Method to prevent damage to probe card
First Claim
1. A method of forming a probe card for the testing of a semiconductor device comprising:
- disposing a plurality of conductive traces adjacent at least one of the first surface and the second surface of a substrate;
providing a plurality of probe elements in electrical communication with the plurality of conductive traces, a first one of the probe elements for supplying a test signal, and at least a second one of the probe elements for receiving a test signal; and
providing a plurality of fuse elements in respective electrical communication with some of the plurality of conductive traces, at least some of the plurality of fuse elements disposed immediately adjacent the at least one of the first surface and the second surface, at least some of said plurality of fuse elements comprising at least two types of fuses of an active fuse element, a passive fuse element, a self-resetting fuse element, a repairable fuse element, and a replaceable fuse element, each fuse element of the plurality of fuse elements for limiting the current level thereof to one of an absolute maximum current level for the probe card without substantial damage thereto and an absolute current level for use in the testing of a semiconductor device without substantial damage thereto.
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Accused Products
Abstract
Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.
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Citations
20 Claims
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1. A method of forming a probe card for the testing of a semiconductor device comprising:
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disposing a plurality of conductive traces adjacent at least one of the first surface and the second surface of a substrate;
providing a plurality of probe elements in electrical communication with the plurality of conductive traces, a first one of the probe elements for supplying a test signal, and at least a second one of the probe elements for receiving a test signal; and
providing a plurality of fuse elements in respective electrical communication with some of the plurality of conductive traces, at least some of the plurality of fuse elements disposed immediately adjacent the at least one of the first surface and the second surface, at least some of said plurality of fuse elements comprising at least two types of fuses of an active fuse element, a passive fuse element, a self-resetting fuse element, a repairable fuse element, and a replaceable fuse element, each fuse element of the plurality of fuse elements for limiting the current level thereof to one of an absolute maximum current level for the probe card without substantial damage thereto and an absolute current level for use in the testing of a semiconductor device without substantial damage thereto. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A manufacturing process for forming a probe card for use in the testing of a semiconductor device comprising:
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providing a substrate having a first surface, a second surface, and an aperture therethrough;
disposing a plurality of conductive traces adjacent at least one of the first surface and the second surface;
providing a plurality of probe elements in electrical communication with the plurality of conductive traces, at least a first one of the probe elements for supplying a test signal, and at least a second one of the probe elements for receiving a test signal, the plurality of probe elements having a portion thereof located on the first surface of the substrate, having a portion thereof extending through an aperture in the substrate, and having a portion thereof located on the second surface of the substrate; and
providing a plurality of fuse elements in respective electrical communication with at least some of the plurality of conductive traces, at least some of the plurality of fuse elements disposed immediately adjacent the at least one of the first surface and the second surface, at least some of said plurality of fuse elements comprising at least two types of fuses of an active fuse element, a passive fuse element, a self-resetting fuse element, a repairable fuse element, and a replaceable fuse element, each fuse element of the plurality of fuse elements for limiting the current level thereof to one of an absolute maximum current level for the probe card without substantial damage thereto and an absolute current level for use in the testing of a semiconductor device without substantial damage thereto. - View Dependent Claims (10, 11, 12, 13)
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14. A method of using a probe card for the testing of at least one semiconductor die comprising:
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providing a probe card having a plurality of probe elements connected thereto for supplying test signals to the at least one semiconductor die, the probe card including;
a substrate having a first surface, a second surface, and an aperture therethrough;
disposing a plurality of conductive traces adjacent at least one of the first surface and the second surface;
providing a plurality of probe elements in electrical communication with the plurality of conductive traces, at least a first one of the probe elements for supplying a test signal, and at least a second one of the probe elements for receiving a test signal, the plurality of probe elements having a portion thereof located on the first surface of the substrate, having a portion thereof extending through an aperture in the substrate, and having a portion thereof located on the second surface of the substrate; and
providing a plurality of fuse elements in respective electrical communication with at least some of the plurality of conductive traces, at least some of the plurality of fuse elements disposed immediately adjacent the at least one of the first surface and the second surface, at least some of said plurality of fuse elements comprising at least two types of fuses of an active fuse element, a passive fuse element, a self-resetting fuse element, a repairable fuse element, and a replaceable fuse element, each fuse element of the plurality of fuse elements for limiting the current level thereof to one of an absolute maximum current level for the probe card without substantial damage thereto and an absolute current level for use in the testing of a semiconductor device without substantial damage thereto;
providing a fuse in electrical communication with at least some of the probe elements; and
testing the at least one semiconductor die by supplying test signals to the at least one semiconductor die. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification