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Multichip package test

  • US 20050258858A1
  • Filed: 07/27/2005
  • Published: 11/24/2005
  • Est. Priority Date: 10/01/2002
  • Status: Active Grant
First Claim
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1. A test apparatus, comprising:

  • a test driver including a drive channel and an input/output channel; and

    a test board including a package, the package having mounted thereon a plurality of chips;

    where the drive channel connects to drive pins associated with each of the plurality of chips in parallel; and

    where the input/output channel connects to input/output pins associated with each of the plurality of chips in parallel.

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