Medical lead and method for medical lead manufacture

• US 20050256557A1
• Filed: 03/08/2005
• Published: 11/17/2005
• Est. Priority Date: 09/26/2000
• Status: Abandoned Application

• Current Assignee: Advanced Neuromodulation Systems Incorporated (Abbott Laboratories Incorporated)
• Original Assignee: Advanced Neuromodulation Systems Incorporated (Abbott Laboratories Incorporated)
• Inventors: Wessman, Bradley J., Pohndorf, Peter J.
• Application Number:
  US11/074,572
• Publication Number:
  US 20050256557A1
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems

Abstract

The present invention provides a medical lead for implantation within a patient. The medical lead has a seem-less lead body having one or more electrodes secured to the distal end and one or more connector bands attached to the proximal end of the lead.

Claims

1-2. -2. (canceled)

3. A method of forming a medical lead, the method comprising:

forming a welding region within insulating material in a lead body of the medical lead to expose a conductor;

forming a conductive pad within the welding region by melting conductive material at a point over the welding region to form the conductive pad and electrically connecting the conductive pad to the conductor; and

electrically connecting an electrode to the conductive pad.

4. A method in accordance with claim 3 wherein the welding region is formed using a laser.

5. A method in accordance with claim 3 wherein the conductive material comprises a conductive metal selected from the group consisting of stainless steel, MB35N, Pt—

Ir, platinum, silver, gold, copper and vanadium.

6. A method in accordance with claim 3 wherein the welding region is in the shape of a groove.

7. A method in accordance with claim 3 further comprising:

welding the electrode to the conductive pad.

8. A method in accordance with claim 3 wherein forming the conductive pad further comprises melting and welding the conductive pad to the conductor using a laser.

9. A method in accordance with claim 3 wherein forming the conductive pad further comprises;

placing a length of wire over the welding region; and

melting the wire at a point such that ends of the wire are drawn into the welding region to form the conductive pad.

10. A method of forming a medical lead, the method comprising:

forming a first welding region within insulating material in a lead body of the medical lead to expose a conductor;

forming a second welding region within the insulating material in the lead body of the medical lead to expose the conductor;

forming a first conductive pad within the first welding region by melting a first conductive material at a point over the first welding region to form the first conductive pad and electrically connecting the first conductive pad to the conductor;

forming a second conductive pad within the second welding region by melting a second conductive material at a point over the second welding region to form the second conductive pad and electrically connecting the second conductive pad to the conductor; and

electrically connecting an electrode to the first conductive pad and the second conductive pad.

11. A method in accordance with claim 10 wherein the first and second welding regions are formed using a laser.

12. A method in accordance with claim 10 wherein the first and second conductive material each comprise a conductive metal selected from the group consisting of stainless steel, MB35N, Pt—

Ir, platinum, silver, gold, copper and vanadium.

13. A method in accordance with claim 10 wherein the first and second welding regions are in the shape of a groove.

14. A method in accordance with claim 10 further comprising:

welding the electrode to the first conductive pad; and

welding the electrode to the second conductive pad.

15. A method in accordance with claim 10 wherein forming the first conductive pad further comprises melting and welding the first conductive pad to the conductor using a laser, and forming the second conductive pad further comprises melting and welding the second conductive pad to the conductor using a laser.

16. A method in accordance with claim 10 wherein forming the first conductive pad further comprises,

placing a length of first wire over the first welding region;

and

melting the first wire at a point such that ends of the first wire are drawn into the first welding region to form the first conductive pad; and

wherein forming the second conductive pad further comprises,

placing a length of second wire over the second welding region; and

melting the second wire at a point such that ends of the second wire are drawn into the second welding region to form the second conductive pad

17. A method of forming a medical lead, the method comprising:

forming a welding region within insulating material in a lead body of the medical lead to expose a conductor;

forming, using a laser, a conductive pad within the welding region by melting wire conductive material within the welding region to form the conductive pad thereby welding the conductive pad to the conductor; and

welding an electrode to the conductive pad.

18. A method in accordance with claim 17 wherein the welding region is formed using a laser.

19. A method in accordance with claim 17 wherein the conductive material comprises a conductive metal selected from the group consisting of stainless steel, MB35N, Pt—

Ir, platinum, silver, gold, copper and vanadium.

20. A method in accordance with claim 17 wherein forming the conductive pad further comprises;

placing a length of wire over the welding region; and

melting the wire at a point such that ends of the wire are drawn into the welding region to form the conductive pad.