Wireless substrate-like sensor

• US 20050224902A1
• Filed: 03/08/2005
• Published: 10/13/2005
• Est. Priority Date: 02/06/2002
• Status: Abandoned Application

• Current Assignee: CyberOptics Semiconductor, Inc. (Nordson Corporation)
• Original Assignee: CyberOptics Semiconductor, Inc. (Nordson Corporation)
• Inventors: Gardner, DelRae H., Ramsey, Craig C., Lassahn, Jeffrey K.
• Application Number:
  US11/075,363
• Publication Number:
  US 20050224902A1
• Time in Patent Office: Days
• US Class Current: 257/433
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards

Abstract

In accordance with an aspect of the present invention, a wireless substrate-like sensor is configured to be low-profile. One exemplary low-profile design includes using an image acquisition system on a leadless ceramic carrier chip. Then a circuit board, or rigid interconnect, is provided with a recess to accommodate the image acquisition system. The image acquisition system is disposed within the recess and coupled to the board through the periphery of the leadless ceramic carrier chip.

Claims

1. A low-profile substrate-like sensor for use in semiconductor processing tool, the sensor comprising:

a housing having a support element and sensing electronics disposed thereon; and

wherein the sensing electronics includes a rigid interconnect having a recessed portion, and a sensing element disposed in the recessed portion and being electrically coupled to the sensing electronics.

2. The sensor of claim 1, wherein the sensing element is an image sensor.

3. The sensor of claim 1, wherein the recessed portion is a hole through the rigid interconnect.

4. The sensor of claim 1, wherein the recessed portion is a cutout.

5. The sensor of claim 4, wherein the cutout is U-shaped.

6. The sensor of claim 4, wherein the cutout is rectangular.

7. The sensor of claim 1, wherein the sensing element is carried within a ceramic leadless chip carrier.

8. The sensor of claim 1, wherein the recessed portion comprises a flexible interconnect.

9. A low-profile substrate-like sensor for use in semiconductor processing tool, the sensor comprising:

a housing having a support platform and sensing electronics disposed thereon; and

wherein the sensing electronics includes a circuit having an image acquisition chip disposed thereon and being electrically coupled to the sensing electronics.

10. The sensor of claim 9, wherein the image acquisition chip is coupled to the sensing electronics by flip chip techniques.

11. The sensor of claim 9, wherein the image acquisition chip is coupled to the sensing electronics by die attachment and wire bonding techniques.