Circuit board, device mounting structure, device mounting method, and electronic apparatus

• US 20050224971A1
• Filed: 09/24/2004
• Published: 10/13/2005
• Est. Priority Date: 04/02/2004
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Suehiro, Mitsuo
• Granted Patent: US 7,411,295 B2
• Time in Patent Office: Days
• US Class Current: 257/737
• CPC Class Codes: H01L 2224/10165 Alignment aids
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/81052 Detaching bump connectors, e.g. after testing unsoldering in general B23K1/018
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/8114 Guiding structures outside the body
• CPC Class Codes: H01L 2224/812 Applying energy for connecting
• CPC Class Codes: H01L 2224/81234 using means for applying energy being within the device, e.g. integrated heater
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 24/799 Apparatus for disconnecting
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/98 Methods for disconnecting semiconductor or solid-state bodies
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 1/111 : Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/09236 : Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672
• CPC Class Codes: H05K 2201/09736 : Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 2201/10015 : Non-printed capacitor
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/0195 : Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3494 : Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern.

Claims

1. A circuit board having a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps,

wherein a plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern.

2. The circuit board according to claim 1, wherein the electronic device is a condenser.

3. The circuit board according to claim 1, said circuit board is a printed circuit board that can mount the electronic device both on its front surface and on its back surface.

4. The circuit board according to claim 1, wherein the two-dimensional arrangement is a square arrangement that arranges the bumps at even intervals.

5. The circuit board according to claim 4, wherein the square arrangement is formed by arranging ground terminal lines and positive electric potential terminal lines alternately.

6. The circuit board according to claim 1, wherein the metal pattern has a protrusion that is elongated over a package of the electronic device.

7. The circuit board according to claim 6, wherein the protrusion has a positioning part for positioning the electronic device by contacting a package of the electronic device.

8. The circuit board according to claim 6, wherein the protrusion has a checking part for checking the connection of the electronic device and the material pattern.

9. The circuit board according to claim 6, wherein the protrusion has a heating part for contacting a heating means to melt solders of the plurality of the bumps which connects the metal pattern.

10. A structure for mounting an electronic device that has bumps in two-dimensional arrangement on a circuit board,

wherein a metal pattern being connected with a plurality of the bumps which has even electric potentials is formed on a surface of the circuit pattern,

wherein the plurality of the bumps is electrically connected by the metal pattern on the surface of the circuit pattern.

11. The structure for mounting the device on the circuit board according to claim 10, wherein the electronic device is a condenser.

12. The structure for mounting the device on the circuit board according to claim 10, the circuit board is a printed circuit board that can mount the electronic device both on its front surface and on its back surface.

13. The structure for mounting the device on the circuit board according to claim 10, wherein the arrangement is a square arrangement that arranges the bumps at even intervals.

14. The structure for mounting the device on the circuit board according to claim 10, wherein the arrangement is formed by arranging ground terminal lines and positive electric potential terminal lines alternately.

15. The structure for mounting the device on the circuit board according to claim 10, wherein the metal pattern has a protrusion that is elongated over a package of the electronic device.

16. The structure for mounting the device on the circuit board according to claim 15, wherein the protrusion has a positioning part for positioning the electronic device by contacting a package of the electronic device.

17. The structure for mounting the device on the circuit board according to claim 15, wherein the protrusion has a checking part for checking the connection of the electronic device and the material pattern.

18. The structure for mounting the device on the circuit board according to claim 15, wherein the protrusion has a heating part for contacting a heating means to melt solders of the plurality of the bumps which connect the metal pattern.

19. A method for mounting an electronic device which has bumps in two-dimensional arrangement on a circuit board,

wherein a plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern,

wherein the plurality of the bumps is electrically connected by the metal pattern on the surface of the circuit pattern,

wherein the metal pattern has a protrusion that is elongated over a package of the electronic device, said method comprising the steps of:

positioning the electronic device on the circuit board by contacting a package of the electronic device with a positioning part provided on the protrusion;

heating a heating part provided on the protrusion; and

checking the connection of the electronic device and the material pattern by using a checking part provided on the protrusion.

20. An electronic apparatus comprising a circuit board on which an electronic device is mounted,

said circuit board having a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting the electronic device that has the bumps,

wherein a plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern.