Apparatus for depositing a multilayer coating on discrete sheets

• US 20050239294A1
• Filed: 04/22/2005
• Published: 10/27/2005
• Est. Priority Date: 04/15/2002
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Moro, Lorenza, Graff, Gordon L., Chu, Xi, Burrows, Paul, Bonham, Charles C., Gross, Mark E., Martin, Peter M., Zumhoff, Mac R., Nelson, Kenneth Jeffrey, Rosenblum, Martin Philip
• Granted Patent: US 8,900,366 B2
• Time in Patent Office: Days
• US Class Current: 438/778
• CPC Class Codes: B05D 1/60 Deposition of organic layers from vapour phase vapour phase deposition in general C23C14/00, C23C16/00
• CPC Class Codes: B05D 3/067 Curing or cross-linking the coating
• CPC Class Codes: B05D 7/52 Two layers
• CPC Class Codes: C23C 14/568 Transferring the substrates through a series of coating stations C23C14/562 takes precedence
• CPC Class Codes: H01L 21/67155 Apparatus for manufacturing or treating in a plurality of work-stations
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/67236 the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/164 using vacuum deposition

Abstract

A tool for depositing multilayer coatings onto a substrate. In one configuration, the tool includes a includes an in-line organic material deposition station operating under at least one of a pressure or temperature controlled environment. In another, it further is of a hybrid design that incorporates both in-line and cluster tool features. In this latter configuration, at least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. The tool is particularly well-suited to depositing multilayer coatings onto discrete substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.

Claims

1. A device for forming at least one layer of organic material onto a discrete substrate, said device comprising:

an organic material deposition station;

an organic material curing station cooperative with said organic material deposition station;

a substrate-transport configured to convey said substrate between at least said organic material deposition station and said organic material curing station;

a reduced-pressure source placed in vacuum communication with said organic material deposition station such that during at least a portion of deposition of said organic layer onto said discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate; and

a thermal control mechanism cooperative with at least one of said organic material deposition station and organic material curing station such that a temperature therein can be controlled during formation of said organic material on said substrate.

2. The device of claim 1, further comprising a control system configured to adjust at least one of said temperature and pressure conditions in said organic material deposition station.

3. The device of claim 2, wherein said control system is configured to adjust both of said temperature and pressure conditions in said organic material deposition station.

4. The device of claim 1, further comprising a plasma cleaning system coupled to said organic material deposition station.

5. The device of claim 4, wherein said plasma cleaning system comprises:

a plasma source fluidly coupled to said organic material deposition station, said plasma source configured to generate a reactive species that can chemically remove residual organic deposits from said organic material deposition station;

a coupling port in fluid communication with said remote plasma source; and

a plasma enclosure in fluid communication with said coupling port.

6. The device of claim 5, wherein said a plasma source comprises a radio frequency generator.

7. The device of claim 5, wherein said plasma source contains a precursor gas selected from the group consisting of O₂, O₃, H₂, N₂, NF₃, CF₄, C₂F₆, and C₃F₈.

8. The device of claim 1, further comprising a masking station configured to apply a mask to said substrate prior to deposition of at least one of said organic layers.

9. A device for depositing material onto a discrete substrate, said device comprising:

a cluster tool configured to deposit one at least one inorganic layer onto said substrate;

an in-line tool configured to deposit one at least one organic layer onto said substrate, said in-line tool operatively coupled to said cluster tool; and

a reduced-pressure source placed in vacuum communication with at least said in-line tool such that during at least a portion of deposition of said organic layer onto said discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate.

10. The device of claim 9, further comprising a thermal control mechanism cooperative with said device such that a temperature in at least one of said cluster tool and said in-line tool can be controlled during deposition of said material on said substrate.

11. The device of claim 10, wherein said in-line tool comprises:

an organic material deposition station;

an organic material curing station cooperative with said organic material deposition station; and

a substrate-transport configured to convey said substrate between at least said organic material deposition station and said organic material curing station.

12. The device of claim 11, wherein said organic material deposition station comprises:

an organic material evaporator;

an organic material deposition nozzle in fluid communication with said evaporator; and

an organic material confinement system disposed about said nozzle.

13. The device of claim 12, wherein said organic material deposition station defines an isolatable interior chamber.

14. The device of claim 13, wherein said isolatable interior chamber defines a first region comprising said organic material confinement system, and a second region selectively isolatable from said first region through a moveable shutter.

15. The device of claim 14, further comprising a cooling device in thermal communication with said second region, said cooling device configured to reduce the effect of a thermal load generated in said first region on said second region.

16. The device of claim 14, further comprising at least one cold trap disposed in thermal communication with said isolatable interior chamber.

17. The device of claim 14, further comprising at least one pump fluidly coupled to at least one of said first and second regions, said at least one pump configured to provide a localized vacuum in at least one of said first or second region of said organic material confinement system.

18. The device of claim 17, wherein said at least one pump comprises a turbomolecular pump.

19. The device of claim 9, wherein said cluster tool further comprises an inorganic deposition station configured to deposit a first layer of inorganic material onto said substrate.

