Pump, cooling system, and electronic apparatus

• US 20050241809A1
• Filed: 04/13/2005
• Published: 11/03/2005
• Est. Priority Date: 04/28/2004
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Sayano, Akio, Tomioka, Kentaro
• Application Number:
  US11/104,805
• Publication Number:
  US 20050241809A1
• Time in Patent Office: Days
• US Class Current: 165/104.330
• CPC Class Codes: F04D 29/026 especially adapted for liquid pumps
• CPC Class Codes: F04D 29/426 especially adapted for liquid pumps
• CPC Class Codes: F05D 2300/21 Oxide ceramics
• CPC Class Codes: F05D 2300/211 Silica
• CPC Class Codes: F05D 2300/51 Hydrophilic, i.e. being or having wettable properties
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A cooling pump includes a rotor including a rotation axis, a disc fixed with the rotation axis, an impeller fixed with the disc for pressurizing a liquid coolant, and a plurality of permanent magnets arrayed to be fixed with the disc in a ring shape; a case including a pump chamber holding the rotor rotatably, the pump chamber having an inlet and an outlet for the liquid coolant, wherein a part of the bottom wall forming the pump chamber is a heat-receiving portion; a cover including a recess, the cover sealing the case, i.e., pump housing, liquid-tightly; and a circular stator disposed in the recess, the stator generating a rotating magnetic field with a plurality of electromagnets to provide the rotor with torque around the rotation axis, wherein a hydrophilic surface is disposed on the inner surface of the pump chamber.

Claims

1. A pump comprising:

a housing including a pump chamber;

an impeller disposed in the pump chamber; and

a stator for rotating the impeller,

wherein an inner surface of the pump chamber includes a hydrophilic surface.

2. The pump according to claim 1, wherein the hydrophilic surface is a film mainly composed of a silicon oxide.

3. The pump according to claim 1, wherein the hydrophilic surface is a film mainly composed of a titanium oxide.

4. The pump according to claim 1, wherein the hydrophilic surface comprises a rough face.

5. The pump according to claim 1, wherein the pump housing comprises a metal case and a resin cover to be combined with the metal case, and the hydrophilic surface is provided on the inner surface of the metal case.

6. The pump according to claim 5, wherein the metal case comprises an outlet tube for discharging the liquid coolant and an inlet tube for sucking the liquid coolant, and the hydrophilic surface is provided on the inner surfaces of the outlet tube and the inlet tube.

7. The pump according to claim 6, wherein the metal case comprises the pump chamber and a reserve chamber, and the hydrophilic surface is provided on the inner surface of the reserve chamber.

8. An electronic apparatus comprising:

a casing;

a substrate disposed in the casing;

a heat generating unit mounted on the substrate; and

a cooling system thermally connected to the heat generating unit, the cooling system including

a radiator for dissipating the heat from the heat generating unit,

a circulation path for circulating a liquid coolant to the radiator, and

a pump for forcibly circulating the liquid coolant through the circulation path, the pump including

a housing including a pump chamber,

an impeller disposed in the pump chamber, and

a stator for rotating the impeller,

wherein an inner surface of the pump chamber includes a hydrophilic surface.

9. The electronic apparatus according to claim 8, wherein the hydrophilic surface is a film mainly composed of a silicon oxide.

10. The electronic apparatus according to claim 8, wherein the hydrophilic surface is a film mainly composed of a titanium oxide.

11. The electronic apparatus according to claim 8, wherein the hydrophilic surface comprises a rough face.

12. The electronic apparatus according to claim 8, wherein the housing comprises a metal case and a resin cover to be combined with the metal case, and the hydrophilic surface is provided on the inner surface of the metal case.

13. The electronic apparatus according to claim 12, wherein the metal case comprises an outlet tube for discharging the liquid coolant to the circulation path and an inlet tube for sucking the liquid coolant from the circulation path, and the hydrophilic surface is provided on the inner surfaces of the outlet tube and the inlet tube.

14. The electronic apparatus according to claim 13, wherein the metal case comprises the pump chamber and a reserve chamber, and the hydrophilic surface is provided on the inner surface of the reserve chamber.

15. A cooling system thermally connected to a heat generating unit, the cooling system comprising:

a radiator for dissipating the heat from the heat generating unit;

a circulation path for circulating a liquid coolant to the radiator; and

a pump for forcibly circulating the liquid coolant through the circulation path, the pump including

a housing including a pump chamber,

an impeller disposed in the pump chamber, and

a stator for rotating the impeller,

wherein an inner surface of the pump chamber includes a hydrophilic surface.

16. The cooling system according to claim 15, wherein the hydrophilic surface is a film mainly composed of a silicon oxide.

17. The cooling system according to claim 15, wherein the hydrophilic surface is a film mainly composed of a titanium oxide.

18. The cooling system according to claim 15, wherein the hydrophilic surface comprises a rough face.

19. The cooling system according to claim 15, wherein the housing comprises a metal case and a resin cover to be combined with the metal case, and the hydrophilic surface is provided on the inner surface of the metal case.

20. The cooling system according to claim 19, wherein the metal case comprises an outlet tube for discharging the liquid coolant to the circulation path and an inlet tube for sucking the liquid coolant from the circulation path, and the hydrophilic surface is provided on the inner surfaces of the outlet tube and the inlet tube.