Sealing porous dielectric materials
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Abstract
Method and structure for minimizing the downsides associated with microelectronic device processing adjacent porous dielectric materials are disclosed. In particular, chemical protocols are disclosed wherein porous dielectric materials may be sealed by attaching coupling agents to the surfaces of pores. The coupling agents may form all or part of caps on reactive groups in the dielectric surface or may crosslink to seal pores in the dielectric.
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Citations
25 Claims
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1-17. -17. (canceled)
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18. A device comprising:
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a substrate layer;
a porous dielectric layer adjacent the substrate layer with a an exposed pore having an opening; and
a barrier across the opening of the exposed pore. - View Dependent Claims (19, 20, 21, 22, 23, 24)
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25-31. -31. (canceled)
Specification