Method for depositing thin film and thin film deposition system having separate jet orifices for spraying purge gas
First Claim
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1. A thin film deposition system comprising:
- a reaction chamber;
at least one susceptor installed in the reaction chamber for mounting a substrate thereon;
a first gas sprayer rotatably located above the susceptor; and
at least one accelerating means located at a position corresponding to the susceptor for vertically accelerating gases supplied from the first gas sprayer.
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Abstract
Disclosed are thin film deposition system and method. The thin film deposition system includes a reaction chamber; at least one susceptor installed in the reaction chamber for mounting a substrate thereon; a first gas sprayer rotatably located above the susceptor; and at least one second gas sprayer installed above the first gas sprayer for spraying purge gas. The thin film deposition system increases the absorption rate of source gas onto the surface of the substrate, efficiently shortens the supply cycles of the gases to improve the productivity thereof, and improves the cleaning effect of the purge gas so that a thin film is stably deposited on the substrate.
14 Citations
18 Claims
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1. A thin film deposition system comprising:
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a reaction chamber;
at least one susceptor installed in the reaction chamber for mounting a substrate thereon;
a first gas sprayer rotatably located above the susceptor; and
at least one accelerating means located at a position corresponding to the susceptor for vertically accelerating gases supplied from the first gas sprayer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A thin film deposition system comprising:
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a reaction chamber;
at least one susceptor installed in the reaction chamber for mounting a substrate thereon;
a first gas sprayer rotatably located above the susceptor; and
at least one second gas sprayer installed above the first gas sprayer for spraying purge gas. - View Dependent Claims (15)
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16. A thin film deposition method comprising:
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preparing a thin film deposition system including a reaction chamber, at least one susceptor installed in the reaction chamber for mounting a substrate thereon, a first gas sprayer rotatably located above the susceptor, and at least one accelerating means located at a position corresponding to the susceptor for vertically accelerating gases supplied from the first gas sprayer;
mounting the substrate on the susceptor in the reaction chamber;
spraying source gas and reaction gas onto the substrate through the rotated first gas sprayer; and
spraying purge gas onto the substrate through the accelerating means. - View Dependent Claims (17)
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18. A thin film deposition method comprising:
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preparing a thin film deposition system including a reaction chamber, at least one susceptor installed in the reaction chamber for mounting a substrate thereon, a first gas sprayer rotatably located above the susceptor, and at least one second gas sprayer installed above the first gas sprayer for spraying purge gas;
mounting the substrate on the susceptor in the reaction chamber;
spraying source gas and reaction gas onto the substrate through the rotated first gas sprayer; and
spraying purge gas onto the substrate through the second gas sprayer.
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Specification