Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein

• US 20050233122A1
• Filed: 04/18/2005
• Published: 10/20/2005
• Est. Priority Date: 04/19/2004
• Status: Abandoned Application

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Mori, Toshihiko, Nishimura, Mikio, Kitagawa, Motoyoshi, Harada, Shinji, Honjou, Kazuhiko, Kimura, Junichi, Nishii, Toshihiro
• Application Number:
  US11/107,852
• Publication Number:
  US 20050233122A1
• Time in Patent Office: Days
• US Class Current: 428/209
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: H05K 1/186 manufactured by mounting on or connecting to patterned circuits before or during embedding
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.

Claims

1. A manufacturing method of laminated substrate comprising a step of preparing a substrate, a step of preparing electronic components, a step of mounting electronic components on a conductive area formed on a principal plane of the substrate, a step of preparing a sheet impregnated with a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range higher than first temperature range, and is cured in third temperature range higher than second temperature range, a step of preparing a perforated sheet having holes formed in a sheet for forming a space around electronic components when sheet is laminated on electronic components, a step of laminating the perforated sheet on electronic components, a first heating step of heating the perforated sheet to second temperature range and softening the thermosetting resin, a resin flowing step of compressing the perforated sheet from second temperature range to third temperature range, and flowing the thermosetting resin to fill in the space surrounding the electronic components, and a second heating step of heating the perforated sheet to third temperature range and curing the thermosetting resin.

2. The manufacturing method of laminated substrate of claim 1, wherein the sheet is a plate form consisting of woven cloth or nonwoven cloth, and resin impregnated in this woven cloth or nonwoven cloth, and a space is provided around electronic components mounted on the sheet.

3. The manufacturing method of laminated substrate of claim 1, wherein the resin flowing step is characterized by compressing the sheet and substrate to cause the thermosetting resin impregnated in the sheet to flow into the space, and the sheet heating temperature is lower than its minimum viscosity point temperature.

4. The manufacturing method of laminated substrate of claim 1, wherein the sheet temperature in resin flowing step is at least lower than the temperature of sheet minimum viscosity in consideration of temperature increment of resin generated by flow of resin into the space.

5. The manufacturing method of laminated substrate of claim 1, wherein the resin temperature when the resin flows into the space in resin flowing step is set at temperature lower than the minimum viscosity point temperature of resin.

6. The manufacturing method of laminated substrate of claim 1, wherein the sheet temperature in forced flowing is temperature not allowing fusing of connection and fixing member.

7. The manufacturing method of laminated substrate of claim 1, wherein the sheet temperature in forced flowing is set at least lower than the melting point temperature of connection and fixing member in consideration of temperature increment of resin by flow into the space.

8. The manufacturing method of laminated substrate of claim 1, wherein the temperature of the resin flowing into the space in forced flowing is set lower than the melting point temperature of the connection and fixing member.

9. The manufacturing method of laminated substrate of claim 1, wherein the speed of the resin flowing into the space in forced flowing is set smaller so as not to raise the viscosity of the resin in consideration of temperature increment by frictional heat generated between the resin and electronic components or the resin and substrate.

10. The manufacturing method of laminated substrate of claim 1, wherein the speed of the resin flowing into the space in forced flowing is set so that the temperature of the resin may not exceed the melting point of connection and fixing member in consideration of temperature increment by frictional heat generated between the resin and electronic components or substrate.

11. The manufacturing method of laminated substrate of claim 1, wherein the sheet temperature in second heating step is set lower than the melting point temperature of connection and fixing member.

12. The manufacturing method of laminated substrate of claim 11, wherein the second heating step is followed by a third heating step of heating to a temperature higher than the melting point of connection and fixing member, and the third heating step is to heat the temperature of the sheet over the melting point of the connection and fixing member after the sheet loses the fluidity.

13. The manufacturing method of laminated substrate of claim 1, wherein forced flowing is to force the resin to flow into the space, and to decrease the viscosity of the resin by heat generation caused by flow of resin into the space.

14. The manufacturing method of laminated substrate of claim 1, wherein the sheet is, in first heating step, compressed at least by a first pressure of contact between heating means for supplying heat to the sheet and the sheet.

15. The manufacturing method of laminated substrate of claim 14, wherein the sheet compressing speed in forced flowing is set larger than the sheet compressing speed in the first heating step.

16. The manufacturing method of laminated substrate of claim 14, wherein a resin fluidity suppressing step intervenes between first heating step and forced flowing step, and this resin fluidity suppressing step is to heat the sheet and to compress the sheet by a second pressure smaller than the first pressure.

17. The manufacturing method of laminated substrate of claim 1, wherein a compression pressure lessening step intervenes between the forced flowing and second heating step, and this compression pressure lessening step is to change from the first pressure supplied in forced flowing to a second pressure smaller than the first pressure.

