Wireless substrate-like sensor

• US 20050233770A1
• Filed: 03/08/2005
• Published: 10/20/2005
• Est. Priority Date: 02/06/2002
• Status: Abandoned Application

• Current Assignee: CyberOptics Semiconductor, Inc. (Nordson Corporation)
• Original Assignee: CyberOptics Semiconductor, Inc. (Nordson Corporation)
• Inventors: Gardner, DelRae H., Ramsey, Craig C., Lassahn, Jeffrey K.
• Application Number:
  US11/074,593
• Publication Number:
  US 20050233770A1
• Time in Patent Office: Days
• US Class Current: 455/561
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards

Abstract

In accordance with one aspect of the present invention, a wireless substrate-like sensor is provided having at least one weight-reducing feature. The feature can include the type of material from which the sensor is constructed, such as aluminum, an aluminum alloy, magnesium, or ceramic. The feature can also include one or more structural adaptations such as holes, whether through or partial, and struts.

Claims

1. A substrate-like sensor system for use in semiconductor processing tools, the sensor comprising:

a housing having a sensor for sensing a condition within a semiconductor processing tool;

wherein the sensor system is configured to resemble a standard sized wafer; and

wherein the sensor system includes at least one feature that reduces weight.

2. The sensor of claim 1, wherein the housing is formed of metal.

3. The sensor of claim 2, wherein the metal is aluminum.

4. The sensor of claim 2, wherein the metal is magnesium.

5. The sensor of claim 1, wherein the housing is formed of ceramic.

6. The sensor of claim 1, wherein the housing is coated with aluminum oxide.

7. The sensor of claim 1, wherein the housing is coated with Nickel.

8. The sensor of claim 1, wherein the housing is coated with a ceramic.

9. The sensor of claim 1, wherein the housing has a diameter that is substantially identical to a standard semiconductor wafer.

10. The sensor of claim 1, wherein the weight-reducing feature includes a hole.

11. The sensor of claim 10, wherein the hole extends through the housing.

12. The sensor of claim 10, wherein the hole does not extend through the housing.

13. The sensor of claim 12, wherein the hole is etched.

14. The sensor of claim 10, wherein the hole is circular.

15. The sensor of claim 1, wherein the weight reducing feature includes a plurality of holes.

16. The sensor of claim 1, wherein the weight reducing feature includes at least one spoke.

17. The sensor of claim 1, wherein the weight reducing feature includes a lattice.

18. The sensor of claim 1, wherein the weight reducing feature includes a honeycomb.

19. The sensor of claim 1, wherein the sensor is an optical sensor.