Surface acoustic wave device and method of adjusting LC component of surface acoustic wave device

• US 20050225410A1
• Filed: 04/13/2004
• Published: 10/13/2005
• Est. Priority Date: 04/16/2003
• Status: Active Grant

• Current Assignee: Intellectual Ventures Holding 81 LLC (Intellectual Ventures LLC)
• Original Assignee: Intellectual Ventures Fund 77 LLC (Intellectual Ventures LLC)
• Inventors: Anasako, Kenichi
• Granted Patent: US 8,416,038 B2
• Time in Patent Office: Days
• US Class Current: 333/193
• CPC Class Codes: H03H 9/0004 Impedance-matching networks H03H9/145 takes precedence
• CPC Class Codes: H03H 9/0296 Surface acoustic wave [SAW] devices having both acoustic and non-acoustic properties
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/52 Electric coupling means
• CPC Class Codes: H03H 9/64 using surface acoustic waves
• CPC Class Codes: H03H 9/6489 Compensation of undesirable effects

Abstract

A surface acoustic wave device comprises a piezoelectric substrate (1), at least one inter-digital transducers (IDT)(2) provided on the piezoelectric substrate, at least one elongated electrode pad (4) electrically connected to the IDT, and at least one stud bump (5) disposed on the electrode pad such that an LC component of the surface acoustic wave device has a predetermined value.

Claims

1. A surface acoustic wave device comprising:

a piezoelectric substrate;

at least one inter-digital transducers (IDT) provided on said piezoelectric substrate;

at least one electrode pad electrically connected to said IDT; and

at least one stud bump disposed on said electrode pad such that an LC component of said surface acoustic wave device has a predetermined value.

2. The surface acoustic wave device according to claim 1, wherein said electrode pad is elongated.

3. The surface acoustic wave device according to claim 1, wherein said electrode pad has a first wiring pattern and a second wiring pattern connected to each other at an end thereof and said stud bump is disposed on said electrode pad such that said first and second wiring patterns are electrically short-circuited.

4. The surface acoustic wave device according to claim 1, wherein said electrode pad has a plurality of wiring patterns, adjacent wiring patterns connected to each other at an end thereof and said stud bump is disposed on said electrode pad such that said adjacent wiring patterns are electrically short-circuited.

5. The surface acoustic wave device according to claim 1, wherein said electrode pad has a first island pattern and a second island pattern and said stud bump is disposed on said electrode pad such that said first and second island patterns are electrically short-circuited.

6. The surface acoustic wave device according to claim 1, which further comprises a base substrate having a wiring pattern corresponding to said electrode pad, wherein said stud bump is electrically connected to said wiring pattern of said base substrate.

7. A method of adjusting an LC component of a surface acoustic wave device having at least one stud bump and at least one electrode pad, said method comprising the steps of:

determining a position at which said stud bump is disposed on said electrode pad such that said LC component of said surface acoustic wave device has a predetermined value; and

disposing said stud bump at said determined position on said electrode pad.

8. The method according to claim 7, wherein said electrode pad is elongated.

9. The method according to claim 7, wherein said electrode pad has a first wiring pattern and a second wiring pattern connected to each other at an end thereof and said first and second wiring patterns are electrically short-circuited by said stud bump disposed at determined position on said electrode pad.

10. The method according to claim 7, wherein said electrode pad has a plurality of wiring patterns, adjacent wiring patterns being connected to each other at an end thereof and said adjacent wiring patterns are electrically short-circuited by said stud bump disposed at determined position on said electrode pad.

11. The method according to claim 7, wherein said electrode pad has a first island pattern and a second island pattern and said first and second island patterns are electrically short-circuited by said stud bump disposed at said determined position on said electrode pad.

12. The method according to claim 7, which further comprises, after said step of disposing said stud bump on said electrode pad, a step of mounting said surface acoustic wave device onto a base substrate having a wiring pattern corresponding to said electrode pad.