Liquid loop with multiple heat exchangers for efficient space utilization

• US 20050231910A1
• Filed: 04/19/2004
• Published: 10/20/2005
• Est. Priority Date: 04/19/2004
• Status: Active Grant

• Current Assignee: Hewlett Packard Enterprise Development LP (Hewlett-Packard Enterprise Company)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Simon, Glenn C., Malone, Christopher G.
• Granted Patent: US 7,280,358 B2
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H05K 7/20727 within server blades for removing heat from heat source
• CPC Class Codes: H05K 7/20772 within server blades for removing heat from heat source

Abstract

A liquid loop cooling system, a tubing encloses an interior lumen within which a cooling fluid can circulate. A plurality of heat exchangers is coupled to the tubing and is configured within in a constrained space in conformance to space availability.

Claims

1. A liquid loop cooling system for usage in a highly compact electronic system chassis comprising:

a tubing enclosing an interior bore or lumen within which a cooling fluid can circulate; and

a plurality of heat exchangers coupled to the tubing and distributed in a constrained space within the chassis in conformance to space availability.

2. The cooling system according to claim 1 further comprising:

a plurality of heat exchangers with different shapes and/or sizes selected to conform to localized spatial voids within the chassis.

3. The cooling system according to claim 1 further comprising:

a plurality of bends and/or angles formed into the tubing and positioning the plurality of heat exchangers in conformance with localized spatial voids within the chassis.

4. A liquid loop cooling system comprising:

a tubing enclosing an interior lumen within which a cooling fluid can circulate; and

a plurality of heat exchangers coupled to the tubing, ones of the plurality of heat exchangers comprising;

a tube segment enclosing a segment interior lumen that passes the cooling fluid and extending from a first end to a second end;

a plurality of fins coupled to the tube segment; and

first and second connectors coupled respectively to the first and second ends and capable of coupling the heat exchanger to the tubing.

5. The cooling system according to claim 4 further comprising:

a plurality of heat exchangers with different shapes and/or sizes configured to conform to localized spatial voids within the chassis.

6. The cooling system according to claim 4 further comprising:

a plurality of angles formed into the tubing and positioning the plurality of heat exchangers in conformance with localized spatial voids within the chassis.

7. The cooling system according to claim 4 further comprising:

a pump coupled to the tubing and capable of pumping the cooling fluid through the tubing.

8. The cooling system according to claim 4 further comprising:

the cooling fluid contained within the tubing and the tube segments of the plurality of heat exchangers.

9. The cooling system according to claim 4 further comprising:

at least one fan configured to drive air through the heat exchangers.

10. The cooling system according to claim 4 further comprising:

at least one cold plate coupled to the tubing.

11. The cooling system according to claim 4 wherein ones of the plurality of heat exchangers further comprise:

a tube segment having a longitudinal axis and a circular cross-section; and

a stack of closely-spaced plates distributed along the longitudinal axis forming the fins coupled to the tube segment.

12. An electronic system comprising:

a chassis including airflow inlet and outlet vents, and fans capable of circulating air from the inlet vents to the outlet vents;

a plurality of components mounted within the chassis including at least one processor and at least one storage device;

a tubing enclosing an interior lumen within which a cooling fluid can circulate; and

a plurality of heat exchangers coupled to the tubing, ones of the plurality of heat exchangers comprising;

a tube segment enclosing a segment interior lumen that passes the cooling fluid and extending from a first end to a second end;

a plurality of fins coupled to the tube segment; and

first and second connectors coupled respectively to the first and second ends and capable of coupling the heat exchanger to the tubing.

13. The system according to claim 12 further comprising:

a plurality of heat exchangers with different shapes and/or configured to conform to space available in the chassis.

14. The system according to claim 12 further comprising:

a plurality of angles and/or bends formed into the tubing and positioning the plurality of heat exchangers in conformance with space available in the chassis.

15. The system according to claim 12 further comprising:

a pump coupled to the tubing and capable of pumping the cooling fluid through the tubing.

16. The system according to claim 12 further comprising:

at least one cold plate coupled to the plurality of heat exchangers.

17. The system according to claim 12 further comprising:

at least one fan configured to drive air through the heat exchangers in cooperation with the plurality of heat exchangers.

18. The system according to claim 12 wherein ones of the plurality of heat exchangers further comprise:

a tube segment having a longitudinal axis and a circular cross-section; and

a stack of closely-spaced plates arranged substantially perpendicular to the longitudinal axis forming the fins coupled to the tube segment.

19. The system according to claim 12 wherein:

the chassis is a compact form factor chassis.

20. A method of configuring a liquid loop cooling system in an electronic system comprising:

determining space availability within a chassis containing components of the computer server;

arranging sizes and shapes of a plurality of heat exchangers to fit into the available space; and

connecting the plurality of heat exchangers with a tubing configured to position the heat exchangers in the available space arrangement.

21. The method according to claim 20 further comprising:

determining heat distribution within a chassis containing components of the computer server; and

arranging sizes and shapes of a plurality of heat exchangers based on heat distribution and the available space in combination; and

connecting the plurality of heat exchangers with a tubing configured to position the heat exchangers according to the heat distribution and available space arrangement.

22. The method according to claim 20 further comprising:

arranging sizes and shapes of at least one fan based on the heat exchanger arrangement.

23. The method according to claim 22 further comprising:

positioning at least one fan to drive air through the plurality of heat exchangers.