Cantilevered micro-electromechanical switch array

• US 20050244099A1
• Filed: 03/23/2005
• Published: 11/03/2005
• Est. Priority Date: 03/24/2004
• Status: Abandoned Application

• Current Assignee: Seertech Corporation
• Original Assignee: Seertech Corporation
• Inventors: Seki, Hajime, Pasch, Nicholas F., Sanders, Glenn C.
• Application Number:
  US11/088,390
• Publication Number:
  US 20050244099A1
• Time in Patent Office: Days
• US Class Current: 385/18
• CPC Class Codes: B81B 7/04 Networks or arrays of similar microstructural devices
• CPC Class Codes: H01H 2001/0063 having electrostatic latches, i.e. the activated position is kept by electrostatic forces other than the activation force
• CPC Class Codes: H01H 2001/0073 Solutions for avoiding the use of expensive silicon technologies in micromechanical switches
• CPC Class Codes: H01H 59/0009 making use of micromechanics

Abstract

A flexible micro-electromechanical switch having a cantilevered platform for forming an electrical circuit. A latching mechanism maintains the platform in a biased position after the biasing voltage is removed. The flexible micro-electromechanical switch can be formed into large area arrays and used as the backplane of display devices.

Claims

1. A micro electromechanical device comprising:

a base layer having a conductive trace and at least one contact and a flexible cantilevered platform having a conductive trace and at least one contact aligned with said base layer conductive trace and contact;

said base layer and said cantilevered platform maintained in a spaced apart by a spacer layer if no bias is applied to said conductive traces and in mechanical engagement at one portion of said cantilevered platform when a bias is applied to said conductive traces; and

a latching mechanism for maintaining said cantilevered platform in mechanical engagement with said base layer after said bias is removed.

2. The micro electromechanical device of claim 1 wherein said base layer, support layer and cantilevered platform are bonded together to form a composite switch.

3. The micro electromechanical device of claim 2 further comprising a plurality of said composite switches arranged in an array.

4. The micro electromechanical device of claim 1 wherein said cantilevered platform comprises a plastic foil having a suspended portion and a portion attached to said support layer.

5. The micro electromechanical device of claim 1 wherein said cantilevered platform comprises a plastic foil having a suspended portion attached to said support layer.

6. The micro electromechanical device of claim 1 wherein said cantilevered platform further comprises balance metal.

7. The micro electromechanical device of claim 6 wherein said cantilevered platform is cut from a flexible sheet, said flexible sheet selected from a foil of either PET or polymide.

9. A micro electromechanical device comprising:

a base layer having a conductive trace and at least one contact and a flexible layer having a conductive trace and at least one contact on an opposing side of said flexible layer, said conductive trace and contact aligned with said base layer conductive trace and contact;

said base layer and said flexible layer at least partially maintained in a spaced apart by a spacer layer and bonded together to form a composite switch, said flexible layer having a cantilevered platform separated from said flexible layer by a gap such that, said cantilevered platform is maintained in a spaced apart relationship if no bias is applied to said conductive traces and in mechanical engagement at least a portion of said cantilevered platform when a bias is applied to said conductive traces.

8. The micro electromechanical device of claim 10 wherein said base layer selected from a sheet of PET or polymide.

10. The micro electromechanical device of claim 9 wherein a plurality of said devices arranged in a plurality of rows and columns.

11. The micro electromechanical device of claim 10 further comprising:

a first driver circuit for controlling a bias across one of said plurality of columns;

a second driver circuit for controlling a bias across each of said plurality of rows to selectively bias said cantilevered platform; and

a third driver circuit for selectively latching said biased platforms in a column after said first driver circuit changes the bias across said one of said plurality of columns, such that said biased platforms remain in mechanical contact with said base layer.

12. The micro electromechanical device of claim 9 wherein said flexible sheet comprises a continuous flexible sheet having said cantilevered platform separated therefrom by laser ablation.

13. The micro electromechanical device of claim 12 wherein said flexible sheet is selected from a foil of PET or polymide.

14. The micro electromechanical device of claim 13 wherein said cantilevered platform further comprises balance metal.

15. A backplane array of switches comprising:

a plurality of composite switches arranged in rows and columns, each of said switches having a base layer and a flexible cantilevered platform at least partially maintained in a spaced apart by a spacer layer;

each of said switches having bias means for controlling said cantilevered platform such that, said cantilevered platform is maintained in a spaced apart relationship if no bias is applied to said conductive traces and in mechanical engagement at least a portion of said cantilevered platform when a bias is applied to said conductive traces;

each of said switches having at least two contacts for forming an electrical circuit when said cantilevered platform is mechanical engagement;

a first driver circuit for controlling a bias across one of said plurality of columns;

a second driver circuit for controlling a bias across each of said plurality of rows to selectively bias said cantilevered platform;

a third driver circuit for selectively latching said biased platforms in a column after said first driver circuit changes the bias across said one of said plurality of columns, such that said biased platforms remain in mechanical contact with said base layer; and

means for biasing a display medium.

16. The backplane array of switches of claim 15 further comprising a front plane having OLED display material.

17. The backplane array of switches of claim 16 further comprising a latching mechanism for displaying an image without refresh scans.

18. The backplane array of switches of claim 15 further comprising a front plane having OLED display material biased at a constant voltage.

19. The backplane array of switches of claim 15 further comprising a front plane having OLED display material biased at continuous intermediate level of brightness.

20. The backplane array of switches of claim 15 further comprising a large area display having a front plane comprising an OLED display material.

21. The backplane array of switches of claim 15 wherein said large area display comprises an area of at least one square meter.

22. The backplane array of switches of claim 15 wherein said cantilevered platform further comprises balance metal.

23. The backplane array of switches of claim 15 wherein said cantilevered platform is cut from a flexible sheet, said flexible sheet selected from a foil of either PET or polymide.