Optical device and method for fabricating the same

• US 20050236685A1
• Filed: 04/22/2005
• Published: 10/27/2005
• Est. Priority Date: 04/26/2004
• Status: Active Grant

• Current Assignee: Collabo Innovations, Inc. (Wi-LAN Inc.)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Minamio, Masanori
• Granted Patent: US 7,511,367 B2
• Time in Patent Office: Days
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

An optical device includes: a base 10; an optical element chip 5 mounted on the base 10; an integrated circuit chip 50 bonded to the back surface of the optical element chip 5; and a transparent member (window member 6). An interconnect 12 is buried in the base 10. The interconnect 12 has an inner terminal portion 12a, an outer terminal portion 12b and an intermediate terminal portion 12c. Pad electrodes 5b on the optical element chip 5 are connected to the inner terminal portion 12a via bumps 8. Pad electrodes 50b on the integrated circuit chip 50 are connected to the intermediate terminal portion 12c via fine metal wires 52. The integrated circuit chip 50 equipped with peripheral circuits and other circuits and the optical element chip 5 are combined into one package.

Claims

1. An optical device comprising:

a base made of a molding resin and having an opening;

an interconnect partially buried in the base and having terminal portions exposed from the base;

a transparent member attached to a first face of the base and covering the opening;

a first resin member for sealing a gap between an edge of the transparent member and a portion of the first face of the base surrounding the opening;

an optical element chip provided on a second face of the base and including an optical element electrically connected to at least one of the terminal portions of the interconnect, the optical element chip having a principal surface facing the transparent member with the opening sandwiched therebetween, the second face being at the opposite side of the first face;

an integrated circuit chip bonded to a back surface of the optical element chip and including a semiconductor element electrically connected to at least one of the terminal portions of the interconnect; and

a second resin member for sealing a gap between respective edges of the optical element chip and the integrated circuit chip and a portion of the second face of the base surrounding the opening.

2. The optical device of claim 1, wherein the optical element chip is flip-chip bonded to at least one of the terminal portions of the interconnect in the base.

3. The optical device of claim 1, wherein the integrated circuit chip has a principal surface opposite to the surface thereof facing the transparent member, and

the semiconductor element is connected to at least one of the terminal portions of the interconnect in the base via at least one fine metal wire.

4. The optical device of claim 1, wherein an insulating film is interposed between the optical element chip and a back surface of the integrated circuit chip.

5. The optical device of claim 1, wherein a step portion is formed in the second face of the base to surround the opening such that the thickness of the base is reduced in a portion surrounding the opening, and

the optical element chip is mounted on the portion of the base where the thickness of the base is reduced.

6. The optical device of claim 1, wherein the base is provided with positioning means for use as a reference point in positioning a member on the base.

7. The optical device of claim 6, wherein the positioning means is a through hole formed in the base.

8. The optical device of claim 1, wherein a solid-state imaging element is mounted on the optical element chip.

9. The optical device of claim 1, wherein either a light-emitting element or a photo-receiver is mounted on the optical element chip, and

the optical device is incorporated in an optical pick up apparatus.

10. The optical device of claim 1, wherein the transparent member is a hologram, and

a photo-receiver and a light-emitting element are mounted on the optical element chip.

11. A method for fabricating an optical device, the method comprising the steps of:

a) molding a lead frame having an interconnect pattern, thereby forming a mold to be a base having a plurality of optical device regions each surrounding an opening;

b) mounting an optical element chip and an integrated circuit chip in this order on each of the optical device regions in the mold or a part separated from the mold, after the step a) has been performed,

c) sealing, with a first resin member, a gap between either the mold or the separated part and a stack including the optical element chip and the integrated circuit chip, after the step b) has been performed;

d) attaching a transparent member to the mold or the separated part in such a manner that the transparent member faces the optical element chip with the opening sandwiched therebetween, after the step a) has been performed; and

e) sealing, with a second resin member, the transparent member and the mold or the separated part, after the step d) has been performed or concurrently with the step d).

12. The method of claim 11, wherein in step b), the optical element chip is flip-chip bonded to a part of the interconnect pattern.

13. The method of claim 11, further comprising the step of connecting part of the integrated circuit chip and part of the interconnect pattern to each other by at least one fine metal wire, after the step b) has been performed and before the step c) is performed.

14. The method of claim 11, further comprising the step of reducing the thickness of a terminal portion of the lead frame located around the opening by coining, before the step a) is performed.

15. The method of claim 11, wherein in step a), the lead frame and a sealing tape are placed in a molding die with the lead frame placed on the sealing tape, thereby performing resin molding.