Integrated passive devices
First Claim
1. An integrated passive device multichip module (MCM IPD) comprising:
- a. a substrate, b. an IPD attached to the substrate with an attachment layer, wherein at least part of the attachment layer is non-conducting.
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Accused Products
Abstract
The specification describes a multi-chip module (MCM) that contains an integrated passive device (IPD) as the carrier substrate (IPD MCM). Parasitic electrical interactions are controlled at one or both interfaces of the IPD either by eliminating metal from the interfaces, or by selective use of metal in parts of the MCM that are remote from the sensitive device components. The sensitive device components are primarily analog circuit components, especially RF inductor elements. In the IPD layout, the sensitive components are segregated from other components. This allows implementation of the selective metal approach. It also allows parasitic interactions on top of the IPD substrate to be reduced by selective placement of IC semiconductor chips and IC chip ground planes. In preferred embodiments of the IPD MCM of the invention, the IPD substrate is polysilicon, to further minimize RF interactions. The various methods of assembling the module may be adapted to keep the overall thickness within 1.0 mm.
31 Citations
22 Claims
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1. An integrated passive device multichip module (MCM IPD) comprising:
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a. a substrate, b. an IPD attached to the substrate with an attachment layer, wherein at least part of the attachment layer is non-conducting. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An integrated passive device multichip module (MCM IPD) comprising:
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a. a substrate, b. an IPD attached to the substrate with an attachment layer, at least a portion of which is non-conducting, the IPD comprising a first portion containing mainly RF components and a second portion containing mainly non-RF components, the IPD having a first surface over the first portion and a second surface under the first portion, c. an IC chip mounted on the second portion of the IPD, the MCM IPD characterized in that the first and second surfaces of the IPD are devoid of metal. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification