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Method of fabricating microelectromechanical system structures

  • US 20050233543A1
  • Filed: 04/20/2004
  • Published: 10/20/2005
  • Est. Priority Date: 04/20/2004
  • Status: Active Grant
First Claim
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1. A method of simultaneously bonding components, comprising the steps of:

  • providing at least first, second and third components;

    at least one of the first, second and third components being comprised of a glass substrate and at least one of the first, second and third components being comprised of a conductive or semiconductive material; and

    simultaneously anodically bonding the at least first, second and third components in a determined order of stacking at a temperature of from about 200 to 400°

    C.

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