Coated polymeric substrates having improved surface smoothness suitable for use in flexible electronic and opto-electronic devices
First Claim
1. The use of a coating composition comprising:
- (a) from about 5 to about 50 weight percent solids, the solids comprising from about 10 to about 70 weight percent silica and from about 90 to about 30 weight percent of a partially polymerized organic silanol of the general formula RSi(OH)3, wherein R is selected from methyl and up to about 40% of a group selected from the group consisting of vinyl, phenyl, gamma-glycidoxypropyl, and gamma-methacryloxypropyl, and (b) from about 95 to about 50 weight percent solvent, the solvent comprising from about 10 to about 90 weight percent water and from about 90 to about 10 weight percent lower aliphatic alcohol, wherein the coating composition has a pH of from about 3.0 to about 8.0, for the purpose of improving the surface smoothness of a polymeric substrate, wherein the surface of said coated substrate exhibits an Ra value of less than 0.6 nm, and/or an Rq value of less than 0.8 nm.
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Abstract
The use of a coating composition comprising: (a) from about 5 to about 50 weight percent solids, the solids comprising from about 10 to about 70 weight percent silica and from about 90 to about 30 weight percent of a partially polymerized organic silanol of the general formula RSi(OH)3, wherein R is selected from methyl and up to about 40% of a group selected from the group consisting of vinyl, phenyl, gamma-glycidoxypropyl, and gamma-methacryloxypropyl, and (b) from about 95 to about 50 weight percent solvent, the solvent comprising from about 10 to about 90 weight percent water and from about 90 to about 10 weight percent lower aliphatic alcohol, wherein the coating composition has a pH of from about 3.0 to about 8.0, for the purpose of improving the surface smoothness of a polymeric substrate, particularly a heat-stabilised, heat-set, oriented polyester substrate, and use of said coated substrate in the manufacture of an electronic or optoelectronic device containing a conjugated conductive polymer.
49 Citations
27 Claims
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1. The use of a coating composition comprising:
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(a) from about 5 to about 50 weight percent solids, the solids comprising from about 10 to about 70 weight percent silica and from about 90 to about 30 weight percent of a partially polymerized organic silanol of the general formula RSi(OH)3, wherein R is selected from methyl and up to about 40% of a group selected from the group consisting of vinyl, phenyl, gamma-glycidoxypropyl, and gamma-methacryloxypropyl, and (b) from about 95 to about 50 weight percent solvent, the solvent comprising from about 10 to about 90 weight percent water and from about 90 to about 10 weight percent lower aliphatic alcohol, wherein the coating composition has a pH of from about 3.0 to about 8.0, for the purpose of improving the surface smoothness of a polymeric substrate, wherein the surface of said coated substrate exhibits an Ra value of less than 0.6 nm, and/or an Rq value of less than 0.8 nm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 21, 22)
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20. A composite film comprising a heat-stabilised, heat-set, oriented poly(ethylene)naphthalate substrate, and a coating layer, wherein said substrate exhibits one or more of:
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(i) a shrinkage at 30 mins at 230°
C. of less than 1%; and
/or(ii) a residual dimensional change Δ
LT measured at 25°
C. before and after heating the film from 8°
C. to 200°
C. and then cooling to 8°
C., of less than 0.75% of the original dimension; and
/or(iii) a coefficient of linear thermal expansion (CLTE) within the temperature range from −
40°
C. to +100°
C. of less than 40×
10−
6/°
C.;
and wherein the surface of said coated substrate exhibits an Ra value of less than 0.6 nm, and/or an Rq value of less than 0.8 nm. - View Dependent Claims (27)
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23. A method of manufacture of a coated polymeric film which comprises the steps of:
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(i) forming a substrate layer comprising poly(ethylene naphthalate);
(ii) stretching the layer in at least one direction;
(iii) heat-setting under dimensional restraint at a tension in the range of about 19 to about 75 kg/m of film width, at a temperature above the glass transition temperature of the polyester but below the melting temperature thereof;
(iv) heat-stabilising under a tension of less than 5 kg/m of film width, and at a temperature above the glass transition temperature of the polyester but below the melting temperature thereof; and
(v) applying a planarising coating composition thereto such that the surface of said coated substrate exhibits an Ra value of less than 0.6 nm, and/or an Rq value of less than 0.8 nm.
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24. A method of manufacture of an electronic or opto-electronic device containing a conjugated conductive polymer and a substrate, said method comprising the steps of:
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(i) forming a substrate layer comprising poly(ethylene naphthalate);
(ii) stretching the layer in at least one direction;
(iii) heat-setting under dimensional restraint at a tension in the range of about 19 to about 75 kg/m of film width, at a temperature above the glass transition temperature of the polyester but below the melting temperature thereof;
(iv) heat-stabilising under a tension of less than 5 kg/m, and at a temperature above the glass transition temperature of the polyester but below the melting temperature thereof; and
(v) applying a planarising coating composition thereto such that the surface of said coated substrate exhibits an Ra value of less than 0.6 nm, and/or an Rq value of less than 0.8 nm; and
(vi) providing the coated, heat-stabilised, heat-set, oriented film as a substrate in the device.
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- 25. A method according to claim 25 further comprising providing on a surface of the coated substrate a barrier layer.
Specification