18. The manufacturing method of laminated substrate of claim 17, wherein the second pressure is set smaller than the pressure when the resin fluidity losing temperature is nearly equal to the melting point temperature of connection and fixing member.

19. The manufacturing method of laminated substrate of claim 1, wherein a resin fluidity suppressing step intervenes between first heating step and forced flowing step, and this resin fluidity suppressing step is to heat the sheet and to compress the sheet by a pressure not to fluidize the resin impregnated in the sheet.

20. The manufacturing method of laminated substrate of claim 1, wherein a resin fluidity suppressing step intervenes between first heating step and forced flowing step, and this resin fluidity suppressing step is to heat the sheet and to compress the sheet by a pressure not to force the resin impregnated in the sheet to flow outside of the substrate.

21. The manufacturing method of laminated substrate of claim 1, wherein a resin fluidity suppressing step intervenes between first heating step and forced flowing step, and this resin fluidity suppressing step is to heat the sheet and to compress the sheet by a pressure for contacting between the sheet and heating means for heating this sheet.

22. The manufacturing method of laminated substrate of claim 1, wherein a resin fluidity suppressing step intervenes between first heating step and forced flowing step, and this resin fluidity suppressing step is to heat the sheet and to reduce the compression pressure of the sheet depending on decline of viscosity of the sheet.

23. The manufacturing method of laminated substrate of claim 1, wherein an evacuating step comes before first heating step in integrating process, and at least one of space and gap is evacuated to be nearly vacuum, and evacuation is canceled when the resin temperature is somewhere between the softening temperature of the resin and upper limit temperature of second temperature range.

24. The manufacturing method of laminated substrate of claim 23, wherein evacuation is canceled at a temperature lower than a temperature where the resin viscosity is minimum viscosity.

25. The manufacturing method of laminated substrate of claim 23, wherein evacuation is canceled nearly simultaneously with start of forced flowing.

28. The manufacturing method of laminated substrate of claim 1, wherein the first heating step is to apply pressure, and heat until the sheet temperature reaches the temperature of resin flowable viscosity at this pressure.

29. The manufacturing method of laminated substrate of claim 1, wherein the resin temperature in forced flowing is held at a nearly constant temperature.

30. The manufacturing method of laminated substrate of claim 1, wherein the temperature rise gradient of sheet in first heating step is set larger than the temperature gradient of the sheet in forced flowing.

31. The manufacturing method of laminated substrate of claim 1, wherein the sheet and electronic components are placed face to face before laminating step, either one of the sheet and substrate is held and suspended by providing a space between the electronic components and sheet, and the laminating step is to suck air in the space and mount the sheet on the electronic components.

32. The manufacturing method of laminated substrate of claim 31, wherein the sheet is a plate form which is viscous at ordinary temperature.

33. The manufacturing method of laminated substrate of claim 1, wherein the laminating step is preceded by perforation of processing holes in prepreg, this perforation is to form resin fluidity suppressing holes near a position of abundant resin amount as compared with volume of the space in prepreg, and forced flowing is to embed the resin fluidity suppressing holes with resin.

34. The manufacturing method of laminated substrate of claim 33, wherein the resin fluidity suppressing holes are provided near the electronic components.

35. The manufacturing method of laminated substrate of claim 33, wherein the electronic components consist of a first electronic component, and a second electronic component disposed adjacently to the first electronic component, and the resin fluidity suppressing holes are provided near the side face of opposite side of the second electronic component of the first electronic component.

36. The manufacturing method of laminated substrate of claim 33, wherein the electronic components consist of a first electronic component, a second electronic component disposed across a first gap to the first electronic component, and a third electronic component disposed at opposite side of the first electronic component across a second gap smaller than the first gap to the second electronic component, and the resin fluidity suppressing holes are provided at least at a corresponding position between the first electronic component and second electronic component.

37. The manufacturing method of laminated substrate of claim 33, wherein the resin fluidity suppressing holes are provided near the center of the sheet.

38. The manufacturing method of laminated substrate of claim 33, wherein the second heating step is followed by a cutting step of cutting at least either the resin or the substrate, and the resin fluidity suppressing holes are provided in a region enclosed by the cut section being cut by the cutting step.

48. The manufacturing method of laminated substrate of claim 1, wherein a semiconductor device for module of claim 39 is mounted on the land formed on the upside of the substrate, and the land and connection bumps of the semiconductor device are connected.

