Alignment of an optic or electronic component

• US 20050226565A1
• Filed: 06/23/2003
• Published: 10/13/2005
• Est. Priority Date: 06/24/2002
• Status: Active Grant

• Current Assignee: Vivo Mobile Communication Co., Ltd. (Vivo Communication Technology Co. Ltd.)
• Original Assignee: Nokia Corporation
• Inventors: Kopola, Harri, Kautio, Kari
• Granted Patent: US 7,223,022 B2
• Time in Patent Office: Days
• US Class Current: 385/52
• CPC Class Codes: G02B 6/3835 using discs, bushings or the like
• CPC Class Codes: G02B 6/3861 Adhesive bonding adhesives in general C09J
• CPC Class Codes: G02B 6/4202 for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment

Abstract

A method and an arrangement for aligning at least one optic and/or electronic component on a substrate or a corresponding support structure, wherein the method includes: arranging a hole in the support structure; arranging at least three stud bumps on the surface of the component; and arranging said stud bumps along the periphery of the hole for alignment of the component to the hole.

Claims

1. A method for aligning at least one optic and/or electronic component on a substrate or a corresponding support structure, characterised in that the method comprises:

arranging a hole in the support structure;

arranging at least three stud bumps on the surface of the component; and

arranging said stud bumps along the periphery of the hole for alignment of the component to the hole.

2. A method according to claim 1, characterised in that aligning the component is performed by arranging the outer surfaces of the stud bumps against the hole walls.

3. A method for aligning at least one optic fibre and an optoelectronic component to each other according to claim 1, wherein the component is mounted on a supporting structure and the optic fibre is connected to the optoelectronic component,

characterised in that the method comprises:

threading the optic fibre through the hole, and

aligning the optic fibre and the component with each other by means of the stud bumps.

4. A method according to claim 1;

characterised in that aligning the fibre is performed by arranging the fibre against the inner surfaces of the stud bumps.

5. A method according to claim 1, characterised in that the stud bumps have at least partly a conical and/or rounded surfaces, and that aligning the optic fibre with the component is performed by adapting the optic fibre along sloping conical inner surfaces and a horizontal brim in the stud bumps.

6. A method according to claim 1, characterised in that the component is a surface emitting optoelectronic component, that the optic fibre is arranged perpendicular to the support structure, and that the fibre is connected to a radiating source on the metallized surface of the component facing the substrate.

7. A method according to claim 1, characterised in that a conductive adhesive is used on the stud bump outer surfaces to accomplish an electrical connection to the support structure.

8. A method according to claim 1, characterised in that a direct bonding method is used to connect the stud bumps to the support structure.

9. A method according to claim 1, characterised in that the stud bumps are of a solder material, and that a solder connection is used to connect the stud bumps to the support structure.

10. An arrangement for aligning at least one optic and/or electronic component on a substrate or a corresponding support structure, characterised in that the arrangement comprises:

a hole in the support structure;

at least three stud bumps arranged on the surface of the component along the periphery of the hole, for aligning the component centered to the hole.

11. A arrangement according to claim 10, characterised in that the stud bumps have at least partly a conical and/or rounded surfaces, and that an optic fibre is aligned with the component by adapting the optic fibre along sloping conical inner surfaces and against a horizontal brim in the stud bumps.

12. An arrangement according to claim 10, characterised in that the component is a surface emitting optoelectronic component, that the optic fibre is arranged perpendicular to the substrate, and that the fibre is connected to a radiating source on the metallized surface of the component facing the substrate.

13. An arrangement according to claim 10, characterised in that a conductive adhesive is used on the stud bump outer surfaces to accomplish an electrical connection to the substrate.

14. An arrangement according to claim 10, characterised in that direct bonding is used to connect the stud bumps to the substrate.

15. An arrangement according to claim 10, characterised in that the stud bumps are of a solder material, and that a solder connection is used to connect the stud bumps to the substrate.

16. An arrangement according to claim 10, characterised in that the substrate consists of at least two layers, and that the diameter of the hole portion(s) in the layer(s) near the component is bigger having place for both the stud bumps and the optic fibre than in other opening portion(s) having a diameter essentially corresponding the diameter of the optic fibre.