Back-biased face target sputtering based programmable logic device
First Claim
1. A facing targets sputtering device for semiconductor fabrication, comprising:
- an air-tight chamber in which an inert gas is admittable and exhaustible;
a pair of target plates placed at opposite ends of said air-tight chamber respectively so as to face each other and form a plasma region therebetween;
a pair of magnets respectively disposed adjacent to said target plates such that magnet poles of different polarities face each other across said plasma region thereby to establish a magnetic field of said plasma region between said target plates;
a substrate holder disposed adjacent to said plasma region, said substrate holder adapted to hold a substrate on which an alloyed thin film is to be deposited;
a back-bias power supply coupled to the substrate holder;
wherein the substrate includes an array of programmable logic devices and a memory array formed thereon.
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Abstract
Systems and methods are disclosed for forming memory arrays on a substrate in an air-tight chamber in which an inert gas is admittable and exhaustible; a pair of target plates placed at opposite ends of said air-tight chamber respectively so as to face each other and form a plasma region therebetween; a pair of magnets respectively disposed adjacent to said target plates such that magnet poles of different polarities face each other across said plasma region thereby to establish a magnetic field of said plasma region between said target plates; a substrate holder disposed adjacent to said plasma region, said substrate holder adapted to hold a substrate on which an alloyed thin film is to be deposited; and a back-bias power supply coupled to the substrate holder.
101 Citations
20 Claims
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1. A facing targets sputtering device for semiconductor fabrication, comprising:
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an air-tight chamber in which an inert gas is admittable and exhaustible;
a pair of target plates placed at opposite ends of said air-tight chamber respectively so as to face each other and form a plasma region therebetween;
a pair of magnets respectively disposed adjacent to said target plates such that magnet poles of different polarities face each other across said plasma region thereby to establish a magnetic field of said plasma region between said target plates;
a substrate holder disposed adjacent to said plasma region, said substrate holder adapted to hold a substrate on which an alloyed thin film is to be deposited;
a back-bias power supply coupled to the substrate holder;
wherein the substrate includes an array of programmable logic devices and a memory array formed thereon. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for sputtering a thin film onto a substrate, comprising:
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providing at least one target and a substrate having a film-forming surface portion and a back portion;
creating a magnetic field so that the film-forming surface portion is placed in the magnetic field with the magnetic field induced normal to the substrate surface portion back-biasing the back portion of the substrate; and
sputtering material onto the film-forming surface portion, wherein the thin forming surface portion comprises a memory cell and a programmable logic device. - View Dependent Claims (17, 18, 19, 20)
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Specification
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- Resources
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Current Assignee4D-S Pty, Ltd.
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Original Assignee4D-S Pty, Ltd.
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InventorsNagashima, Makoto
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Application NumberUS11/157,109Publication NumberTime in Patent OfficeDaysField of SearchUS Class Current204/192.120CPC Class CodesC23C 14/352 using more than one target ...H01J 37/3402 using supplementary magneti...