26. A manufacturing method of laminated substrate comprising a step of preparing a substrate, a step of preparing electronic components, a step of mounting electronic components on a conductive area formed on a principal plane of the substrate, a step of preparing a sheet impregnated with a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range higher than first temperature range, and is cured in third temperature range higher than second temperature range, a step of preparing a perforated sheet having holes formed in a sheet for forming a space around electronic components when sheet is laminated on electronic components, a step of laminating the perforated sheet on electronic components, a first heating step of heating the perforated sheet to second temperature range and softening the thermosetting resin, a heating and compressing step of compressing the perforated sheet from the second temperature range to the third temperature range, and heating and compressing the resin, and a second heating step of heating the sheet to third temperature range after this heating and compressing step, wherein the heating and compressing step changes the pressure applied to the sheet depending on the viscosity of the resin.

27. A manufacturing method of laminated substrate comprising a step of preparing a substrate, a step of preparing electronic components, a step of mounting electronic components on a conductive area formed on a principal plane of the substrate, a step of preparing a sheet impregnated with a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range higher than first temperature range, and is cured in third temperature range higher than second temperature range, a step of preparing a perforated sheet having holes formed in a sheet for forming a space around electronic components when sheet is laminated on electronic components, a step of laminating the perforated sheet on electronic components, a first heating step of heating the perforated sheet to second temperature range and softening the thermosetting resin, a heating and compressing step of compressing the perforated sheet from the second temperature range to the third temperature range, and heating and compressing the resin, and a second heating step of heating the sheet to third temperature range after this heating and compressing step, wherein the heating and compressing step changes the speed of compressing the sheet depending on the viscosity of the resin.

39. A semiconductor device for module comprising a semiconductor device forming a semiconductor circuit, and connection bumps connected to plural electrodes arrayed at one side of outer body of this semiconductor device, wherein the connection bumps have a first bump array having a plurality of connection bumps arranged so as to form a first space between adjacent connection bumps, and a second bump array having a plurality of connection bumps arranged so as to form a second space having a wider opening area than the opening area of the first space.

40. The semiconductor device for module of claim 39, wherein the first bump array has a first electrode, and a second electrode electrically independent from this first electrode, and short-circuit preventing means for preventing short-circuiting of the first electrode and second electrode is provided between the second electrode and first electrode.

41. The semiconductor device for module of claim 39, wherein the second array is provided near the outer periphery of the semiconductor device.

42. The semiconductor device for module of claim 39, wherein the connection bumps of the second bump array have a higher melting point than the connection bumps of the first bump array.

43. The semiconductor device for module of claim 39, wherein the size of connection bumps is gradually increased from the first bump array side to the second bump array side.

44. The semiconductor device for module of claim 39, wherein the interval of connection bumps in second bump array is set larger than the interval of connection bumps in first bump array.

45. A module comprising a substrate, and a conductive area (land pattern) provided on a principal plane of the substrate, wherein a semiconductor device for module of claim 39 is mounted on the conductive area, the conductive area is provided at a position corresponding to connection bumps of the semiconductor device for module, and a first resin fluidity embedding part is provided between the substrate and the downside of the semiconductor device for module.

46. A module of claim 45 having a resin sheet provided on the upside of a substrate and embedding a semiconductor device for module, wherein the sheet has a second resin fluidity embedding part by the resin provided on the outer periphery of the semiconductor device for module.

47. The module of claim 46, wherein the resin is a thermosetting resin which has a fluidity in first temperature range, and is cured in second temperature range higher than the first temperature range, and the melting point of connection bumps is higher than the upper limit temperature of the first temperature range.

49. A manufacturing apparatus of laminated substrate for embedding electronic components in a laminated substrate, comprising laminating means for laminating a sheet by forming a space around electronic components on a substrate having lands and electrodes of electronic components provided on the upside connected and fixed by connection and fixing member, and integrating means provided at the downstream of the integrating means and integrating the sheet and substrate by heating and compressing, the sheet being a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range higher than first temperature range, and is cured in third temperature range higher than second temperature range, wherein the integrating means includes enclosing means surrounding the substrate and shielding the atmosphere, evacuating means connected to the enclosing means for evacuating by sucking air in the enclosing means, compressing means provided in the vertical direction of the substrate laminating the sheet for compressing the sheet, heating means provided in the compressing means for heating the compressing means to third temperature range, and driving means coupled to the compressing means, the manufacturing apparatus of laminated substrate further comprises a sensor provided in the compressing means for issuing a signal depending on the viscosity of the resin, and a driving means control circuit inserted between the sensor output and driving means, and the driving means control circuit compresses the sheet to the compressing means when the sheet temperature is within the second temperature range, and forces the resin to flow into the space between the electronic components and substrate.

50. The manufacturing apparatus of laminated substrate of claim 49, wherein the sensor is a temperature sensor for detecting the sheet temperature, and on the basis of the signal issued from the temperature sensor, the driving means control circuit forces the resin to flow in at temperature of the sheet lower than the temperature of minimum viscosity of the sheet.

51. The manufacturing apparatus of laminated substrate of claim 49, wherein the sensor is a temperature sensor for detecting the sheet temperature, and the driving means control circuit forces the resin to flow into the space at the temperature of the sheet lower than the melting temperature of the connection and fixing member.