20. The device of claim 9, wherein said reduced-pressure source is placed in vacuum communication with said cluster tool such that during at least a portion of deposition of said inorganic layer onto said discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate.

21. A tool for depositing a multilayer coating on a discrete substrate, said tool comprising:

a plurality of peripheral stations disposed about a substantially central hub and coupled thereto such that said substantially central hub can transport said substrate between at least one of said peripheral stations, said plurality of peripheral stations comprising;

a barrier layer forming station configured to deposit one at least one inorganic layer onto said substrate; and

at least one organic layer forming station configured as an in-line tool to deposit one at least one organic layer onto said substrate;

a reduced-pressure source placed in vacuum communication with at least one of said barrier layer forming station and said organic layer forming station such that during at least a portion of deposition of said multilayer coating onto said substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate; and

a temperature control device placed in thermal communication with at least one of said barrier layer forming station and said organic layer forming station such that during at least a portion of deposition of said multilayer coating onto said substrate, said temperature control device operates to adjust the temperature of said substrate.

22. The tool of claim 21, wherein said temperature control device is configured to reduce the temperature of said substrate.

23. The tool of claim 21, further comprising at least one masking station disposed in said tool, said masking station configured to place at least one mask on said substrate.

24. The tool of claim 21, wherein said at least one organic layer forming station comprises a monomer deposition station, a monomer curing station, and a substrate-transport configured to convey said substrate between at least said monomer deposition and curing stations.

25. A tool for depositing a multilayer coating on a discrete substrate, said tool comprising:

a monomer layer deposition station configured as an in-line tool to deposit one at least one organic layer onto said substrate, said in-line tool operatively coupled to said cluster tool;

a barrier layer deposition station cooperative with said monomer layer deposition station, said barrier layer deposition station configured as a cluster tool to deposit one at least one inorganic layer onto said substrate; and

a reduced-pressure source placed in vacuum communication with said at least one of said cluster tool and said in-line tool such that during at least a portion of deposition of said multilayer coating onto said discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate.

26. The tool of claim 25, further comprising at least one curing station configured to cure an organic layer deposited by said monomer layer deposition station.

27. The tool of claim 25, further comprising at least one contamination reduction device to control the migration of material making up said organic layer from said monomer layer deposition station in which said material originated.

28. The tool of claim 25, further comprising a masking station cooperative with said tool, said masking station configured to place at least one mask on said substrate.

29. The tool of claim 28, wherein said masking station comprises an organic mask placement device and an inorganic mask placement device.

30. The tool of claim 25, wherein said monomer layer deposition station and said barrier layer deposition station are configured to reverse said substrate along respective transport paths therein such that multiple layers of said multilayer coating may be deposited.

31. The tool of claim 25, further comprising an environmental isolation valve disposed between said monomer layer deposition station and said barrier layer deposition station.

32. The tool of claim 25, further comprising at least one surface treatment chamber configured to enhance the ability of individual layers of said multilayer coating to adhere to said substrate or an adjacent layer of said multilayer coating.

33. The tool of claim 32, wherein said surface treatment chamber is disposed in said monomer layer deposition station.

34. The tool of claim 33, wherein said surface treatment chamber comprises a plasma energy source.

35. The tool of claim 33, wherein said surface treatment chamber comprises a thermal evaporation device.

36. The tool of claim 33, wherein said thermal evaporation device is configured to deposit a non-oxide material.

37. The tool of claim 36, wherein said non-oxide material comprises at least one of lithium fluoride or magnesium fluoride.

38. The tool of claim 25, wherein said barrier layer deposition station is configured to place an inorganic layer onto said substrate prior to the placement of an organic layer from said monomer layer deposition station.

39. The tool of claim 25, wherein said vacuum source is configured to provide a different vacuum level during deposition of said inorganic layer than during deposition of said organic layer.

40. An encapsulating tool configured to deposit a multilayer coating onto an organic light emitting diode placed on a discrete substrate, said encapsulating tool comprising:

a cluster tool configured to deposit one at least one inorganic layer onto said organic light emitting diode;

an in-line tool configured to deposit one at least one organic layer onto said organic light emitting diode, said in-line tool operatively coupled to said cluster tool; and

a vacuum source coupled to at least said in-line tool such that during at least a portion of deposition of said organic layer onto said organic light emitting diode, said vacuum source operates to create an at least partially evacuated environment about said organic light emitting diode.

41. The encapsulation tool of claim 40, further comprising a thermal control mechanism coupled to at least one of said cluster tool and said in-line tool.

42. The encapsulation tool of claim 40, wherein said encapsulation tool is configured such that either said inorganic or organic layer can be first applied to said organic light emitting diode.

43. A method of depositing a multilayer coating onto a substrate, said method comprising:

configuring a tool to comprise;

a cluster section configured to deposit one at least one inorganic layer onto said substrate;

an in-line section configured to deposit one at least one organic layer onto said substrate, said in-line section operatively coupled to said cluster section; and

a reduced-pressure source placed in vacuum communication with at least said in-line section;

loading said substrate into said tool;

depositing at least a portion of said inorganic material onto said substrate as a component of said multilayer coating;

operating said reduced-pressure source to create an at least partially evacuated environment about said substrate during at least a portion of deposition of said organic layer onto said substrate;

depositing at least a portion of said organic layer onto said substrate as a component of said multilayer coating; and

curing said deposited organic layer.

