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Integrated passive devices

  • US 20050253257A1
  • Filed: 01/06/2005
  • Published: 11/17/2005
  • Est. Priority Date: 04/29/2004
  • Status: Active Grant
First Claim
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1. An integrated passive device multichip module (MCM IPD) comprising:

  • a. a substrate, b. an IPD attached to the substrate with an attachment layer, wherein at least part of the attachment layer is non-conducting.

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