Semiconductor device, magnetic sensor, and magnetic sensor unit
First Claim
Patent Images
1. A semiconductor device, comprising:
- a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
an electrode portion, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portion; and
, an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portion, in a state which exposes, at least, said electrode portion on the surface side of said semiconductor chip;
and wherein said electrode portion is placed in a position which does not overlap with said sensor element in the thickness direction of said semiconductor chip.
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Abstract
A semiconductor device, comprising a semiconductor chip; a pad electrode; an electrode portion; a wiring portion. An insulating portion is formed from electrically insulating material, covering the surface of the semiconductor chip and sealing the sensor element, wiring portion and electrode portion, in a state which exposes at least the electrode portion on the surface of the semiconductor chip. The electrode portion is placed in a position which does not overlap with the sensor element in the thickness direction of the semiconductor chip.
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Citations
16 Claims
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1. A semiconductor device, comprising:
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a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
an electrode portion, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portion; and
,an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portion, in a state which exposes, at least, said electrode portion on the surface side of said semiconductor chip;
and wherein said electrode portion is placed in a position which does not overlap with said sensor element in the thickness direction of said semiconductor chip. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device, comprising:
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a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
a plurality of electrode portions, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portions; and
,an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portions, in a state which exposes, at least, said electrode portions on the surface side of said semiconductor chip;
and wherein said electrode portions comprise protruding portions which protrude from said insulating portion in the thickness direction of said semiconductor chip; and
,one protruding portion placed adjacently to said sensor element has a smaller protrusion length from said insulating portion compared with other protruding portions placed at a distance from said sensor element.
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7. A semiconductor device, comprising:
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a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
a plurality of electrode portions, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portions; and
,an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portions, in a state which exposes, at least, said electrode portions on the surface side of said semiconductor chip;
and wherein said electrode portions comprise protruding portions which protrude from said insulating portion in the thickness direction of said semiconductor chip; and
,one protruding portion placed adjacently to said sensor element is formed from conductive material with a lower melting point compared with other protruding portions placed at a distance from said sensor element.
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8. A semiconductor device, comprising:
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a semiconductor chip, on the surface of which are formed integrated circuitry and a sensor element, electrically connected thereto;
a pad electrode, formed on the surface side of said semiconductor chip, and electrically connected to at least said integrated circuitry;
a plurality of electrode portions, positioned on the surface side of said semiconductor chip, and electrically connecting said semiconductor chip to external circuitry;
a wiring portion, electrically connecting said pad electrode to said electrode portions; and
,an insulating portion, formed from electrically insulating material, which covers the surface of said semiconductor chip and seals said sensor element, wiring portion, and electrode portions, in a state which exposes, at least, said electrode portions on the surface side of said semiconductor chip;
and wherein said electrode portions comprise protruding portions which protrude from said insulating portion in the thickness direction of said semiconductor chip;
said protruding portions comprise a substantially spherical core formed from a conductive material and a shell portion, covering the periphery of the core, and formed from a conductive material with a melting point lower than the melting point of said conductive material; and
,the core of one protruding portion placed adjacent to said sensor element is formed to be smaller than the cores of other protruding portions placed at a distance from said sensor element, and moreover diameters of the shell portions of said one protruding portion and of said other protruding portions are substantially equal.
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9. A magnetic sensor, comprising a magnetic sensor chip, formed substantially into a sheet shape, which is sensitive to the magnetic component in at least one direction of a magnetic field, and a plurality of electrode portions, protruding from the surface of said magnetic sensor chip, which electrically connect said magnetic sensor chip to a substantially sheet-shaped circuit board, wherein
the electrode portions are arranged in a row on the surface of said magnetic sensor chip.
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10. A magnetic sensor, comprising a magnetic sensor chip, formed substantially into a sheet shape, which is sensitive to the magnetic component in at least one direction of a magnetic field, and a plurality of electrode portions, protruding from the surface of said magnetic sensor chip, which electrically connect said magnetic sensor chip to a substantially sheet-shaped circuit board, wherein
the electrode portions are arranged in a plurality of parallel rows on the surface of said magnetic sensor chip; - and,
the protrusion lengths of said electrode portions decrease gradually in the direction of arrangement of said plurality of rows. - View Dependent Claims (15, 16)
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13. A magnetic sensor unit, comprising a first magnetic sensor which is sensitive to the magnetic components of a magnetic field in two directions, a second magnetic sensor which is sensitive to the magnetic component of a magnetic field in at least one direction, and a substantially sheet-shaped circuit board on the surface of which the two magnetic sensors are mounted, wherein
each of the magnetic sensors comprises a magnetic sensor chip formed in substantially a sheet shape, and a plurality of electrode portions, protruding from the surface of the magnetic sensor chip, which are brought into contact with the surface of said circuit board and are electrically connected to said circuit board; - and,
at least one of the magnetic sensor chips is caused to be inclined with respect to the rear surface of said circuit board, such that the direction of sensitivity of said second magnetic sensor intersects the plane comprising the two directions of sensitivity of said first magnetic sensor, and moreover the sum of the height dimensions, in the thickness direction of said circuit board, of said circuit board and of said electrode portions, is changed in portions. - View Dependent Claims (14)
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Specification