Organic electroluminescence device

• US 20050248272A1
• Filed: 05/02/2005
• Published: 11/10/2005
• Est. Priority Date: 05/07/2004
• Status: Abandoned Application

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Kanai, Masahiro, Koike, Atsushi, Mitsui, Mutsuo
• Application Number:
  US11/119,488
• Publication Number:
  US 20050248272A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 59/871 Self-supporting sealing arrangements
• CPC Class Codes: H10K 59/8721 Metallic sealing arrangements
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/874 including getter material or desiccant

Abstract

The present invention provides an excellent organic EL device with a glass substrate and a sealing glass sheet which are thinned for weight reduction while avoiding lowering the durability and impact resistance of the device. The organic luminescence device is characterized in that sealing is performed at the space between a face of the sealing glass sheet along the outer edge and a face of the device substrate with a low melting point metal.

Claims

1. An organic electroluminescence device including an organic luminescence element portion having a pair of electrodes and an organic conductive layer placed between the pair of electrodes, and a substrate carrying the organic luminescence element portion thereon, comprising a sealing member covering the organic luminescence element portion,

wherein no adhesive as an interstitial object is provided on a surface at which the sealing member and the organic luminescence element portion are in contact with each other, and

wherein a low melting point metal fixes the sealing member to the substrate along an outer periphery of the sealing member.

2. The organic electroluminescence device according to claim 1, wherein a passivation layer containing at least silicon is placed between the sealing member and the substrate.

3. The organic electroluminescence device according to claim 1, wherein a laminated structure of a passivation layer containing at least silicon and a moisture absorption layer is placed between the sealing member and the substrate.