Copper foil for high-density ultra-fine printed wiring board

• US 20050249927A1
• Filed: 07/13/2005
• Published: 11/10/2005
• Est. Priority Date: 09/22/2000
• Status: Active Grant

• Current Assignee: Furukawa Electric Company Limited
• Original Assignee: Circuit Foil Japan Company Limited
• Inventors: Hoshino, Kazuhiro, Fukuda, Shin, Suzuki, Akitoshi, Nakaoka, Tadao
• Granted Patent: US 7,175,920 B2
• Time in Patent Office: Days
• US Class Current: 428/209
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: C25D 1/04 Wires; Strips; Foils
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 7/0614 Strips or foils
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: Y10T 428/12431 Foil or filament smaller than 6 mils
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/12514 One component Cu-based
• CPC Class Codes: Y10T 428/12535 with additional, spatially distinct nonmetal component
• CPC Class Codes: Y10T 428/12569 Synthetic resin
• CPC Class Codes: Y10T 428/12611 Oxide-containing component
• CPC Class Codes: Y10T 428/12771 Transition metal-base component
• CPC Class Codes: Y10T 428/12861 Group VIII or IB metal-base component
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31678 Of metal
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

The present invention is to provide an ultra-thin copper foil with a carrier which comprises a release layer, a diffusion preventive layer and a copper electroplating layer laminated in this order, or a diffusion preventive layer, a release layer and a copper electroplating layer laminated in this order on the surface of a carrier foil, wherein a surface of the copper electroplating layer is roughened; a copper-clad laminated board comprising the ultra-thin copper foil with a carrier being laminated on a resin substrate; a printed wiring board comprising the copper-clad laminated board on the ultra-thin copper foil of which is formed a wiring pattern; and a multi-layered printed wiring board which comprising a plural number of the above printed wiring board being laminated.

Claims

1. (canceled)

2. An ultra-thin copper foil with a carrier foil which comprises a diffusion preventive layer, a release layer and an ultra-thin copper foil formed by copper electroplating, laminated in this order on a surface of the carrier foil.

3. The ultra-thin copper foil with a carrier foil according to claim 2, wherein the release layer is a chromium layer or a chromium hydrated oxide layer.

6. The ultra-thin copper foil with a carrier foil according to claim 2, wherein the diffusion preventive layer comprises at least one metal selected from the group consisting of nickel, cobalt, iron, chromium, molybdenum, tungsten, copper, aluminum and phosphorus, and is a layer of single metal, an alloy layer of two or more metals or a layer of at least one metal oxide.

8. The ultra-thin copper foil with a carrier foil according to claim 2, wherein the carrier foil is a foil of copper or copper alloy.

9. The ultra-thin copper foil with a carrier foil according to claim 2, wherein the carrier foil is an electrodeposited copper foil, an electrodeposited copper alloy foil, a rolled copper foil or a rolled copper alloy foil.

10. The ultra-thin copper foil with a carrier foil according to claim 2, wherein a surface of the carrier foil is a matte side or a shiny side of an untreated electrodeposited copper foil or an untreated electrodeposited copper alloy foil.

11. The ultra-thin copper foil with a carrier foil according to claim 2, wherein the carrier foil is a foil in which the matte side or the shiny side of an untreated electrodeposited copper foil or an untreated electrodeposited copper alloy foil is subjected to roughening treatment.

12. The ultra-thin copper foil with a carrier foil according to claim 2, wherein the carrier foil is a foil in which at least one of a roll finished surface of a rolled copper foil or a rolled copper alloy foil is subjected to roughening treatment.

13. The ultra-thin copper foil with a carrier foil according to claim 11, wherein the roughening treatment is to roughen the surface by chemical or electrochemical method or to attach roughening particles by electroplating.

14. The ultra-thin copper foil with a carrier foil according to claim 13, wherein a particle size of the roughening treatment according to the electroplating is 5 μ

m or less.

15. The ultra-thin copper foil with a carrier foil according to claim 2, wherein the ultra-thin copper foil is a foil having a thickness of 12 μ

m or less.

16. The ultra-thin copper foil with a carrier foil according to claim 2, wherein the carrier foil is a foil having a thickness of 1 mm or less.

17. The ultra-thin copper foil with a carrier foil according to claim 16, wherein the carrier foil is a foil having a thickness of 7 μ

m to 70 μ

m.

18. The ultra-thin copper foil with a carrier foil according to claim 11, wherein a surface of the ultra-thin copper foil subjected to roughening treatment is subjected to at least one treatment selected from a metal plating other than copper plating, chromate treatment and silane coupling agent treatment.

19. The ultra-thin copper foil with a carrier foil according to claim 11, wherein a surface of the ultra-thin copper foil subjected to roughening treatment is covered by an insulating resin layer at a B-stage state.

20. A copper-clad laminated board comprising the ultra-thin copper foil with a carrier foil according to claim 2 being laminated on a resin substrate.

21. The copper-clad laminated board according to claim 20, wherein the carrier foil is peeled off from the ultra-thin copper foil with a carrier of the copper-clad laminated board.

22. A printed wiring board comprising the copper-clad laminated board according to claim 21 on the ultra-thin copper foil of which is formed a wiring pattern.

23. A multi-layered printed wiring board which comprising a plural number of printed wiring board according to claim 22 being laminated.

24. A multi-layered printed wiring board which comprises the ultra-thin copper foil with a carrier foil according to claim 2 being laminated on at least one surface of an inner plate to which a wiring pattern had previously been formed to form a copper-clad laminated board, the ultra-thin copper foil being exposed by peeling off the carrier foil from the copper-clad laminated board, and a plural number of printed wiring boards on the ultra-thin copper foil of which being formed a wiring pattern being laminated.

25. The ultra-thin copper foil with a carrier foil according to claim 2, wherein a surface of the ultra-thin copper foil is roughened.

4-5. -5. (canceled)

7. (canceled)