Method and apparatus for placing ID tags in molded articles

• US 20050237195A1
• Filed: 03/23/2005
• Published: 10/27/2005
• Est. Priority Date: 04/27/2004
• Status: Active Grant

• Current Assignee: SencorpWhite Inc.
• Original Assignee: Sencorp Inc. (Kyocera Corporation)
• Inventors: Urban, Brian J.
• Granted Patent: US 7,323,990 B2
• Time in Patent Office: Days
• US Class Current: 340/572.100
• CPC Class Codes: B29C 43/18 incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles B29C43/206 takes precedence
• CPC Class Codes: G08B 13/2445 Tag integrated into item to be protected, e.g. source tagging
• CPC Class Codes: Y10T 83/04 Processes

Abstract

A thermoforming apparatus and method are provided. An identification tag such as a radio frequency identification tag is provided for molding into or attaching to a thermoformed article during the thermoforming process. The tag may be attached to the article by mechanical interlocking and/or a heat sensitive adhesive. The identification tag is applied to the article while the article is being formed in the thermoforming mold.

Claims

1. A method of securing a product identification tag to a heat formed article;

said method comprising

removing a product identification tag form a source of tags;

moving said removed tag to a position adjacent to a mold component;

moving a heat formable material to a position adjacent the positioned tag and mold component;

heating the heat formable material to a temperature to permit heat forming of the material, but below its melting temperature;

moving the heated material into contact with the mold component;

forming the heat formable material to conform generally to the shape of a portion of the mold component and over a portion of the tag; and

attaching the removed tag to the heated material during the forming of the material.

2. The method of claim 1 wherein the attaching being by mechanical interengagement.

3. The method of claim 2, wherein a portion of the heated material being formed to interengage with a portion of the tag.

4. The method of claim 1 wherein the attaching being by adhesion.

5. The method of claim 4 including applying hot melt adhesive to at least one of the tag and the material to effect the attaching by adhesion.

6. The method of claim 1 wherein the moving of the removed tag including moving the removed tag through a portion of said mold component.

7. The method of claim 1 wherein the moving of the removed tag including moving the removed tag into contact with an exposed portion of the mold component and then moving the heat formable material into attaching engagement with the tag.

8. The method of claim 1 wherein the tag including an RFID tag.

9. The method of claim 1 including forming an open faced pocket around a portion of the tag.

10. An apparatus for forming a molded article with an attached identification tag, said apparatus including:

at least one mold component;

a feed device adapted to selectively feed heat formable material to a position adjacent the mold component;

a heater adapted to heat thermoformable material to a temperature sufficient for heat forming;

a force applying device associated with the mold component and operable to

apply force to thermoformable material and conform the material generally to at least a portion of the mold component; and

a transport mechanism associated with the mold and operable to move an identification tag from a source to a position adjacent an exposed surface of the mold component for attachment to material formed by the mold component.

11. The apparatus of claim 10 wherein the transport mechanism including an elevating mechanism adapted to move the tag to a generally upwardly facing surface of the mold component.

12. The apparatus of claim 11 wherein the elevating mechanism including a pin movably mounted in the mold component and having a free end adapted to receive a tag on a first surface thereof, said first surface forming a portion of an exposed molding surface of the mold component.

13. The apparatus of claim 12 including a vacuum source operably associated with the first surface to releasably secure a tag in position on the pin.

14. The apparatus of claim 10 wherein the transport mechanism including a robotic arm with at least one attachment member movable between a tag pickup position and a tag depositing portion and operable to selectively move a tag from its pickup position to its deposting position adjacent the mold component.

15. The apparatus of claim 12 wherein the mold component having a generally upwardly facing second surface and said robotic arm being operable to deposit a tag on said second surface.

16. The apparatus of claim 15 including a vacuum source operably associated with the attachment member to releasably secure a tag in position on the attachment member.

17. The apparatus of claim 10 including a retainer mechanism associated with the mold component operable to releasably retain a tag adjacent a molding surface of the mold component.

18. The apparatus of claim 17 wherein the retainer mechanism including a vacuum source communicating with a port opening on a surface of the attachment member.

19. The apparatus of claim 10 wherein the mold component including a male mold portion.

20. The apparatus of claim 10 wherein the mold component including a female mold portion.

21. The apparatus of claim 10 wherein the mold component including a male mold portion and a female mold portion.

22. The apparatus of claim 10 wherein the force applying device including a vacuum source in flow communication with a port adjacent the mold component operable to reduce air pressure adjacent the mold component.