Conductive ink

• US 20050236603A1
• Filed: 05/06/2003
• Published: 10/27/2005
• Est. Priority Date: 05/07/2002
• Status: Abandoned Application

• Current Assignee: Sadeg M. Faris
• Original Assignee: Sadeg M. Faris
• Inventors: Faris, Sadeg M.
• Application Number:
  US10/513,518
• Publication Number:
  US 20050236603A1
• Time in Patent Office: Days
• US Class Current: 252/500
• CPC Class Codes: C09D 11/52 Electrically conductive inks
• CPC Class Codes: H01B 1/08 oxides
• CPC Class Codes: H01B 1/20 Conductive material dispersed in non-conductive organic material organic macromolecular compounds or compositions C08
• CPC Class Codes: H05K 1/097 Inks comprising nanoparticles and specially adapted for being sintered at low temperature H05K1/095 takes precedence

Abstract

Transparent conductive inks are provided. The conductive ink generally comprises flakes of electrically conductive material mixed with an ink carrier material. This invention shows that by making electrically conductive materials into pre-annealed flat flakes or platelets and mixing them in a suitable fluid, the prior art problems are solved, making it possible for electrically conductive inks to be conveniently used for general purpose applications exploiting their remarkable conductive properties. This is an electrically conductive ink, which is applied at room temperature, and no further annealing or treatment by the user is needed, since the conductive platelets are already annealed.

Claims

1. A method of making electrically conductive transparent ink comprising

providing a transparent conductive rigid film;

transforming said electrically conductive transparent film into a plurality of electrically conductive transparent flakes;

mixing said electrically conductive transparent flakes with a transparent ink carrier material.

2. The method as in claim 1, where the electrically conductive transparent film is formed by sputtering or chemical vapor deposition of a transparent electrically conductive material coating on a substrate.

3. The method as in claim 2, wherein the substrate and the coating are used to form the flakes.

4. The method is in claim 2, wherein the coating is removed from the substrate, further wherein the flakes are formed from the coating without the substrate

5. A transparent conductive ink comprising:

transparent conductive flakes; and

transparent ink carrier material.

6. A substantially transparent conductive ink comprising:

substantially transparent conductive flakes; and

substantially transparent ink carrier material.

7. Apparatus for producing conductive platelets comprising:

a container and a means for producing a conductive precursor material;

a film application device;

a first substrate coated by said film application device with a film of said conductive precursor material;

an annealing apparatus to anneal the conductive precursor material into the desired electrical resistivity;

a drying and cooling means for producing a conductive film;

a second substrate coated with an adhesive by an adhesive application device;

said adhesive, after application to said second substrate, is dried by a drying apparatus;

a device for transferring conductive film from first substrate onto adhesive coated second substrate;

a means for embrittling said conductive film and said adhesive;

a means for breaking into small platelets and removing the brittle conductive film and adhesive from second substrate;

a means for separating the conductive platelets from the adhesive; and

a means for drying the conductive platelets, and breaking them further into smaller platelets.

8. Apparatus for producing conductive platelets according to claim 7, wherein first and second substrates are continuously counter rotating belts rotated by drums, said belts are continuously touching to transfer conductive film.

9. Apparatus for producing conductive platelets according to claim 7, wherein the embrittling means is a chamber for cooling the materials to cryogenic temperature where nearly all conductive precursor materials become brittle and easily broken into platelets.

10. Apparatus for producing conductive platelets according to claim 7, wherein the means for breaking and removing the brittle conductive film and adhesive is an ultrasonic air jet, water jet, or a jet of a slurry comprising a fluid and an abrasive powder.

11. Apparatus for producing conductive platelets according to claim 7, wherein the means for separating the conductive platelets from the adhesive is dissolving the adhesive in suitable solvents.

12. Apparatus for producing conductive platelets according to claim 7, wherein the second substrate is eliminated, and the conductive film is broken into platelets and removed directly from the first substrate by means of an ultrasonic bath.

13. Apparatus for producing conductive platelets according to claim 7, wherein the means for breaking and removing the brittle conductive film and adhesive is a vacuum means for applying suction to said film.

14. Apparatus for producing conductive ink comprising:

a continuously moving substrate;

a means for coating said substrate with a conductive film;

a means for removing the conductive film in the form of small conductive platelets; and

a means for mixing a suitable host material with said conductive platelets producing the final conductive ink product.

15. Apparatus for producing conductive ink according to claim 14, wherein the means for removing the conductive film from substrate is a plurality of belts each coated with an adhesive pattern of the desired platelet size such that all the conductive film is turned into platelets.

16. Apparatus for producing conductive ink according to claim 14, wherein the means for separating the conductive platelets from the adhesive is the same fluid desired for making the final conductive ink product.

17. A process for producing conductive platelets comprising the steps of:

a. coating a first substrate with conductive precursor material,

b. treating said conductive precursor material to provide a conductive film of uniform thickness;

c. transferring said conductive film to a second substrate, said second substrate having an adhesive coating on a surface thereof forming a conductive film-adhesive coating structure,

d. breaking said conductive film and said adhesive coating structure into adhesive coated platelets of a selected size,

e. separating said adhesive coating from said adhesive coated platelets by means of a solvent, and,

f. drying said platelets.

18. A process for producing conductive platelets according to claim 17 wherein the step of treating includes the step of annealing said conductive precursor material to form a film of a desired electrical resistivity.

19. A process for producing conductive platelets according to claim 17 further including the step of mixing said platelets into a host material.

20. A process for producing conductive platelets comprising the steps of:

a. coating a first substrate with conductive precursor material,

b. treating said conductive precursor material to provide a conductive film of uniform thickness;

c. transferring said conductive film to a second substrate, said second substrate having an adhesive coating on a surface thereof forming a conductive film-adhesive coating structure,

d. shaping at least said conductive film into adhesive coated platelets of a selected size,

e. separating said adhesive coating from said adhesive coated platelets by means of a solvent, and,

f. drying said platelets.

21. A process according to claim 20 wherein the step of shaping at least said conductive film includes the steps of photolithographically patterning and etching said at least a layer into platelets of a selected size.