Apparatus and method for the determination of positioning coordinates for semiconductor substrates

• US 20050225642A1
• Filed: 03/18/2005
• Published: 10/13/2005
• Est. Priority Date: 04/10/2004
• Status: Abandoned Application

• Current Assignee: Leica Microsystems Semiconductor GmbH
• Original Assignee: Leica Microsystems Semiconductor GmbH
• Inventors: Spill, Burkhard
• Application Number:
  US11/083,718
• Publication Number:
  US 20050225642A1
• Time in Patent Office: Days
• US Class Current: 348/207.990
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G03F 9/7088 Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Abstract

An apparatus (2) and a method for the determination of positioning coordinates for at least one semiconductor substrate (6) are disclosed. A digital camera (11) for acquiring an image of the surface (4) of the semiconductor substrate (6) is provided. A computer system is provided, having a display (41) on which the image of the surface (4) of the semiconductor substrate (6) is presentable. By way of an input means (44), a user can mark at least one site (34) of interest on the surface (4) of the semiconductor substrate (6). A measuring machine (24) then automatically travels to the at least one defined site (34) and carries out the desired measurement or examination.

Claims

1. An apparatus for the determination of positioning coordinates for at least one semiconductor substrate comprises:

an acquisition means for digital images of the surface of the semiconductor substrate;

a computer system with a display on which the image of the surface of the semiconductor substrate is presented;

an input means with which a user marks at least one site of interest on the surface of the semiconductor substrate as shown on the display; and

a stage, displaceable in a X direction and a Y direction, that carries the semiconductor substrate and positions the semiconductor substrate with respect to a measuring machine in the at least one marked site.

2. The apparatus as defined in claim 1, wherein the acquisition means is a digital camera having a CCD chip a digital video camera.

3. The apparatus as defined in claim 1, wherein a prealigner is provided that aligns the semiconductor substrate with respect to a coordinate system associated with the apparatus.

4. The apparatus as defined in claim 1, wherein the digital camera 11 possesses a resolution of 3 million pixels;

and each acquired image has a file size of approximately 9.3 MB per image in the .bmp format.

5. The apparatus as defined in claim 1, wherein the semiconductor substrate is a patterned wafer, or a wafer having at least one applied layer.

6. The apparatus as defined in claim 1, wherein the apparatus is incorporated into a measurement system for the semiconductor industry.

7. The apparatus as defined in claim 1, wherein the apparatus is integrated into a device for layer thickness measurement.

8. The apparatus as defined in claim 1, wherein the apparatus is a standalone variant that, in a semiconductor fabrication system, distributes the wafer coordinates of sites that are to be examined more closely, as an ASCII file, to other measuring systems.

14. The method as defined in claim 1, wherein a “

Low Mag”

or “

High-Mag”

presentation of the at least one defined site is selected by the user on the display.

15. The method as defined in claim 14, wherein at “

Low Mag,”

the surface of the wafer having the patterned elements is imaged over an area of 1 mm to 1.3 mm.

16. The method as defined in claim 14, wherein with the switchover to “

High Mag,”

the site on the surface of the wafer at which the measurement is to be carried out is positioned more accurately; and

its coordinates are then stored.

9. A method for the determination of position coordinates for at least one semiconductor substrate using a digital camera, comprising the steps of:

aligning the semiconductor substrate in order to obtain a correlation between the coordinates of the semiconductor substrate and of a measuring machine;

acquiring an image of the entire surface of the semiconductor substrate,

presenting the image of the surface of the semiconductor substrate on a display;

marking by the user, via an input means, at least one site on the surface of the semiconductor substrate; and

transferring a displaceable stage of a measuring machine and thereby positioning of the measuring machine at the at least one marked site on the surface of the semiconductor substrate;

whereby the stage is moved successively to the at least one marked site in order to carry out the specific measurement there.

10. The method as defined in claim 9, wherein the acquisition of an image of the entire surface of the semiconductor substrate is carried out using a digital camera or a digital video camera.

11. The method as defined in claim 9, wherein with the input means, a cursor is positioned at the at least one site selected by the user on the surface of the semiconductor substrate.

12. The method as defined in claim 9, wherein in the context of the examination of multiple identical semiconductor substrates of a stack, for one of those semiconductor substrates the sites on the semiconductor substrate are selected by the user and the respectively associated coordinates are ascertained;

and those ascertained coordinates are applied for all semiconductor substrates of the stack.

13. The method as defined in claim 9, wherein the semiconductor substrate is a wafer that is provided with at least one layer on the surface, or wherein the wafer having multiple patterned elements, the wafer being provided with at least one layer on the surface, or the wafer that is provided with at least one patterned element on the surface.

18. The method as defined in claim 9, wherein the method is integrated into a standalone apparatus;

and in a semiconductor fabrication system, the coordinates of the defined sites on the surface of semiconductor substrates that are to be examined more closely are transmitted as an ASCII file to other measurement systems.

17. The method as defined in claim 27, wherein at “

High Mag,”

the surface of the wafer (32) of the semiconductor substrate is imaged over an area of 0.24 mm×

0.32 mm.