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Selective catalytic activation of non-conductive substrates

  • US 20050241951A1
  • Filed: 02/03/2005
  • Published: 11/03/2005
  • Est. Priority Date: 04/30/2004
  • Status: Abandoned Application
First Claim
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1. A method of plating on a non-conductive substrate, the method comprising the steps of:

  • a) applying a catalytic ink to at least a portion of a surface of the non-conductive substrate, wherein the catalytic ink comprises;

    i) a solvent;

    ii) a source of catalytic metal ions;

    iii) a crosslinking agent;

    iv) a copolymer; and

    v) a polyurethane polymer;

    b) reducing the source of catalytic metal ions to its associated metal with a suitable reducing agent; and

    c) plating metal on the catalytic ink applied to the portion of the surface of the non-conductive substrate.

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