Light emitting diode array module for providing backlight and backlight unit having the same

• US 20050243576A1
• Filed: 07/14/2004
• Published: 11/03/2005
• Est. Priority Date: 05/03/2004
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Park, Young Sam, Park, Jung Kyu, Kim, Chang Wook
• Granted Patent: US 7,217,004 B2
• Time in Patent Office: Days
• US Class Current: 362/612
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

The present invention provides a Light Emitting Diode (LED) array module for providing backlight, which can be used as an independent device with a plurality of LEDs being integrally packaged, and which can be universally used regardless of a screen size, and a backlight unit having the same. The LED array module used as a light source of backlight includes a bar-shaped Printed Circuit Board (PCB) on which conductive patterns for transmitting power are formed, a base formed on the PCB and made of a heat conductive material, a plurality of LED chips mounted on the base in a line and electrically connected to the conductive patterns of the PCB, a reflector formed to surround the plurality of the LED chips and adapted to reflect light radiated from the plurality of LED chips upward, and a lens formed above the plurality of LED chips and reflector to have a bar shape and adapted to diffuse the light radiated from the plurality of LED chips and reflector in a horizontal direction.

Claims

1. A Light Emitting Diode (LED) array module used as a light source of backlight, comprising:

a bar-shaped Printed Circuit Board (PCB) on which conductive patterns for transmitting power are formed;

a base formed on the PCB and made of a heat conductive material;

a plurality of LED chips mounted on the base in a line and electrically connected to the conductive patterns of the PCB;

a reflector formed to surround the plurality of the LED chips and adapted to reflect light radiated from the plurality of LED chips upward; and

a lens formed above the plurality of LED chips and reflector to have a bar shape and adapted to diffuse the light radiated from the plurality of LED chips and reflector in a horizontal direction.

2. The LED array module as set forth in claim 1, wherein the plurality of LED chips each radiate one of red, green and blue light.

3. The LED array module as set forth in claim 1, wherein the lens has a structure that allows light to be diffused along a longitudinal direction of the module.

4. The LED array module as set forth in claim 1, further comprising an encapsulant made of a transparent soft material to cover and protect the plurality of LED chips.

5. The LED module as set forth in claim 4, wherein the lens is formed to be integrated with the encapsulant.

6. The LED module as set forth in claim 4, wherein the encapsulant is made of a material in which resin and a dispersant are mixed together.

7. A backlight unit for a display device, wherein a plurality of LED array modules set forth in claim 1 are arranged in a plurality of rows and columns, the LED array modules being arranged at regular intervals in each of the rows, each of LED array modules in a first row being located to face a space between two adjacent LED array modules in a second row in a relationship of two adjacent rows.