Method of manufacturing light emitting device

• US 20050233488A1
• Filed: 06/13/2005
• Published: 10/20/2005
• Est. Priority Date: 10/09/2002
• Status: Active Grant

• Current Assignee: Semiconductor Energy
• Original Assignee: Semiconductor Energy
• Inventors: Yamazaki, Shunpei, Murakami, Masakazu
• Granted Patent: US 7,393,708 B2
• Time in Patent Office: Days
• US Class Current: 438/33
• CPC Class Codes: G09G 2330/02 Details of power systems and of start or stop of display operation
• CPC Class Codes: G09G 2330/028 Generation of voltages supplied to electrode drivers in a matrix display other than LCD
• CPC Class Codes: G09G 3/006 Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays testing individual LED's G01R31/2635; testing lamps G01R31/44; testing of optical features of LCD displays G02F1/1309
• CPC Class Codes: G09G 3/3208 organic, e.g. using organic light-emitting diodes [OLED]
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/12 Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/70 Testing, e.g. accelerated lifetime tests
• CPC Class Codes: H10K 71/851 Division of substrate

Abstract

The present invention provides a manufacturing method of a light emitting device in which the number of display panels manufactured from one substrate is increased and display panel is mass produced is provided. One feature of the invention is that the shipping is performed not by separating the substrate over which a plurality of light emitting regions is formed and attaching the FPC to the each piece thereof but before separating, namely in the incomplete state (that can be also referred to as semi end products). However, the invention has a structure in which the inspection can be partly carried out before the shipping.

Claims

1. A method for manufacturing a light emitting device comprising the steps of:

forming a plurality of light emitting regions and a plurality of terminal portions over a first substrate;

sealing the light emitting regions and the terminal portions with a second substrate;

removing one part of the second substrate overlapped with one part the terminal portions, thereby exposing the one part of the terminal portions;

inspecting by applying a current to the one part of the terminal portions;

cutting off the first and the second substrates thereby dividing into each light emitting region with each terminal portion; and

attaching an FPC to the each terminal portion connected to the each light emitting region.

2. A method according to claim 1, wherein n×

m (n>

1 and m>

1) light emitting regions are arranged in n lines and m columns in the first substrate.

3. A method according to claim 1, wherein the light emitting regions comprise a plurality of thin film transistors.

4. A method according to claim 1, wherein the second substrate has the same size as that of the first substrate or smaller size than that of the first substrate.

5. A method according to claim 1, the light emitting device is incorporated in a camera.

6. A method according to claim 1, the light emitting device is incorporated in a display device.

7. A method according to claim 1, the light emitting device is incorporated in a navigation system.

8. A method according to claim 1, the light emitting device is incorporated in a personal computer.

9. A method according to claim 1, the light emitting device is incorporated in a portable information terminal.

10. A method according to claim 1, the light emitting device is incorporated in a game machine.

11. A method for manufacturing a light emitting device comprising the steps of:

forming a plurality of light emitting regions and a plurality of terminal portions connected to the light emitting regions over a first substrate;

sealing the light emitting regions and the terminal portions with a second substrate;

removing one part of the second substrate overlapped with one part the terminal portions, thereby exposing the one part of the terminal portions;

inspecting by applying a current to the one part of the terminal portions;

covering the one part of the terminal portions with an antistatic agent;

cutting off the first and the second substrates, thereby dividing into each light emitting region with each terminal portion; and

attaching an FPC to the each terminal portion.

12. A method according to claim 11, wherein n×

m (n>

1 and m>

1) light emitting regions are arranged in n lines and m columns in the first substrate.

13. A method according to claim 11, wherein the light emitting regions comprise a plurality of thin film transistors.

14. A method according to claim 11, wherein the second substrate has the same size as that of the first substrate or smaller size than that of the first substrate.

15. A method according to claim 11, the light emitting device is incorporated in a camera.

16. A method according to claim 11, the light emitting device is incorporated in a display device.

17. A method according to claim 11, the light emitting device is incorporated in a navigation system.

18. A method according to claim 11, the light emitting device is incorporated in a personal computer.

19. A method according to claim 11, the light emitting device is incorporated in a portable information terminal.

20. A method according to claim 11, the light emitting device is incorporated in a game machine.

21. A method for manufacturing a light emitting device comprising the steps of:

forming a plurality of light emitting regions and a plurality of terminal portions over a first substrate;

sealing the light emitting regions and the terminal portions with at least one second substrate, the second substrate being smaller than the first substrate;

dividing the first substrate along the second substrate;

removing one part of the second substrate overlapped with one part of the terminal portions, thereby exposing the one part of the terminal portions;

inspecting by applying a current to the one part of the terminal portions;

cutting off the first and the second substrates, thereby dividing into each light emitting region with each terminal portion; and

attaching an FPC to the each terminal portion connected to the each light emitting region.

22. A method according to claim 21, wherein n×

m (n>

1 and m>

1) light emitting regions are arranged in n lines and m columns in the first substrate.

23. A method according to claim 21, wherein the light emitting regions comprise a plurality of thin film transistors.

24. A method according to claim 21, the light emitting device is incorporated in a camera.

25. A method according to claim 21, the light emitting device is incorporated in a display device.

26. A method according to claim 21, the light emitting device is incorporated in a navigation system.

27. A method according to claim 21, the light emitting device is incorporated in a personal computer.

28. A method according to claim 21, the light emitting device is incorporated in a portable information terminal.

29. A method according to claim 21, the light emitting device is incorporated in a game machine.