Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
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Abstract
A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.
29 Citations
50 Claims
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1-42. -42. (canceled)
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43. A method of manufacturing a power amplification module comprising the steps of:
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(a) preparing a plurality of wiring substrates;
(b) inspecting the wiring substrates;
(c) affixing a defect mark to a defective wiring substrate out of the plurality of wiring substrates; and
(d) mounting a chip for a passive element or a chip for an active element onto one of the wiring substrates on which the defect mark is not affixed. - View Dependent Claims (46)
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- 44. The method of manufacturing a power amplification module according to claim 44, wherein the power amplification module is an RF power module.
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47. A method of manufacturing a power amplification module having a passive element and a semiconductor chip, comprising the steps of:
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(a) preparing a wiring substrate having a first terminal and a second terminal;
(b) printing a first solder material to the first terminal;
(c) applying a second solder material by potting to the second terminal;
(d) after the step (b), disposing the passive element over the first terminal;
(e) after the step (c), disposing the semiconductor chip over the second terminal; and
(f) after the steps (d) and (e), performing a reflow of the first and second solder materials. - View Dependent Claims (48, 49, 50)
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Specification