Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
First Claim
1. A process of manufacturing a multilayer circuit board in which at least one insulating layer and at least one wiring layer are laminated, the process comprising the steps of:
- forming a wiring on the wiring layer in a composite member comprising the wiring layer and the insulating layer integrally formed on the wiring layer, the wiring layer comprising a second metal layer formed on one or both sides of a first metal layer, wherein the second metal layer has a larger coefficient of thermal expansion than the first metal layer;
forming a blind via-hole in the insulating layer such that a bottom portion of the via-hole is formed by a surface of the second metal layer;
forming a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole in such a manner as to be in contact with the second metal layer surface that forms the blind via-hole bottom portion.
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Accused Products
Abstract
A multilayer circuit board including a laminate of at least one insulating layer and at least one wiring layer. The wiring layer is formed by a composite member having a first metal layer and a second metal layer formed on one or both sides of the first metal layer. The first metal layer having a smaller coefficient of thermal expansion than the second metal layer. The second metal layer having a higher electric conductivity than the first metal layer. The insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer. A layer-to-layer interconnection portion is provided on the surface of the insulating layer and in the blind via-hole and is formed in the blind via-hole to be in contact with the surface of the second metal layer.
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Citations
4 Claims
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1. A process of manufacturing a multilayer circuit board in which at least one insulating layer and at least one wiring layer are laminated, the process comprising the steps of:
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forming a wiring on the wiring layer in a composite member comprising the wiring layer and the insulating layer integrally formed on the wiring layer, the wiring layer comprising a second metal layer formed on one or both sides of a first metal layer, wherein the second metal layer has a larger coefficient of thermal expansion than the first metal layer;
forming a blind via-hole in the insulating layer such that a bottom portion of the via-hole is formed by a surface of the second metal layer;
forming a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole in such a manner as to be in contact with the second metal layer surface that forms the blind via-hole bottom portion.
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2. A process of manufacturing a multilayer circuit board comprising an insulating layer in which at least one wiring layer is formed, the process comprising the steps of:
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forming a wiring on the wiring layer in a composite member comprising the wiring layer and the insulating layer integrally formed on the wiring layer, the wiring layer comprising a second metal layer formed on one or both sides of a first metal layer, wherein the second metal layer has a larger coefficient of thermal expansion than the first metal layer;
forming a blind via-hole in each insulating layer on the opposite surfaces between which the wiring layer is inserted, the blind via-hole having a bottom portion formed by a surface of the second metal substrate; and
forming a layer-to-layer interconnection portion on the surface of the insulating layers and in each blind via-hole in such a manner as to be in contact with the second metal layer surface forming the blind via-hole bottom portion.
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3. A process of manufacturing a multilayer circuit board comprising the steps of:
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preparing a wiring layer formed by a composite member comprising a first metal layer and a second metal layer formed on one or both sides of the first metal layer, the second metal layer having a higher electric conductivity and a greater coefficient of thermal expansion than the first metal layer;
forming a substrate for multilayer circuitry by laminating the wiring layer on one or both sides of an insulating resin layer;
forming a predetermined wiring on the wiring layer;
covering the wiring formed in the wiring forming step with an insulating layer;
forming a blind via-hole in the insulating layer, or the insulating layer and insulating resin layer, the blind via-hole having a bottom portion formed by a surface of the second metal layer; and
forming a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole in such a manner as to be in contact with the second metal layer surface in the blind via-hole.
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4. A process of manufacturing a multilayer circuit board comprising the steps of:
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preparing a wiring layer formed by a composite member comprising a first metal layer and a second metal layer formed on both sides of the first metal layer, the second metal layer having a higher electric conductivity and a greater coefficient of thermal expansion than the first metal layer;
forming a substrate for multilayer circuitry by laminating the wiring layer on both sides of an insulating layer;
forming a predetermined wiring on the wiring layer formed in the wiring preparing step;
covering the wiring formed in the wiring forming step with an insulating layer;
forming a blind via-hole in each insulating layer, or the insulating layer and insulating resin layer on the opposite surfaces between which the insulating layer is inserted, the blind via-hole having a bottom portion formed by a surface of the second metal layer; and
forming a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole in such a manner as to be in contact with the surface of the second metal layer in each blind via-hole.
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Specification