Wireless substrate-like sensor

• US 20050224899A1
• Filed: 03/08/2005
• Published: 10/13/2005
• Est. Priority Date: 02/06/2002
• Status: Abandoned Application

• Current Assignee: CyberOptics Semiconductor, Inc. (Nordson Corporation)
• Original Assignee: CyberOptics Semiconductor, Inc. (Nordson Corporation)
• Inventors: Gardner, DelRae H., Ramsey, Craig C., Lassahn, Jeffrey K.
• Application Number:
  US11/075,357
• Publication Number:
  US 20050224899A1
• Time in Patent Office: Days
• US Class Current: 257/414
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards

Abstract

In accordance with an aspect of the present invention, a wireless substrate-like sensor is configured to ensure it does not contaminate a semiconductor processing chamber. The sensor is sealed except for one or more apertures. In one embodiment, a vent is disposed proximate the apertures. In another embodiment, the aperture is coupled to a pressure equalization member that deforms in response to a differential in pressure between the sensor interior and exterior.

Claims

1. A substrate-like sensor for use in semiconductor processing tool, the sensor comprising:

a housing having an electronics compartment the interior of which is sealed except for a vent that allows gas to pass between the interior of the electronics compartment and an exterior; and

sensing electronics disposed within the electronics compartment and being adapted to sense a characteristic of the semiconductor processing tool; and

a filter disposed proximate the vent such that all gas passing through the vent passes through the filter.

2. The sensor of claim 1, wherein the housing is configured to resemble a standard sized wafer.

3. A substrate-like sensor for use in semiconductor processing tool, the sensor comprising:

a housing having an interior, an exterior, and an aperture therebetween;

sensing electronics disposed within the housing and being adapted to sense a characteristic of the semiconductor processing tool; and

a pressure equalization member sealingly coupled to the aperture, the equalization member being configured to deflect in response to a differential pressure between the interior and the exterior.

4. The sensor of claim 3, wherein the equalization member is a bladder.

5. The sensor of claim 3, wherein the equalization member is a balloon.

6. The sensor of claim 3, wherein the equalization member is a bellows.

7. The sensor of claim 3, wherein the equalization member comprises a portion of a wall of the housing.