Test method for semiconductor components using anisotropic conductive polymer contact system
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Abstract
A contact system for electrically engaging semiconductor components includes an interface board mountable to an automated test handler, and a floating substrate on the interface board. The interface board includes interface contacts in electrical communication with external test circuitry. The substrate includes flexible segments, and contactors having contact pads on opposing sides of the flexible segments configured to simultaneously electrically engage terminal contacts on the components, and the interface contacts on the interface board. The contact pads include conductive polymer layers that provide an increased compliancy for the contactors. This increased compliancy allows the contactors to accommodate variations in the dimensions and planarity of the terminal contacts on the component. In addition, the substrate includes grooves between the contactors which provide electrical isolation and allow the contactors to move independently of one another. An alternate embodiment contact system includes a Z-axis conductive polymer layer between the substrate and the interface board. Also provided are test methods employing the contact systems.
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Citations
77 Claims
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1-60. -60. (canceled)
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61. A method for testing a semiconductor component having a plurality of terminal contacts comprising:
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providing a board comprising a plurality of contacts in electrical communication with test circuitry;
providing a substrate on the board;
providing a plurality of movable test contactors on the substrate comprising first contacts configured to electrically engage the terminal contacts and second contacts in electrical communication with the first contacts, and an anisotropic conductive polymer layer configured to electrically engage the second contacts and the contacts;
placing the component on the substrate with the terminal contacts in electrical communication with the first contacts and the second contacts in electrical communication with the contacts; and
applying test signals through the test contactors and the terminal contacts to the component. - View Dependent Claims (62, 63, 64, 65, 66)
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67. A method for testing a semiconductor component having a terminal contact comprising:
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providing a board comprising at least one contact in electrical communication with test circuitry;
providing a substrate on the board comprising at least one contactor configured to simultaneously electrically engage the contact and the terminal contact, the contactor comprising a first contact on a first side of the substrate configured to electrically engage the terminal contact, a second contact on the second side in electrical communication with the first contact, and an anisotropic conductive polymer layer proximate to a second opposing side of the substrate configured to electrically engage the second contact and the contact;
placing the component on the board with the first contact in electrical communication with the terminal contact and the second contact in electrical communication with the contact; and
applying test signals through the terminal contact, the contact, the second contact, and the anisotropic conductive polymer layer to the component. - View Dependent Claims (68, 69, 70, 71)
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72. A method for testing a semiconductor component having a plurality of terminal contacts comprising:
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providing a board comprising a plurality of contacts in electrical communication with test circuitry;
providing a floating substrate on the board;
providing a plurality of test contactors on the substrate, each test contactor comprising a flexible segment on the substrate, a first contact on a first side of the flexible segment configured to electrically engage a terminal contact, a second contact and on a second opposing side of the flexible segment in electrical communication with the first contact, and an anisotropic conductive polymer configured to electrically engage the second contact and a contact on the board;
placing the component on the substrate with the terminal contacts in electrical communication with the test contactors; and
applying test signals through the test contactors and the terminal contacts to the component. - View Dependent Claims (73, 74, 75, 76, 77)
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Specification