Selectively configurable probe strucutres, e.g., for testing microelectronic components

• US 20050258848A1
• Filed: 07/28/2005
• Published: 11/24/2005
• Est. Priority Date: 08/26/2002
• Status: Active Grant

• Current Assignee: Brett Crump, Ralph Schaeffer
• Original Assignee: Brett Crump, Ralph Schaeffer
• Inventors: Crump, Brett, Schaeffer, Ralph
• Granted Patent: US 7,170,304 B2
• Time in Patent Office: Days
• US Class Current: 324/750.30
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07392 manipulating each probe element or tip individually
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Microelectronic components are commonly tested with probe cards. Certain aspects of the invention provide alternative probes, probe cards, and methods of testing microelectronic components. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, a microelectronic component is tested by contacting each of a plurality of second probes carried by the probe card to one of a plurality of spaced-apart second contacts on the microelectronic component, thereby aligning each of the first probes with a first contact of the microelectronic component. The second probes may then be moved out of contact with the second contacts while keeping the base of the probe card stationary with respect to the microelectronic component.

Claims

1-86. -86. (canceled)

87. A method of testing a microelectronic component with a selectively configurable probe card, comprising:

at a first temperature, contacting each of a plurality of contacts carried by the microelectronic component with one of a plurality of probes carried by the probe card, the probes being arranged in a first probe arrangement;

changing the temperature of the microelectronic component, thereby altering a relative arrangement of the contacts from a first contact arrangement to a different second contact arrangement;

actuating a plurality of actuators to rearrange the probes to a second probe arrangement wherein each of the probes is positioned to correspond to a position of one of the contacts in the second contact arrangement.

88. The method of claim 87 wherein the each of the actuators is associated with one of the probes, actuating the actuators moving tips of the associated probes with respect to a base of the probe card.

89. The method of claim 88 wherein each of the actuators includes a flexor coupled to the associated probe, actuating the actuators comprising changing the lengths of the flexors.

90. The method of claim 88 wherein each of the actuators includes a flexor coupled to the associated probe, actuating the actuators comprising heating the flexors.