DRAM cell arrangement with vertical MOS transistors

• US 20050253180A1
• Filed: 06/22/2005
• Published: 11/17/2005
• Est. Priority Date: 05/29/2001
• Status: Active Grant

• Current Assignee: Polaris Innovations Limited (Wi-LAN Inc.)
• Original Assignee: Qimonda AG (Infineon Technologies AG)
• Inventors: Lee, Brian S., Schlosser, Till
• Granted Patent: US 7,329,916 B2
• Time in Patent Office: Days
• US Class Current: 257/302
• CPC Class Codes: H10B 12/033 the capacitor extending over the transistor
• CPC Class Codes: H10B 12/036 the capacitor extending under the transistor
• CPC Class Codes: H10B 12/053 the transistor being at least partially in a trench in the substrate vertical transistor in combination with a capacitor formed in a substrate trench H10B12/0383

Abstract

The invention is related to a DRAM cell arrangement with vertical MOS transistors. Channel regions arranged along one of the columns of a memory cell matrix are parts of a rib which is surrounded by a gate dielectric layer. Gate electrodes of the MOS transistors belonging to one row are parts of a strip-like word line, so that at each crossing point of the memory cell matrix there is a vertical dual-gate MOS transistor with gate electrodes of the associated word line formed in the trenches on both sides of the associated rib.

Claims

1. A DRAM cell arrangement with vertical MOS transistors, comprising:

a matrix of memory cells defined by a plurality of spaced-apart parallel word lines and a plurality of spaced-apart parallel ribs disposed in a cross-wise direction with respect to the word lines, wherein a memory cell is defined at each cross point defined by an intersection of a word line and a rib, wherein each memory cell comprises a vertical dual-gate MOS transistor each comprising;

an upper source/drain region, a lower source/drain region and a channel region disposed between the source/drain regions;

wherein the channel region is formed in one of the ribs; and

a pair of gate electrodes formed on opposite sides of the channel region.

2. The DRAM cell arrangement of claim 1, wherein the upper source/drain regions are formed in strips of material traversing the lengths of the ribs.

3. The DRAM cell arrangement of claim 1, further comprising spaced-apart shallow isolation trenches disposed parallel to the word lines and formed on the ribs to isolate the lower source/drain regions from one another.

4. The DRAM cell arrangement of claim 1, further comprising trenches formed between the ribs and integrally connected with the word lines.

5. The DRAM cell arrangement of claim 1, wherein a width and doping of the channel regions is selected to produce fully depleted vertical dual-gate MOS transistors.

6. The DRAM cell arrangement of claim 1, wherein the gate electrodes formed by a gate dielectric layer disposed over the ribs.

7. The DRAM cell arrangement of claim 6, wherein a portion of the gate dielectric layer is disposed between the ribs and word lines.

8. The DRAM cell arrangement of claim 1, wherein each memory cell further comprises a capacitor electrically connected to a respective transistor

9. The DRAM cell arrangement of claim 8, wherein each capacitor is stacked with respect to its respective transistor and is electrically connected to the lower source/drain region of its respective transistor.

10. The DRAM cell arrangement of claim 9, further comprising metal bit lines disposed over the transistors and arranged parallel to the ribs and cross-wise with respect to the word lines, the metal bit lines being electrically connected to the upper source/drain regions of the respective transistors.

11. The DRAM cell arrangement of claim 9, further comprising an auxiliary carrier substrate disposed beneath the capacitors and an auxiliary layer capable of wafer bonding disposed between the auxiliary carrier substrate and the capacitors.

12. A DRAM cell arrangement with vertical MOS transistors, comprising:

a matrix of memory cells defined by the collective intersections of a plurality of spaced-apart parallel word lines and a plurality of spaced-apart parallel ribs disposed in a cross-wise direction with respect to the word lines, the ribs being covered with a gate dielectric material to form gate electrodes on each side of a respective rib and wherein the ribs are separated by trenches filled with conductive material in contact with the word lines, wherein each memory cell comprises a capacitor and a vertical dual-gate MOS transistor in stacked relation to one another and electrically connected, each vertical dual-gate MOS transistor comprising;

an upper source/drain region, a lower source/drain region and a channel region disposed between the source/drain regions;

wherein the upper and lower source/drain regions are formed as strips of doped material traversing the lengths of their respective rib, and wherein the channel region is formed in one of the ribs and is grounded to at least reduce floating body effects.

13. The DRAM cell arrangement of claim 12, further comprising spaced-apart shallow isolation trenches disposed parallel to the word lines and formed on the ribs to isolate the lower source/drain regions from one another.

14. The DRAM cell arrangement of claim 12, wherein a width and doping of the channel regions is selected to produce fully depleted vertical dual-gate MOS transistors.

15. The DRAM cell arrangement of claim 12, wherein a portion of the gate dielectric layer is disposed between the ribs and word lines.

16. The DRAM cell arrangement of claim 12, wherein each capacitor is electrically connected to the lower source/drain region of its respective transistor.

17. The DRAM cell arrangement of claim 16, further comprising metal bit lines disposed over the transistors and arranged parallel to the ribs and cross-wise with respect to the word lines, the metal bit lines being electrically connected to the upper source/drain regions of the respective transistors.

18. The DRAM cell arrangement of claim 16, further comprising an auxiliary carrier substrate disposed beneath the capacitors and an auxiliary layer capable of wafer bonding disposed between the auxiliary carrier substrate and the capacitors.