Process and device for incorporating electronics into a tire

• US 20050257868A1
• Filed: 05/21/2004
• Published: 11/24/2005
• Est. Priority Date: 05/21/2004
• Status: Abandoned Application

• Current Assignee: Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Original Assignee: Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Inventors: Adamson, John David
• Application Number:
  US10/850,922
• Publication Number:
  US 20050257868A1
• Time in Patent Office: Days
• US Class Current: 152/152.100
• CPC Class Codes: B29D 2030/0077 Directly attaching monitoring devices to tyres before or after vulcanization, e.g. microchips
• CPC Class Codes: B60C 23/0493 for attachment on the tyre

Abstract

A patch having integrated electronics and positioned within the structure of a tire is provided. A process for integrating such patch within a tire is also provided. The patch is placed within the tire structure as opposed to resting on a tire surface. The patch may be attached within the tire structure using adhesives or may be bonded within the tire structure through a curing process.

Claims

1. A process for integrating an electronic device into a tire, comprising the steps of:

providing a patch, said patch configured for placement within the tire;

providing an electrical circuit for use with the tire;

incorporating said electrical circuit with said patch;

curing said patch at least partially;

embedding said patch within the architecture of the tire; and

curing the tire so as to provide an integrated structure that includes said patch and said tire.

2. A process according to claim 1, wherein said incorporating step comprises enclosing said electrical circuit within said patch.

3. A process according to claim 2, wherein said patch is comprised of a silica-reinforced elastomer.

4. A process according to claim 1, wherein said incorporating step comprises attaching said electrical circuit to the surface of said patch.

5. A process according to claim 1, wherein said patch is constructed from one or more materials selected from the group consisting of rubber, aramid, polyester, polyimide, rayon, nylon, foam rubber, steel, fiberglass, and TEFLON®

.

6. A process according to claim 1, wherein said electrical circuit includes an electromechanical transducer element.

7. A process according to claim 1, wherein the tire includes an inner liner and wherein said embedding step includes placing said patch under and adjacent to the inner liner.

8. A process according to claim 1, wherein the tire includes a plurality of layers, and wherein said embedding step comprises placing said patch between adjacent layers.

9. A process according to claim 1, wherein the tire includes a crown region and a tread region, and wherein said embedding step includes placing said patch within the crown region and adjacent to the tread region.

10. A process for including an electronic device within the structure of a tire, comprising the steps of:

providing a patch for placement within the structure of the tire;

providing an electrical circuit;

configuring said electrical circuit with said patch for placement into the structure of the tire;

applying an adhesive to said patch;

placing said patch within the tire such that said patch is enclosed within the structure of the tire; and

curing the tire.

11. A process according to claim 10, wherein said configuring step comprises attaching at least part of said electrical circuit to a surface of said patch.

12. A process according to claim 10, wherein said configuring step comprises embedding at least part of said electrical circuit into said patch.

13. A process according to claim 10, wherein said patch is comprised of a silica-reinforced elastomer.

14. A process according to claim 10, wherein said patch is constructed from one or more materials selected from the group consisting of rubber, aramid, polyester, polyimide, rayon, nylon, foam rubber, steel, stainless steel, fiberglass, and TEFLON®

.

15. A process according to claim 10, wherein said electrical circuit includes an electromechanical transducer element.

16. A process according to claim 10, wherein the structure of the tire includes an inner liner, and wherein said placing step comprises positioning said patch under and adjacent to the inner liner of the tire.

17. A process according to claim 10, wherein the structure of the tire includes a plurality of layers, and wherein said placing step comprises positioning said patch between layers.

18. A process according to claim 10, wherein the structure of the tire includes a crown region and a tread region, and wherein said placing step comprises positioning said patch within the crown region and adjacent to the tread region.

19. A process according to claim 10, wherein said patch is cured prior to said step of placing said patch within the tire.

20. A process according to claim 10, wherein said patch is semi-cured prior to said step of placing said patch within the tire.

21. A tire having integrated electronics, comprising;

a tire architecture that includes a pair of side wall portions, a crown section, and a tread section;

a patch enclosed within a portion of said tire architecture; and

an electrical circuit incorporated with said patch.

22. A tire having integrated electronics as in claim 21, wherein said electrical circuit includes an electromechanical transducer element for converting mechanical energy into electrical energy.

23. A tire having integrated electronics as in claim 21, wherein said patch is positioned in said crown section.

24. A tire having integrated electronics as in claim 21, wherein said patch is positioned in one of said pair of sidewall portions.

25. A tire having integrated electronics as in claim 21, wherein said patch is bonded to said tire architecture.

26. A tire having integrated electronics as in claim 21, wherein said patch is constructed from one or more materials selected from the group consisting of rubber, silica-reinforced elastomer, aramid, polyester, polyimide, rayon, nylon, foam rubber, steel, stainless steel, fiberglass, and TEFLON®

.

27. A tire having integrated electronics as in claim 21, wherein said patch is attached to said tire architecture with an adhesive.

28. An apparatus for use in incorporating electronics into a tire, comprising:

a patch having a slim profile, said patch made of a substantially electrically insulating material, said patch configured for being embedded inside of a tire;

an electrical circuit carried by said patch, said electrical circuit configured for communicating with a remote location; and

wherein said patch reduces dissipation between said electrical circuit and the tire when said patch is embedded inside of the tire.

29. An apparatus as in claim 28, wherein said patch is made of a material having a substantially low relative dielectric constant.

30. An apparatus as in claim 28, wherein said electrical circuit includes an antenna for use in communicating with a remote location, and wherein said electrical circuit includes a sensor for measuring at least one physical condition in the tire.