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Monitored medication package

  • US 20050241983A1
  • Filed: 04/01/2005
  • Published: 11/03/2005
  • Est. Priority Date: 03/10/2003
  • Status: Abandoned Application
First Claim
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1. A medication package comprising:

  • a blister pack defining a plurality of bubble chambers therein, each adapted to receive a dose of medication;

    a layer composed of a frangible material covering said plurality of bubble chambers;

    a insulating layer of an electrically non-conductive material disposed on said layer of frangible material, said insulating layer defining a plurality of holes therein corresponding to said plurality of bubble chambers; and

    a circuit board disposed on said insulating layer opposite said frangible layer, said circuit board defining a plurality of holes therein corresponding to said plurality of holes defined in said insulating layer and said bubble chambers, wherein each of said plurality of holes in said circuit board is surrounded by an electrically conductive trace;

    wherein said holes in said insulating layer are slightly larger than said holes in said circuit board, such that said electrically conductive traces surrounding said holes in said circuit board are exposed when said circuit board and said insulating layer are in contact with each other.

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