Exposure apparatus and device manufacturing method

• US 20050259234A1
• Filed: 06/08/2005
• Published: 11/24/2005
• Est. Priority Date: 12/10/2002
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Hirukawa, Shigeru, Magome, Nobutaka, Tanaka, Issey
• Granted Patent: US 8,004,650 B2
• Time in Patent Office: Days
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/70716 Stages
• CPC Class Codes: G03F 7/709 Vibration, e.g. vibration detection, compensation, suppression or isolation

Abstract

Liquid is supplied by a supply mechanism to a space between a lens and a wafer via a supply nozzle on one side of the lens, and the liquid is recovered by a recovery mechanism via a recovery pipe on the other side of the lens. When the supply and the recovery of the liquid are performed in parallel, a predetermined amount of liquid (exchanged at all times) is held between the lens and the substrate on the stage. Accordingly, when exposure (pattern transfer on the substrate) is performed in this state, an immersion method is applied and a pattern is transferred with good precision onto the substrate. In addition, in the case the liquid leaks out from under the lower edge of a peripheral wall, the liquid that could not be recovered is recovered by an auxiliary recovery mechanism via a slit. And, by such operations, the substrate is freed from the residual liquid on the substrate.

Claims

1. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies liquid to a space between said projection optical system and said substrate on said substrate stage;

a recovery mechanism that recovers said liquid; and

an auxiliary recovery mechanism that recovers said liquid which could not be recovered by said recovery mechanism.

2. The exposure apparatus of claim 1, said exposure apparatus further comprising:

a plate provided in at least a part of the periphery of a mounted area of said substrate on said substrate stage, said plate having a surface arranged at substantially the same height as a surface of said substrate mounted on said substrate stage.

3. The exposure apparatus of claim 1 wherein

said auxiliary recovery mechanism recovers remaining liquid at the rear side of said projection optical system in a moving direction of said substrate.

4. The exposure apparatus of claim 1 wherein

said auxiliary recovery mechanism recovers remaining liquid at the front side of said projection optical system in a moving direction of said substrate.

5. The exposure apparatus of claim 1 wherein

said auxiliary recovery mechanism includes a suction mechanism that sucks fluid.

6. The exposure apparatus of claim 5, said exposure apparatus further comprising:

a gas supply mechanism that suppresses an environmental change in the periphery of said liquid caused by suction operation of said suction mechanism.

7. The exposure apparatus of claim 1 wherein

said projection optical system includes a plurality of optical elements in which an optical element located closest to said substrate has a hole formed in a section excluding a portion used for exposure, and

at least one operation of supplying said liquid, recovering said liquid, and recovering bubbles is performed via said hole.

8. The exposure apparatus of claim 1, said exposure apparatus further comprising:

a control unit that stops both liquid supply operation by said supply mechanism and liquid recovery operation by said recovery mechanism when said substrate stage remains stationary.

9. The exposure apparatus of claim 1 wherein

said supply mechanism supplies liquid to the space between said projection optical system and said substrate on said substrate stage from the front side in a moving direction of said substrate.

10. The exposure apparatus of claim 1 wherein

said supply mechanism supplies liquid to a space between said projection optical system and a substrate on said substrate stage from the rear side in a moving direction of said substrate.

11. The exposure apparatus of claim 1, said exposure apparatus further comprising:

a drive system that drives said substrate stage in a predetermined scanning direction with respect to said energy beam to transfer said pattern onto said substrate in a scanning exposure method.

12. The exposure apparatus of claim 11 wherein

said supply mechanism has a plurality of supply ports arranged spaced apart in a non-scanning direction perpendicular to said scanning direction, and said supply mechanism supplies said liquid from at least one supply port selected from said plurality of supply ports in accordance with the size of a divided area subject to exposure on said substrate.

13. The exposure apparatus of claim 1, said exposure apparatus further comprising:

at least one bubble recovery mechanism that recovers bubbles in the liquid at the rear side of said projection optical system in a moving direction of said substrate.

14. The exposure apparatus of claim 1, said exposure apparatus further comprising:

an adjustment unit that adjusts exposure conditions based on at least one of actual measurement values and prediction values of temperature information on said liquid between said projection optical system and said substrate.

144. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 1.

15. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies liquid to locally fill a space between said projection optical system and said substrate on said substrate stage with the liquid;

a recovery mechanism that recovers said liquid; and

a plate provided in at least a part of the periphery of a mounted area of said substrate on said substrate stage, said plate having a surface arranged at substantially the same height as a surface of said substrate mounted on said substrate stage.

16. The exposure apparatus of claim 15 wherein

a gap formed between said plate and said substrate is set to 3 mm and under.

17. The exposure apparatus of claim 15, said exposure apparatus further comprising:

an interferometer that measures a position of said substrate stage; and

an air conditioning mechanism that performs air conditioning in the periphery of said liquid between said projection optical system and said substrate.

18. The exposure apparatus of claim 15 wherein

the liquid supply by said supply mechanism begins on said plate.

19. The exposure apparatus of claim 15 wherein

said projection optical system includes a plurality of optical elements in which an optical element located closest to said substrate has a hole formed in a section excluding a portion used for exposure, and

at least one operation of supplying said liquid, recovering said liquid, and recovering bubbles is performed via said hole.

20. The exposure apparatus of claim 15, said exposure apparatus further comprising:

a control unit that stops both liquid supply operation by said supply mechanism and liquid recovery operation by said recovery mechanism when said substrate stage remains stationary.

