Electrical circuits with button plated contacts and assembly methods

• US 20050242160A1
• Filed: 04/30/2004
• Published: 11/03/2005
• Est. Priority Date: 04/30/2004
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Soh, Wei Hong, Nippa, Kinya
• Granted Patent: US 7,311,240 B2
• Time in Patent Office: Days
• US Class Current: 228/180.210
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/09736 Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 2201/10666 Plated through-hole for surface mounting on PCB
• CPC Class Codes: H05K 2203/0545 Pattern for applying drops or paste; Applying a pattern made of drops or paste using thick film techniques to apply conductive material by using a substrate with a shape pattern H05K3/1258
• CPC Class Codes: H05K 3/363 by soldering
• CPC Class Codes: H05K 3/42 Plated through-holes or plated via connections

Abstract

Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one button attached to it. The button has a desired height above a surface of the article to which it is attached. The second article has a quantity of solder located in a position where the solder joint is to be formed. A heat source is applied until the quantity of solder liquefies. The heat source is removed until the solder solidifies with a uniform thickness approximately equal to the height of the button.

Claims

1. A method for making a solder joint, the method comprising the steps of:

positioning a first article and a second article to be soldered together, at least one of said first article and said second article having at least one button attached thereto, said at least one button having a desired height above a surface of said article to which it is attached, said second article having a quantity of solder located thereon in a position where the solder joint is to be formed;

applying a heat source and heating said articles until said quantity of solder liquefies; and

removing said heat source until said solder solidifies, said solder having a uniform thickness approximately equal to said height.

2. The method of claim 1, further comprising a step for using said heat source to apply pressure to said articles when said heat source heats said articles.

3. The method of claim 1, wherein said at least one button comprises any one of copper, a copper alloy, steel, aluminum, and an aluminum alloy.

4. The method of claim 3, wherein said first article comprises a printed circuit board.

5. The method of claim 4, wherein said second article comprises a flexible circuit.

6. The method of claim 1, wherein said first article comprises a printed circuit board.

7. The method of claim 6, wherein said second article comprises a flexible circuit.

8. The method of claim 1, wherein said solder forms a solder joint, and wherein said solder joint contains a through hole.

9. The method of claim 1, further comprising a plurality of buttons attached to said second article.

10. A method for making a solder joint, the method comprising the steps of:

positioning a first article and a second article to be soldered together, said first article having at least one button attached thereto, said at least one button having a desired height above a surface of said first article, said second article having a quantity of solder located thereon in a position where the solder joint is to be formed;

applying a heat source and heating said articles until said quantity of solder liquefies; and

removing said heat source until said solder solidifies, said solder having a uniform thickness approximately equal to said height.

11. The method of claim 10, further comprising a step for using said heat source to apply pressure to said articles when said heat source heats said articles.

12. The method of claim 10, wherein said at least one button comprises any one of copper, a copper alloy, steel, aluminum, and an aluminum alloy.

13. The method of claim 12, wherein said first article comprises a printed circuit board.

14. The method of claim 13, wherein said second article comprises a flexible circuit.

15. The method of claim 10, wherein said first article comprises a printed circuit board.

16. The method of claim 15, wherein said second article comprises a flexible circuit.

17. The method of claim 10, wherein said solder forms a solder joint, and wherein said solder joint contains a through hole.

18. The method of claim 10, further comprising a plurality of buttons attached to said first article.

19. A method for connecting a flexible circuit to a device, the method comprising the steps of:

placing a quantity of solder between said flexible circuit and said device, said flexible circuit containing at least one button having a height above a surface of said flexible circuit;

applying a heat source and heating at least one of said flexible circuit and said device until said quantity of solder liquefies; and

removing said heat source until said solder solidifies, said solder having a uniform thickness approximately equal to said height.

20. The method of claim 19, further comprising a step for using said heat source to apply pressure to said flexible circuit and said device when said heat source heats said flexible circuit and said device.

21. The method of claim 19, wherein said at least one button comprises any one of copper, a copper alloy, steel, aluminum, and an aluminum alloy.

22. The method of claim 21, wherein said device comprises a printed circuit board.

23. The method of claim 19, wherein said solder forms a solder joint, and wherein said solder joint contains a through hole.

24. The method of claim 19, further comprising a plurality of buttons attached to said first article.