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Method and apparatus for automotive radar sensor

  • US 20050225481A1
  • Filed: 04/08/2005
  • Published: 10/13/2005
  • Est. Priority Date: 04/12/2004
  • Status: Abandoned Application
First Claim
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1. A packaging apparatus for integrated circuits comprising:

  • a dielectric substrate comprising a single or plurality of dielectric layers;

    a single or plurality of electrically conductive layers deposed on one or more surfaces of said single or plurality of dielectric layers;

    a single or plurality of integrated circuits attached to a surface of said dielectric substrate;

    a single or plurality of electromagnetic signal radiating ports on a surface of said dielectric substrate; and

    a single or plurality of stress-relieved external interconnect means.

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