Method and apparatus for automotive radar sensor

• US 20050225481A1
• Filed: 04/08/2005
• Published: 10/13/2005
• Est. Priority Date: 04/12/2004
• Status: Abandoned Application

• Current Assignee: GHZ TR Corporation
• Original Assignee: GHZ TR Corporation
• Inventors: Bonthron, Andrew J.
• Application Number:
  US11/102,499
• Publication Number:
  US 20050225481A1
• Time in Patent Office: Days
• US Class Current: 342/175
• CPC Class Codes: G01S 13/08 Systems for measuring distance only indirect measurement G01S13/46
• CPC Class Codes: G01S 13/24 using frequency agility of carrier wave
• CPC Class Codes: G01S 13/282 using a frequency modulated carrier wave G01S13/286 takes precedence
• CPC Class Codes: G01S 13/347 using more than one modulation frequency
• CPC Class Codes: G01S 13/931 of land vehicles
• CPC Class Codes: G01S 7/032 Constructional details for solid-state radar subsystems
• CPC Class Codes: G01S 7/354 Extracting wanted echo-signals Doppler systems G01S13/50
• CPC Class Codes: G01S 7/356 involving particularities of FFT processing
• CPC Class Codes: G01S 7/358 using I/Q processing
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01066 : Dysprosium [Dy]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 : Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/16251 : Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01Q 1/3233 : particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 15/248 : using a reflecting surface, e.g. twist reflector combination with a polarisation filter in dual reflector antennas H01Q19/195
• CPC Class Codes: H01Q 21/0093 : Monolithic arrays
• CPC Class Codes: H01Q 21/08 : the units being spaced along or adjacent to a rectilinear path waveguide fed H01Q21/0037

Abstract

Methods and apparatus are presented which reduce the overall cost and increase the imaging capability for medium and long range automotive radar sensing applications through the combination of a high signal-to-noise ratio and wide dynamic range radar waveform and architecture, antenna arrangement, and a low cost packaging and interconnection method. In accordance with aspects of the present invention, one way a high signal-to-noise ratio and wide dynamic range imaging radar with reduced cost can be achieved is through the combination of a pulsed stepped-frequency-continuous-wave waveform and electrically beam-switched radar architecture, utilizing a planar package containing high-frequency integrated circuits as well as integrated high-frequency waveguide coupling ports, coupled to a multi-beam waveguide-fed twist-reflector narrow beam-width antenna. Other methods and apparatus are presented.

Claims

1. A packaging apparatus for integrated circuits comprising:

a dielectric substrate comprising a single or plurality of dielectric layers;

a single or plurality of electrically conductive layers deposed on one or more surfaces of said single or plurality of dielectric layers;

a single or plurality of integrated circuits attached to a surface of said dielectric substrate;

a single or plurality of electromagnetic signal radiating ports on a surface of said dielectric substrate; and

a single or plurality of stress-relieved external interconnect means.

2. The apparatus of claim 1, wherein said single or plurality of integrated circuits is attached to the same side of said dielectric substrate as said electromagnetic signal radiating ports.

3. The apparatus of claim 1, wherein said single or plurality of integrated circuits is attached to the opposite side of said dielectric substrate as said electromagnetic signal radiating ports.

4. The apparatus of claim 1, wherein said electromagnetic signal radiating ports are comprised of electromagnetic signal coupling ports to external waveguide structures.

5. The apparatus of claim 4, wherein said electromagnetic signal coupling ports contain a microstrip patch radiating structure.

6. The apparatus of claim 4, wherein said external waveguide structures are metallic rectangular waveguide structures.

7. The apparatus of claim 1, wherein said electromagnetic signal radiating ports are comprised of antenna structures.

8. The apparatus of claim 7, wherein said antenna structures are comprised of microstrip patch radiating structures.

9. The apparatus of claim 1, additionally comprising one or a plurality of electrically conductive covers surrounding said single or plurality of integrated circuits attached to a surface of said dielectric substrate.

10. The apparatus of claim 9, wherein said electrically conductive covers are additionally thermally conductive.

11. The apparatus of claim 10, wherein said covers are bonded to the surface of an integrated circuit.

12. The apparatus of claim 1, additionally comprising one or a plurality of brazed or soldered pins on a surface of said substrate.

13. The apparatus of claim 1, additionally comprising one or a plurality of brazed or soldered leads on a surface of said substrate.

14. The apparatus of claim 1, additionally comprising one or a plurality of wire-bondable pads on a surface of said substrate.

15. The apparatus of claim 1, additionally comprising one or a plurality of solderable pads on a surface of said substrate.

16. The apparatus of claim 1, wherein one or more of said dielectric layers are comprised of alumina.

17. The apparatus of claim 1, wherein one or more of said dielectric layers are comprised of LTCC.

18. The apparatus of claim 1, wherein one or more of said dielectric layers are comprised of HTCC.

19. The apparatus of claim 1, wherein said single or plurality of integrated circuits are attached to the substrate utilizing flip-chip attachment.

20. The apparatus of claim 19, wherein said flip-chip attachment utilizes gold thermo-compression bump bonding.

21. The apparatus of claim 1, wherein said single or plurality of integrated circuits are attached to the substrate utilizing wire-bonding attachment.

22. The apparatus of claim 1, additionally comprising one or a plurality of vias for the connection of signals through one or a plurality if said dielectric layers.

23. The apparatus of claim 19, wherein one or more signals from said single or plurality of integrated circuits are connected directly to a controlled impedance inner layer structure with ground shielding metallization deposed on the same surface of the substrate as said single or plurality of integrated circuits are attached.

24. A method for the packaging of integrated circuits, comprising:

attaching one or a plurality of integrated circuits to a substrate;

electromagnetically radiating one or a plurality of signals from said substrate in a direction normal to a surface of said substrate; and

connecting one or a plurality of signals from said substrate to an external circuit using a stress-relieved external interconnect means.

25. The method of claim 24, additionally comprising attaching of one or a plurality of electrically conducting covers surrounding one or a plurality of said integrated circuits.

26. A packaging apparatus for integrated circuits comprising:

a high-frequency die to substrate interconnect means;

a high-frequency package substrate means;

a mechanically stress-relieved package substrate external interconnect means; and

an integrated signal radiating means.

27. The apparatus of claim 26, additionally comprising a package cover means.

28. The apparatus of claim 26, wherein said integrated signal radiating means is comprised of one or a plurality of planar antennas.

29. A packaging apparatus for integrated circuits comprising:

a high-frequency die to substrate interconnect means;

a high-frequency package substrate means;

a mechanically stress-relieved package substrate external interconnect means; and

an integrated electro-magnetic signal coupling means.

30. The apparatus of claim 29, additionally comprising a package cover means.