Adhesive material and structures formed therewith

• US 20050241756A1
• Filed: 04/26/2005
• Published: 11/03/2005
• Est. Priority Date: 04/28/2004
• Status: Abandoned Application

• Current Assignee: Zephyros, Inc.
• Original Assignee: L&L Products Inc.
• Inventors: Harthcock, Matthew, Hable, Christopher
• Application Number:
  US11/114,631
• Publication Number:
  US 20050241756A1
• Time in Patent Office: Days
• US Class Current: 156/305
• CPC Class Codes: C08J 3/241 Preventing premature crosslinking by physical separation of components, e.g. encapsulation
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C09J 2301/408 additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 2433/00 Presence of (meth)acrylic polymer
• CPC Class Codes: C09J 2463/00 Presence of epoxy resin
• CPC Class Codes: C09J 2475/00 Presence of polyurethane
• CPC Class Codes: C09J 5/00 Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
• CPC Class Codes: C09J 5/06 involving heating of the applied adhesive

Abstract

An adhesive material includes a polymeric component and one or more curing agents. The adhesive material is typically activated to cure upon exposure to a stimulus such as pressure.

Claims

1. A method of forming a structure of an article of manufacture, the method comprising:

providing a first member and a second member of the structure;

locating an adhesive material between the first member and the second member wherein at least a portion of the adhesive material is located within encapsulations;

activating the adhesive material to cure between the first member and the second member by exposing the adhesive material to a stimulus that causes the encapsulations to fail.

2. A method as in claim 1 wherein the encapsulations fail by rupturing, flowing or melting.

3. A method as in claim 1 wherein the adhesive material includes a polymeric component and at least one curing agent and activating the adhesive material includes exposing the polymeric component to the at least one curing agent thereby causing the adhesive material to cure and adhere to the first member and the second member.

4. A method as in claim 3 wherein the polymeric component includes one or more polymeric compounds, which include an epoxy resin.

5. A method as in claim 4 wherein the at least one curing agent includes an amine, an amide, an isocyanate or a peroxide.

6. A method as in claim 5 wherein the at least one curing agent is at least about 1%, but less than about 60% by weight of the adhesive material.

7. A method as in claim 6 wherein the polymeric component is epoxy-based and the polymeric component is at least about 30%, but less than about 80% by weight of the adhesive material.

8. A method as in claim 7 wherein the first and second member are part of an airplane.

9. A method as in claim 8 wherein the first and second member are part of a wing of the airplane.

10. A method as in claim 1 wherein the first and second member are part of an airplane.

11. A method as in claim 10 wherein the first and second member are part of a wing of the airplane.

12. A method as in claim 11 wherein the first member is a rib and the second member is a panel.

17. A method as in claim 8 wherein:

i. the first and second member are part of a wing of an airplane;

ii. the polymeric component is epoxy-based;

iii. the at least one curing agent includes an amine, an amide or a peroxide

iv. the at least one curing agent is at least about 1%, but less than about 35% by weight of the adhesive material; and

v. the polymeric component is at least about 30%, but less than about 80% by weight of the adhesive material.

19. A method as in claim 8 wherein:

i. the first and second member are part of a wing of the airplane;

ii. the polymeric component is epoxy-based;

iii. the at least one curing agent includes an amine, an amide or a peroxide iv. the at least one curing agent is at least about 1%, but less than about 11% by weight of the adhesive material; and

v. the polymeric component is at least about 30%, but less than about 80% by weight of the adhesive material.

13. A method of forming a structure of an article of manufacture, the method comprising:

providing a first member and a second member of the structure;

locating an adhesive material between the first member and the second member, wherein;

i. the adhesive material includes at least one curing agent and a polymeric component; and

ii. multiple encapsulations encapsulate at least a portion of the polymeric material, the curing agent or both;

activating the adhesive material by applying pressure to the adhesive material such that the multiple encapsulations rupture thereby causing the adhesive material to cure between and adhere to the first member and the second member and form the structure.

14. A method as in claim 13 wherein the encapsulations are formed of a thermoplastic.

15. A method as in claim 13 wherein the pressure is at least 1 MPa.

16. A method as in claim 13 wherein the at least one curing agent can cure the polymeric component at a temperature below about 100°

C.

20. A method as in claim 13 wherein:

i. the encapsulations are formed of a thermoplastic;

ii. the pressure is at least 1 MPa; and

iii. the at least one curing agent can cure the polymeric component at a temperature below about 100°

C.

18. A method of forming a structure of a wing of an aircraft, the method comprising:

providing a first member and a second member of the structure of the wing of the aircraft, wherein;

i. the first member is a panel of the wing; and

ii. the second member is a rib of the wing;

locating an adhesive material between the first member and the second member, wherein;

i. the adhesive material includes at least one curing agent and a polymeric component; and

ii. multiple encapsulations encapsulate at least a portion of the polymeric material, the curing agent or both;

activating the adhesive material by compressing the adhesive material between the first member and the second member such that the multiple encapsulations rupture thereby causing the adhesive material to cure between and adhere to the first member and the second member and form the structure.