Hearing implant with MEMS inertial sensor and method of use

• US 20050245990A1
• Filed: 04/28/2004
• Published: 11/03/2005
• Est. Priority Date: 04/28/2004
• Status: Abandoned Application

• Current Assignee: Joseph Roberson
• Original Assignee: Joseph Roberson
• Inventors: Roberson, Joseph
• Application Number:
  US10/833,424
• Publication Number:
  US 20050245990A1
• Time in Patent Office: Days
• US Class Current: 607/57
• CPC Class Codes: A61N 1/36036 of the outer, middle or inner ear
• CPC Class Codes: A61N 1/36038 Cochlear stimulation

Abstract

An implant device for treating hearing disorders. In one exemplary embodiment, an implant body is dimensioned for attachment to the ossicular chain of a patient. The implant body carries a micro-encapsulated MEMS inertial sensing device that is electrically coupled by a micro-cable to an implantable signal processing system. The MEMS inertial sensor is capable of directly sensing acoustic waves transmitted through the ossicular chain. Signals from the inertial sensor are sent to the signal processing system for filtering, conditioning and amplification to thereafter be carried to a plurality of electrodes carried by a cochlear implant.

Claims

1. An implant body for coupling to middle or inner ear structure, the body carrying a wafer scale inertial sensor having a piezoresistive-doped cantilever coupled to a seismic mass for detecting acoustic waves in the ear structure.

2. An implant body as in claim 1 further comprising signal circuitry coupling the piezoresistive-doped cantilever to a signal processor.

3. An implant body as in claim 2 further comprising a cochlear implant portion coupled by circuitry to the signal processor.

4. An ossicular implant comprising an inertial sensor chip that defines a flexure coupled to a suspended mass, the flexure carrying a piezoresistive element coupled to signal circuitry that extends to an off-chip signal processor for sensing acoustic waves in middle ear structure.

5. The ossicular implant as in claim 4 further comprising a cochlear implant coupled by circuitry to the signal processor.

6. A sensor for implantation in ear structure comprising at least one wafer scale deflectable flexure portion coupled to a suspended mass portion wherein the flexure carries a piezoelectric element.

7. The sensor as in claim 6 further comprising signal circuitry coupling the piezoelectric element to a signal processor.

8. The sensor as in claim 7 further comprising a cochlear implant coupled by circuitry to the signal processor.

9. An implant for treating hearing disorders comprising an implant body of a biocompatible material for coupling to hearing structure between and including the eardrum and the cochlea, and a micro-fabricated sensor system within the implant body comprising a deflectable cantilever coupled to a suspended mass, a portion of the cantilever doped with a piezoelectric or piezoresistive material.

10. A method for treating a hearing disorder of a human patient, comprising the steps of;

(a) providing an implant body that carries at least one wafer scale inertial sensor having a piezoresistive-doped flexure coupled to a suspended mass; and

(b) acquiring input signals of acoustic pressure waves within middle or inner ear structure by detecting changes in resistance to current flow through each piezoresistive-doped flexure during deflection of the flexure and suspended mass in response to acoustic displacements.

11. A method as in claim 10 wherein step (b) acquires input signals associated with acoustic displacements in a single axis.

12. A method as in claim 10 wherein step (b) acquires input signals associated with acoustic displacements in two axes.

13. A method as in claim 10 wherein step (b) acquires input signals associated with acoustic displacements in three axes.

14. A method as in claim 10 further comprising the step of processing the input signals with a signal processor.

15. A method as in claim 11 further comprising the step of filtering the input signals.

16. A method as in claim 11 further comprising the step of amplifying the input signals.

17. A method as in claim 11 further comprising the step of digitizing the input signals.

18. A method as in claim 11 further comprising the step of utilizing the signal processor to provide coded output signals for delivery to a cochlear implant.

19. A method as in claim 11 further comprising the step of utilizing the signal processor to provide output signals to deliver electrical energy to an electrode array carried by a cochlear implant to stimulate auditory nerve fibers in the cochlea.

20. A method as in claim 11 further comprising the step of utilizing the signal processor to provide output signals to deliver electrical energy to an electrode array carried by a cochlear implant to stimulate auditory nerve fibers in the cochlea.

21. A method for treating a hearing disorder of a human patient, comprising the steps of;

(a) coupling an implant body to middle ear structure that carries a wafer scale inertial sensor with a flexure coupled to a suspended mass, the flexure carrying a piezoelectric element;

(b) permitting acoustic waves to deflect the flexure and suspended mass; and

(c) detecting electrical current flow from the piezoelectric element to thereby provide input signals of the acoustic pressure waves.

22. A method as in claim 21 wherein step (c) detects pressure waves along a single axis.

23. A method as in claim 21 wherein step (c) detects pressure waves along multiple axes.

24. A method as in claim 21 further comprising the step of processing the input signals with a signal processor and transmitting output signals to a cochlear implant.