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Method for printing an electronic circuit component on a substrate using a printing machine

  • US 20050241506A1
  • Filed: 04/29/2005
  • Published: 11/03/2005
  • Est. Priority Date: 05/03/2004
  • Status: Active Grant
First Claim
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1. A method of printing circuit components onto a printing substrate, comprising:

  • printing a conductive structure on a first side of the printing substrate, said conductive structure forming a circuit component; and

    printing a decorative image motif on a second side of the printing substrate, wherein the printing of the conductive structure and the printing of the decorative image motif are performed in one offset printing process.

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