Optical device and method for fabricating the same

• US 20050253211A1
• Filed: 04/11/2005
• Published: 11/17/2005
• Est. Priority Date: 05/14/2004
• Status: Active Grant

• Current Assignee: Collabo Innovations, Inc. (Wi-LAN Inc.)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Fukuda, Toshiyuki, Minamio, Masanori
• Granted Patent: US 7,436,053 B2
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 29/49172 by molding of insulating material

Abstract

An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.

Claims

1. An optical device comprising:

a base of molding resin having an opening and formed with a shoulder whose upper level is on an upper region of a lower surface of the base surrounding the opening;

a wire which is partly buried in the molding resin and which has an external terminal portion provided in an outer peripheral part of the base and an internal terminal portion provided in the upper region of the lower surface of the base and bent up above the external terminal portion;

a translucent member attached to an upper surface of the base and covering the opening; and

an optical element chip of which a main surface is placed on the upper region of the lower surface of the base to face the translucent member with the opening interposed therebetween, the optical element chip mounting an optical element electrically connected to the internal terminal portion of the wire.

2. The device of claim 1,

wherein upper and lower surfaces of the internal terminal portion are substantially flush with upper and lower surfaces of part of the base adjacent to the internal terminal portion, respectively.

3. The device of claim 1,

wherein the optical element chip is flip-chip bonded onto the terminal portion of the wire of the base.

4. The device of claim 1, wherein the wire further comprises a reinforcing terminal portion provided between the internal and external terminal portions.

5. The device of claim 1, further comprising an integrated circuit chip which is disposed on the back surface of the optical element chip and which mounts a semiconductor element electrically connected to a terminal portion of the wire.

6. The device of claim 1,

wherein the base is provided with positioning means used as a reference for positioning of a member to be attached to the base.

7. The device of claim 6,

wherein the positioning means is a through hole provided in the base.

8. The device of claim 1,

wherein the optical element chip mounts an image sensing element, and

the device is a solid-state image sensing device.

9. The device of claim 1,

wherein the optical element chip mounts either one of a light emitting element and a light receiving element, and

the device is incorporated in an optical pickup system.

10. The device of claim 1,

wherein the translucent member is a hologram,

the optical element chip mounts a light receiving element and a light emitting element, and

the device is a hologram unit.

11. A method for fabricating an optical device, comprising:

the step (a) of molding a lead frame with a wiring pattern to form a molded structure of bases with a plurality of optical device formation regions each surrounding an opening;

the step (b) of attaching, after the step (a), an optical element chip to each of the optical device formation regions so that the chip covers the opening, the optical device formation regions being located in the molded structure of the bases or in individual separated parts made by splitting the molded structure;

the step (c) of sealing, after the step (b), the optical element chips and connecting portions of the molded structure or of the separated parts of the molded structure with a first resin member;

the step (d) of attaching, after the step (a), translucent members to the molded structure or the separated parts of the molded structure so that each of the translucent members faces the corresponding optical element chip with the opening interposed therebetween; and

the step (e) of sealing, after the step (d) or simultaneously with the step (d), the translucent members and the molded structure of the bases or the separated parts with a second resin member,

wherein in the step (a), resin sealing is carried out with an internal terminal portion of the wiring pattern put on a projection of a lower die of a molding die and thereby sandwiched by an upper die and the lower die.

12. The method of claim 11,

wherein in the step (b), the optical element chip is flip-chip bonded to portions of the wiring pattern.

13. The method of claim 11, further comprising the step of attaching, after the step (b) and before the step (c), an integrated circuit chip to the back surface of each of the optical element chips,

wherein in the step (c), the first resin member seals the optical element chips, the integrated circuit chips, and the connecting portions of the molded structure or of the separated parts of the molded structure.

14. The method of claim 11,

wherein in the step (a), resin molding is carried out with the lead frame to be a wire put on a sealing tape and installed in the molding die.