Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same

• US 20050258516A1
• Filed: 09/28/2004
• Published: 11/24/2005
• Est. Priority Date: 05/19/2004
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Hong, Suk-Kee, Lee, Yeong-Gyu, Park, Heung-Woo
• Granted Patent: US 7,078,804 B2
• Time in Patent Office: Days
• US Class Current: 257/659
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Abstract

A micro-electro-mechanical system (MEMS) package with a side sealing member and a method of manufacturing the package are disclosed. In the MEMS package and method of the present invention, a sealing member is formed on a side surface of a lid glass that is mounted on a spacer surrounding MEMS elements provided on a base substrate and covers the MEMS elements, so that the sealing member hermetically seals the MEMS elements from the external environment.

Claims

1. A micro-electro-mechanical system (MEMS) package with a side sealing member, comprising:

a base substrate provided with an MEMS element thereon;

a first metal layer provided through patterning on the base substrate while surrounding the MEMS element; and

a spacer mounted to the base substrate while being in contact with the first metal layer, thus securing an MEMS moving space where the MEMS element is free to move vertically;

a lid glass provided with a second metal layer for uniting a sealing member to the lid glass, the second metal layer being provided at a predetermined portion at which the lid glass is in contact with the spacer when the lid glass is mounted to the spacer; and

the sealing member provided on the first metal layer, the spacer and an outside surface of the second metal layer of the lid glass.

2. The MEMS package as set forth in claim 1, further comprising:

a passivation layer provided between the base substrate and the first metal layer so as to prevent the MEMS element from being short-circuited to the base substrate.

3. The MEMS package as set forth in claim 1, wherein the lid glass is coated on at least one side thereof with an antireflective (AR) coating so as to enhance incident light transmissibility thereof.

4. The MEMS package as set forth in claim 1, wherein the sealing member comprises solder or an epoxy resin.

5. A method of manufacturing a micro-electro-mechanical system (MEMS) package with a side sealing member, comprising:

providing an MEMS element on a base substrate;

patterning a first metal layer on the base substrate so that the first metal layer surrounds the MEMS element;

mounting a spacer to the base substrate so that the spacer is in contact with the first metal layer, thus securing an MEMS moving space where the MEMS element is free to move vertically;

mounting a lid glass to the spacer, the lid glass having a second metal layer at a predetermined portion thereof at which the lid glass is in contact with the spacer when the lid glass is mounted to the spacer; and

applying a sealing member on the first metal layer, the spacer and an outside surface of the second metal layer of the lid glass, thus hermetically sealing the MEMS element from an external environment.

6. The method as set forth in claim 5, further comprising:

providing a passivation layer on the base substrate so as to prevent the MEMS element from being short-circuited to the base substrate.