Packaging techniques for a high-density power converter

• US 20050242913A1
• Filed: 07/08/2005
• Published: 11/03/2005
• Est. Priority Date: 03/11/2002
• Status: Active Grant

• Current Assignee: Drue Nicholson, Roger Hooey
• Original Assignee: Drue Nicholson, Roger Hooey
• Inventors: Nicholson, Drue, Hooey, Roger
• Granted Patent: US 7,474,185 B2
• Time in Patent Office: Days
• US Class Current: 336/55
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/22 Cooling by heat conduction through solid or powdered fillings
• CPC Class Codes: H01F 27/266 Fastening or mounting the core on casing or support on coil H01F27/30
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/0254 High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection electrostatic discharge protection for electric apparatus in general H05K9/0067, H05K9/0079; Arrangements for regulating voltages or for using plural voltages
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A high-density power converter that benefits from improved packaging techniques and thermal handling capability is provided. The power converter includes a magnetic core. The converter further includes a printed circuit board providing at least one cutout for receiving a portion of the magnetic core. A circuit is magnetically coupled to the magnetic core. A stopper is configured at an edge of the cutout proximate to the circuit to hold the magnetic core at a predefined distance relative to the circuit, thereby meeting a safety distance requirement between the core and the circuit. Advanced thermal management is provided by way of a heatsink assembly to enhance the thermal-handling capability of the converter.

Claims

1. A power converter comprising:

a printed circuit board configured to support on one side thereof heat-generating components of the power converter; and

a baseplate for transferring heat from the heat-generating components, the baseplate comprising a surface thermally coupled to the heat-generating components therein, the surface of the baseplate configured to have a varying profile to generally match the profile of the heat-generating components on the one side of the printed circuit board.

2. The power converter of claim 1 further comprising thermal interface material between the baseplate and the printed circuit board.

3. The power converter of claim 1 further comprising studs for mechanically connecting the baseplate to the printed circuit board.

4. The power converter of claim 3 wherein the studs are integrally constructed with the baseplate.

5. The power converter of claim 1 wherein the baseplate further comprises fins to serve as a heatsink.

6. The power converter of claim 5 wherein some of the fins have their respective roots positioned relatively closer to respective heat-generating components of the power converter, thereby providing a closer thermal path for discharging heat from the heat-generating components.