44. The method of claim 43, further comprising treating at least one surface of said substrate prior to forming a first layer of said multilayer coating thereon to enhance adhesion between said substrate and said first formed layer.

45. The method of claim 43, further comprising:

placing an inorganic mask over said substrate prior to said depositing said inorganic layer; and

placing an organic mask over said substrate prior to depositing said organic layer.

46. The method of claim 45, further comprising stacking a plurality of masks to make an undercut mask.

47. The method of claim 45, comprising removing said organic mask prior to said curing.

48. The method of claim 45, wherein said organic mask comprises an undercut mask.

49. The method of claim 48, wherein said depositing at least a portion of said organic layer onto said substrate comprises avoiding contact between a portion of said deposited organic layer that has spread into a shadow region defined by said undercut mask and a portion of said undercut mask that is in substantial contact with said substrate.

50. The method of claim 43, further comprising cooling at least a portion of said tool to effect control over deposition of said organic layer.

51. The method of claim 43, wherein said depositing at least a portion of said inorganic layer is performed prior to said depositing at least a portion of said organic layer onto said substrate such that the first deposited layer on said substrate is an inorganic layer.

52. The method of claim 43, wherein said depositing at least a portion of said inorganic layer is performed after said depositing at least a portion of said organic layer onto said substrate such that the first deposited layer on said substrate is an organic layer.

53. The method of claim 43, further comprising operating a thermal control mechanism such that a temperature in at least one of said cluster tool and said in-line tool can be controlled during said deposition.

54. A method of encapsulating an organic light emitting diode placed on a discrete substrate with a multilayer coating, said method comprising:

configuring an encapsulation tool to comprise;

a cluster section configured to deposit one at least one inorganic layer onto said organic light emitting diode;

an in-line section configured to deposit one at least one organic layer onto said organic light emitting diode, said in-line section operatively coupled to said cluster section; and

a vacuum source coupled to at least said in-line section;

loading said organic light emitting diode into said encapsulation tool;

depositing at least a portion of said inorganic layer onto said organic light emitting diode while said organic light emitting diode is in said inorganic layer deposition station;

depositing at least a portion of said organic layer onto said organic light emitting diode while said organic light emitting diode is in said organic layer deposition station;

operating said vacuum source to create an at least partially evacuated environment about said organic light emitting diode during at least a portion of deposition of said organic layer thereon; and

curing said deposited organic layer.

55. The method of claim 54, wherein said depositing said organic and inorganic layers are repeated at least once.

56. The method of claim 55, wherein said depositing said organic and inorganic layers can be performed in an any order.

57. The method of claim 54, wherein organic material used for said organic layer is introduced into said organic layer deposition station in vapor form.

58. The method of claim 57, wherein said organic material is a polymer precursor.

59. The method of claim 57, wherein said organic material is a monomer.

60. The method of claim 54, wherein inorganic material used for said inorganic layer is a ceramic.

61. The method of claim 54, wherein said curing said deposited organic layer comprises ultraviolet curing.

62. The method of claim 54, wherein a first applied layer is an inorganic layer.

63. The method of claim 54, wherein a final applied layer is an inorganic layer.

64. The method of claim 54, further comprising treating at least one said deposited inorganic layer prior to deposition of an organic layer thereon.

65. The method of claim 64, wherein said treatment comprises applying a plasma source to said inorganic layer.

66. A tool comprising:

an encapsulation device comprising;

an organic layer forming station comprising;

an organic material deposition station;

an organic material curing station cooperative with said organic material deposition station;

a substrate-transport configured to convey a substrate between at least said organic material deposition station and said organic material curing station;

a reduced-pressure source placed in vacuum communication with said organic material deposition station such that during at least a portion of deposition of an organic layer onto said discrete substrate, said reduced-pressure source operates to create an at least partially evacuated environment about said substrate; and

a thermal control mechanism cooperative with at least one of said organic material deposition station and organic material curing station such that a temperature therein can be controlled during formation of said organic material on said substrate; and

a barrier layer forming station configured to place at least one inorganic layer onto said substrate or said organic layer formed on said substrate, said barrier layer forming station and said organic layer forming station cooperative with one another such that upon operation thereof at least one encapsulated member is formed on said substrate;

a load lock to facilitate selective vacuum isolation between said encapsulation device and a remainder of said tool; and

an exchange mechanism to facilitate transport of said at least one encapsulated member between said encapsulation device and said remainder of said tool.

67. The tool of claim 66, wherein said encapsulation device comprises an organic light emitting diode encapsulation device.

68. The tool of claim 66, wherein said exchange mechanism comprises an accumulator.

69. The tool of claim 66, wherein said barrier layer forming station is configured as a cluster tool and said organic layer forming station is configured as an in-line tool.

70. The tool of claim 66, wherein said organic layer forming station further comprises a cleaning system.

71. The tool of claim 70, wherein said cleaning system comprises a glow discharge device.