Pump, cooler, and electronic device

• US 20050244292A1
• Filed: 03/17/2005
• Published: 11/03/2005
• Est. Priority Date: 04/28/2004
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tomioka, Kentaro, Hata, Yukihiko
• Application Number:
  US11/082,301
• Publication Number:
  US 20050244292A1
• Time in Patent Office: Days
• US Class Current: 417/423.700
• CPC Class Codes: F04D 29/026 especially adapted for liquid pumps
• CPC Class Codes: F04D 29/426 especially adapted for liquid pumps
• CPC Class Codes: F05D 2300/43 Synthetic polymers, e.g. plastics; Rubber
• CPC Class Codes: F05D 2300/615 Filler

Abstract

According to one embodiment, a pump housing comprises a heat receiving plate which is thermally coupled to a CPU, and a pump chamber. An impeller to be rotated by a motor is provided in the pump chamber. At least a part of the pump housing is made of resin containing at least one of metal filler, filler of material having lower linear expansion coefficient than the resin, and filler of material having lower water-vapor transmissivity than the resin.

Claims

1. A pump comprising:

an impeller; and

a pump housing coupled to the impeller, the pump housing comprises a plurality of components including a housing body coupled to a first cover, at least one component of the plurality of components being made of a resin containing at least one of (i) a metal filler, (ii) a filler of material having lower linear expansion coefficient than the resin, and (iii) a filler of material having a lower water-vapor transmissivity than the resin.

2. A pump according to claim 1, wherein the first cover of the pump housing being made of the resin.

3. A pump according to claim 2, wherein the plurality of components of the pump housing further comprise a main-body primary portion and a heat receiving plate thermally coupled to the main-body primary portion, the main-body primary portion also being made of the resin.

4. A pump according to claim 1, wherein the plurality of components of the pump housing further comprise a main-body primary portion and a heat receiving plate thermally coupled to the main-body primary portion, the main-body primary portion being made of the resin.

5. A pump according to claim 1, wherein the plurality of components of the pump housing comprise a main-body primary portion and a heat receiving plate thermally coupled to the main-body primary portion, the heat receiving plate being made of the resin.

6. A pump according to claim 1, wherein the impeller is situated within a recessed portion formed within an interior of the pump housing with the first cover of the pump housing covering an opening of the recessed portion.

7. A pump according to claim 1 further comprising a motor adapted to rotate the impeller.

8. A pump according to claim 7, wherein the motor comprises a rotor positioned within the housing body and a stator positioned coaxially inside the rotor to produce a magnetic field causing rotation of the impeller.

9. A pump according to claim 1, wherein the at least one component of the plurality of components is made of the resin including of a non-metal filler having a lower linear expansion coefficient than the resin.

10. A pump according to claim 1, wherein the at least one component of the plurality of components is made of the resin including of a non-metal filler having a lower water-vapor transmissivity than the resin.

11. A pump according to claim 1, wherein the at least one component of the plurality of components is made of the resin containing the metal filler having a lower water-vapor transmissivity than the resin.

12. A cooler comprising:

a heat radiation portion;

a pump to forcibly circulate coolant to the heat radiation portion, the pump including a pump housing and an impeller rotationally coupled to the pump housing, the pump housing comprises a plurality of components including (a) a first cover, (b) a main-body primary portion coupled to the first cover and including an input conduit and an outlet conduit, and (c) a heat receiving plate thermally coupled to the main-body primary portion, where at least two of the first cover, the main-body primary portion and the heat receiving plate being made of a resin containing at least one of (i) a metal filler, (ii) a filler of material having lower linear expansion coefficient than the resin, and (iii) a filler of material having a lower water-vapor transmissivity than the resin;

a first piping coupled to the outlet conduit of the pump and the heat radiation portion, the first piping to route the coolant heated at the pump to the heat radiation portion; and

a second piping coupled to the inlet conduit of the pump and the heat radiation portion, the second piping to route the coolant cooled by the heat radiation portion to the pump.

13. A cooler according to claim 12, wherein the heat radiation portion comprising:

a third piping including a first opening coupled to the first piping and a second opening coupled to the second piping; and

a plurality of heat radiation fins thermally coupled with the third piping.

14. A cooler according to claim 12, wherein the first cover and the main-body primary portion of the pump housing are made of the resin.

15. A cooler according to claim 12, wherein the pump further comprises a motor adapted to rotate the impeller.

16. A pump according to claim 12, wherein the at least two of the first cover, the main-body primary portion and the heat receiving plate are made of the resin containing the metal filler and the metal filler having a lower linear expansion coefficient than the resin.

17. A pump according to claim 12, wherein the at least two of the first cover, the main-body primary portion and the heat receiving plate are made of the resin containing the metal filler and the metal filler having a lower water-vapor transmissivity than the resin.

18. An electronic device comprising:

a heat generating unit implemented within a first housing; and

a cooler comprises a pump including a pump housing and an impeller rotationally coupled to the pump housing for circulating coolant, the pump housing including

a cover being made of a resin containing at least one of (i) a metal filler, (ii) a filler of material having lower linear expansion coefficient than the resin, and (iii) a filler of material having a lower water-vapor transmissivity than the resin, including an input conduit and an outlet conduit, and

a main-body primary portion coupled to the cover being made of the resin.

19. An electronic device according to claim 18, wherein the cooler further comprises:

a heat radiation portion including a piping including a first opening and a second opening, and a plurality of heat radiation fins thermally coupled to the piping;

a first piping coupled between (i) an outlet conduit placed within the main-body primary portion of the pump and (ii) the first opening of the piping of the heat radiation portion, the first piping to route the coolant heated at the pump to the piping; and

a second piping coupled to (i) an inlet conduit placed within the main-body primary portion of the pump and (ii) the second opening of the piping of the heat radiation portion, the second piping to route the coolant cooled by the plurality of heat radiation fins to the pump.

20. An electronic device according to claim 18, wherein the pump of the cooler further comprises a motor adapted to rotate the impeller.