Micromechanical component and corresponsing production method
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Accused Products
Abstract
A micromechanical component including a chip which is mounted on a substrate and has an encapsulated chip area which is higher than its vicinity, as well as a mounting area provided in the vicinity of the encapsulated chip area. The chip being mounted on the substrate by a mounting arrangement which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom. The encapsulated chip area is surrounded by an underfill beneath the chip. A method for the manufacture of the micromechanical component is also provided.
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Citations
34 Claims
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1-17. -17. (canceled)
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18. A micromechanical component comprising:
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a chip mounted on a substrate, and having an encapsulated chip area which is higher than its vicinity, a mounting area being provided in a vicinity of the encapsulated chip area;
wherein the chip is mounted on the substrate using a mounting arrangement which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom, the encapsulated chip area being surrounded by an underfill beneath the chip. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
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26. A method for making a micromechanical component, the method comprising:
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providing a chip which includes an encapsulated chip area which is higher than its vicinity, and a mounting area in a vicinity of the encapsulated chip area;
mounting the chip on a substrate via a mounting arrangement, which is connected to the mounting area, so that the encapsulated chip area faces the substrate and is positioned at a distance therefrom; and
underfilling the chip so that the encapsulated chip area is surrounded by an underfill beneath the chip. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34)
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Specification