Micromechanical component and corresponsing production method

• US 20050253240A1
• Filed: 02/21/2003
• Published: 11/17/2005
• Est. Priority Date: 06/12/2002
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Graf, Eckhard, Fischer, Frank, Haag, Frieder, Nuechter, Wolfgang
• Application Number:
  US10/514,364
• Publication Number:
  US 20050253240A1
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A micromechanical component including a chip which is mounted on a substrate and has an encapsulated chip area which is higher than its vicinity, as well as a mounting area provided in the vicinity of the encapsulated chip area. The chip being mounted on the substrate by a mounting arrangement which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom. The encapsulated chip area is surrounded by an underfill beneath the chip. A method for the manufacture of the micromechanical component is also provided.

Claims

1-17. -17. (canceled)

18. A micromechanical component comprising:

a chip mounted on a substrate, and having an encapsulated chip area which is higher than its vicinity, a mounting area being provided in a vicinity of the encapsulated chip area;

wherein the chip is mounted on the substrate using a mounting arrangement which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom, the encapsulated chip area being surrounded by an underfill beneath the chip.

19. The micromechanical component of claim 18, wherein the mounting area includes a metal-plated area, and the mounting arrangement includes solder bumps for a flip-chip assembly.

20. The micromechanical component of claim 18, wherein the mounting area includes an adhesive area, and the mounting arrangement includes an adhesive arrangement.

21. The micromechanical component of claim 18, wherein the mounting area includes a welding area, and the mounting arrangement includes a welding zone.

22. The micromechanical component of claim 18, wherein the substrate includes an integrated circuit chip.

23. The micromechanical component of claim 18, wherein the chip includes at least one of a sensor chip, an actuator chip which has a sensor structure, and an actuator structure beneath the encapsulated chip area.

24. The micromechanical component of claim 18, wherein the substrate is mounted on a lead frame, and the component is surrounded by a plastic package.

25. The micromechanical component of claim 18, wherein the encapsulated chip area includes a cap-type cover for covering a functional area provided on a substrate, the cap-type cover having at least one perforated cover layer which is sealed by at least one sealing layer.

26. A method for making a micromechanical component, the method comprising:

providing a chip which includes an encapsulated chip area which is higher than its vicinity, and a mounting area in a vicinity of the encapsulated chip area;

mounting the chip on a substrate via a mounting arrangement, which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom; and

underfilling the chip so that the encapsulated chip area is surrounded by an underfill beneath the chip.

27. The method of claim 26, wherein the mounting area includes a metal-plated area, and the mounting arrangement includes solder bumps for a flip-chip assembly.

28. The method of claim 26, wherein the mounting area includes an adhesive area, and the mounting arrangement includes an adhesive arrangement.

29. The method of claim 26, wherein the mounting area includes a welding area, and the mounting arrangement includes a welding zone.

30. The method of claim 26, wherein the substrate includes an integrated circuit chip.

31. The method of claim 30, wherein a plurality of chips are mounted on a plurality of wafer-bonded IC chips, and the components are subsequently separated.

32. The method of claim 26, wherein the chip includes at least one of a sensor chip, an actuator chip which has a sensor structure, and an actuator structure beneath the encapsulated chip area.

33. The method of claim 26, wherein the substrate is mounted on a lead frame, and the component is surrounded by a plastic package.

34. The method of claim 26, wherein the encapsulated chip area includes a cap-type cover for covering a functional area provided on the substrate, the cap-type cover including at least one perforated cover layer which is sealed by at least one sealing layer.