Thin-film deposition apparatus
First Claim
1. A gas-feeding apparatus configured to be connected to an evacuatable reaction chamber provided with a support for placing a substrate thereon, comprising:
- a gas-distribution head for introducing gases into the chamber through a head surface, comprising a first section for discharging a gas through the head surface toward the support and a second section for discharging a gas through the head surface toward the support, said first and said second sections being isolated from each other in the gas-distribution head, at least one of which section is coupled to an exhaust system for purging therefrom a gas present in the corresponding section without passing through the head surface.
1 Assignment
0 Petitions
Accused Products
Abstract
A gas-feeding apparatus configured to be connected to an evacuatable reaction chamber includes a gas-distribution head for introducing gases into the chamber through a head surface. The gas-feeding head includes a first section for discharging a gas through the head surface toward a susceptor and a second section for discharging a gas through the head surface toward the susceptor. The first and the second sections are isolated from each other in the gas-distribution head, at least one of which section is coupled to an exhaust system for purging therefrom a gas present in the corresponding section without passing through the head surface.
-
Citations
40 Claims
-
1. A gas-feeding apparatus configured to be connected to an evacuatable reaction chamber provided with a support for placing a substrate thereon, comprising:
a gas-distribution head for introducing gases into the chamber through a head surface, comprising a first section for discharging a gas through the head surface toward the support and a second section for discharging a gas through the head surface toward the support, said first and said second sections being isolated from each other in the gas-distribution head, at least one of which section is coupled to an exhaust system for purging therefrom a gas present in the corresponding section without passing through the head surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
21. A method for forming a thin film on a substrate comprising:
-
(i) placing a substrate in an interior of a reaction chamber;
(ii) introducing a first gas into the interior of the reaction chamber via a first path of a showerhead through a showerhead surface, wherein the first gas is introduced from an upstream side of the showerhead surface, and the interior of the reaction chamber is on a downstream side of the showerhead surface;
(iii) purging the first path of the showerhead with a purge gas while evacuating the first path from the upstream side of the showerhead surface; and
(iv) introducing a second gas into the interior of the reaction chamber via a second path of the showerhead through the showerhead surface, wherein the first path and the second path are isolated from each other in the showerhead, thereby reacting the first gas and the second gas and depositing a film on the substrate. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29)
-
-
30. A gas-feeding apparatus adapted to be connected to an evacuatable reaction chamber for atomic layer growth processing, comprising:
-
a distribution plate;
a first plate having first bores through which a first gas passes, wherein a first section is formed between the distribution plate and the first plate, wherein the first gas is introduced into the first section and passes through the first bores; and
a second plate having second bores through which a second gas passes, wherein a second section is formed between the first plate and the second plate, wherein the second gas is introduced into the second section and passes through the second bores, said second plate having third bores through which the first gas passes, wherein the second section is provided with connectors which connect the respective first bores and the respective third bores in the second section without being communicated with the second bores, wherein at least one of the first section or the second section is coupled to an exhaust system which discharges the gas in the corresponding section without passing through the corresponding bores. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
-
Specification