52. The manufacturing apparatus of laminated substrate of claim 49, wherein the sensor is a temperature sensor for detecting the sheet temperature, and on the basis of the signal issued from the temperature sensor, the driving means control circuit forces the resin to flow in at temperature of the sheet lower than the melting temperature of the connection and fixing member by more than a predetermined temperature increment raised by frictional heat.

53. The manufacturing apparatus of laminated substrate of claim 49, wherein the speed of the compressing means is small enough so as not to raise the viscosity of the resin, by temperature rise by frictional heat generated between the resin and electronic components or substrate.

54. The manufacturing apparatus of laminated substrate of claim 49, wherein the compressing means compresses the sheet at a speed so that the viscosity of the resin may be smaller by temperature rise by frictional heat generated between the resin and electronic components or substrate.

55. The manufacturing apparatus of laminated substrate of claim 49, wherein the sensor is a temperature sensor for detecting the sheet temperature, a heating means control circuit is inserted between the output of this temperature sensor and heating means, and the heating means control circuit heats the sheet to temperature higher than the melting point of the connection and fixing member, after a first sheet loses its fluidity, on the basis of the signal issued from the temperature sensor.

56. The manufacturing apparatus of laminated substrate of claim 55, wherein the sensor has at least a temperature sensor for detecting the sheet temperature, and when the output from the temperature sensor indicates within first temperature range, the driving means control circuit holds the compression pressure by the pressing means by a small pressure.

57. The manufacturing apparatus of laminated substrate of claim 49, wherein the sensor has at least a temperature sensor for detecting the sheet temperature, and on the basis of the output signal of the temperature sensor, when the driving means control circuit judges it to be within second temperature range, the pressure of the pressing means is kept at a small pressure for suppressing fluidity of the resin until the pressing means forces the resin to flow into the space.

58. The manufacturing apparatus of laminated substrate of claim 49, wherein the sensor has at least a temperature sensor for detecting the sheet temperature, and the driving means control circuit increases, on the basis of the output signal from this temperature sensor, the moving speed of the compressing means in second temperature range more than in first temperature range.

59. The manufacturing apparatus of laminated substrate of claim 49, wherein the sensor includes at least a pressure sensor provided in the compressing means, and when the pressure of the pressure sensor becomes a predetermined first pressure, the driving means control circuit changes the sheet compressing pressure to second pressure smaller than first pressure.

60. The manufacturing apparatus of laminated substrate of claim 59, wherein the driving means control circuit moves in a direction of increasing the interval of the pressing means when the pressure becomes first pressure.

61. The manufacturing apparatus of laminated substrate of claim 59, wherein the sensor includes at least a temperature sensor, and the driving means control circuit holds the pressure of the pressing means below a predetermined pressure until the temperature of the resin becomes a predetermined temperature.

62. The manufacturing apparatus of laminated substrate of claim 59, wherein the driving means control circuit cancels evacuation when the sheet temperature is in second temperature range.

63. The manufacturing apparatus of laminated substrate of claim 59, wherein the compressing means changes the sheet compressing pressure depending on the viscosity of the resin.

64. The manufacturing apparatus of laminated substrate of claim 59, wherein the driving means control circuit changes the sheet compressing pressure depending on the signal from the sensor.

65. The manufacturing apparatus of laminated substrate of claim 59, wherein the driving means control circuit changes the sheet compressing speed depending on the signal from the sensor.

66. A manufacturing apparatus of laminated substrate comprising suspending means provided on upside of compressing means for holding a sheet above electronic components so as to have a space around electronic components, wherein evacuating means evacuates nearly to vacuum state by sucking at least the air in the space.

67. The manufacturing apparatus of laminated substrate of claim 66, wherein sealing means is composed of at least compressing means, and a guide unit planted on this compressing means and provided to cover the outer periphery of substrate, and a sheet is placed to cover the opening of the guide unit.

68. The manufacturing apparatus of laminated substrate of claim 66, wherein the guide unit has holes for sucking the air in the sealing means, and the holes are provided near the lower end of the guide unit.

69. The manufacturing apparatus of laminated substrate of claim 66, wherein the suspending means includes a guide unit enclosing the side of substrate, and a holder provided at upside of the guide unit and having a slope in a direction of spreading the width upward.

70. The manufacturing apparatus of laminated substrate of claim 66, wherein the suspending means is composed of upper side compressing plate provided opposite to the compressing means, and a holder claw provided in the upper side compression plate.

71. The manufacturing apparatus of laminated substrate of claim 70, wherein the holder claw is rotatably provided on the upper side compression plate.

72. The manufacturing apparatus of laminated substrate of claim 70, wherein the holder claw is provided to cover the entire periphery of the sheet.