21. The exposure apparatus of claim 15 wherein

said supply mechanism supplies liquid to the space between said projection optical system and said substrate on said substrate stage from the front side in a moving direction of said substrate.

22. The exposure apparatus of claim 15 wherein

said supply mechanism supplies liquid to the space between said projection optical system and said substrate on said substrate stage from the rear side in a moving direction of said substrate.

23. The exposure apparatus of claim 15, said exposure apparatus further comprising:

a drive system that drives said substrate stage in a predetermined scanning direction with respect to said energy beam to transfer said pattern onto said substrate in a scanning exposure method.

24. The exposure apparatus of claim 23 wherein

said supply mechanism has a plurality of supply ports arranged spaced apart in a non-scanning direction perpendicular to said scanning direction, and said supply mechanism supplies said liquid from at least one supply port selected from said plurality of supply ports in accordance with the size of a divided area subject to exposure on said substrate.

25. The exposure apparatus of claim 15, said exposure apparatus further comprising:

at least one bubble recovery mechanism that recovers bubbles in the liquid at the rear side of said projection optical system in a moving direction of said substrate.

26. The exposure apparatus of claim 15, said exposure apparatus further comprising:

an adjustment unit that adjusts exposure conditions based on at least one of actual measurement values and prediction values of temperature information on said liquid between said projection optical system and said substrate.

145. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 15.

27. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

an interferometer that measures a position of said substrate stage;

a supply mechanism that supplies liquid to a space between said projection optical system and said substrate on said substrate stage;

a recovery mechanism that recovers said liquid; and

an air conditioning mechanism that performs air conditioning in the periphery of said liquid between said projection optical system and said substrate.

28. The exposure apparatus of claim 27 wherein

said air conditioning mechanism includes a suction mechanism that sucks fluid.

29. The exposure apparatus of claim 28 wherein

said suction mechanism also performs the function of recovering said liquid which could not be recovered by said recovery mechanism.

30. The exposure apparatus of claim 27 wherein

said air conditioning mechanism locally air-conditions the periphery of said liquid.

31. The exposure apparatus of claim 27 wherein

said projection optical system includes a plurality of optical elements in which an optical element located closest to said substrate has a hole formed in a section excluding a portion used for exposure, and

at least one operation of supplying said liquid, recovering said liquid, and recovering bubbles is performed via said hole.

32. The exposure apparatus of claim 27, said exposure apparatus further comprising:

a control unit that stops both liquid supply operation by said supply mechanism and liquid recovery operation by said recovery mechanism when said substrate stage remains stationary.

33. The exposure apparatus of claim 27 wherein

said supply mechanism supplies liquid to the space between said projection optical system and the substrate on said substrate stage from the front side in a moving direction of said substrate.

34. The exposure apparatus of claim 27 wherein

said supply mechanism supplies liquid to the space between said projection optical system and the substrate on said substrate stage from the rear side in a moving direction of said substrate.

35. The exposure apparatus of claim 27, said exposure apparatus further comprising:

a drive system that drives said substrate stage in a predetermined scanning direction with respect to said energy beam to transfer said pattern onto said substrate in a scanning exposure method.

36. The exposure apparatus of claim 35 wherein

said supply mechanism has a plurality of supply ports arranged spaced apart in a non-scanning direction perpendicular to said scanning direction, and said supply mechanism supplies said liquid from at least one supply port selected from said plurality of supply ports in accordance with the size of a divided area subject to exposure on said substrate.

37. The exposure apparatus of claim 27, said exposure apparatus further comprising:

at least one bubble recovery mechanism that recovers bubbles in the liquid at the rear side of said projection optical system in a moving direction of said substrate.

38. The exposure apparatus of claim 27, said exposure apparatus further comprising:

an adjustment unit that adjusts exposure conditions based on at least one of actual measurement values and prediction values of temperature information on said liquid between said projection optical system and said substrate.

146. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 27.

39. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies liquid to a space between said projection optical system and said substrate on said substrate stage; and

a recovery mechanism that recovers said liquid, wherein

said projection optical system includes a plurality of optical elements in which an optical element located closest to said substrate has a hole formed in a section excluding a portion used for exposure, and

at least one operation of supplying said liquid, recovering said liquid, and recovering bubbles is performed via said hole.

40. The exposure apparatus of claim 39, said exposure apparatus further comprising:

a control unit that stops both liquid supply operation by said supply mechanism and liquid recovery operation by said recovery mechanism when said substrate stage remains stationary.

41. The exposure apparatus of claim 39 wherein

said supply mechanism supplies liquid to the space between said projection optical system and the substrate on said substrate stage from the front side in a moving direction of said substrate.

42. The exposure apparatus of claim 39 wherein

said supply mechanism supplies liquid to the space between said projection optical system and the substrate on said substrate stage from the rear side in a moving direction of said substrate.

43. The exposure apparatus of claim 39, said exposure apparatus further comprising:

a drive system that drives said substrate stage in a predetermined scanning direction with respect to said energy beam to transfer said pattern onto said substrate in a scanning exposure method.

44. The exposure apparatus of claim 43 wherein

said supply mechanism has a plurality of supply ports arranged spaced apart in a non-scanning direction perpendicular to said scanning direction, and said supply mechanism supplies said liquid from at least one supply port selected from said plurality of supply ports in accordance with the size of a divided area subject to exposure on said substrate.

45. The exposure apparatus of claim 39, said exposure apparatus further comprising:

at least one bubble recovery mechanism that recovers bubbles in the liquid at the rear side of said projection optical system in a moving direction of said substrate.

46. The exposure apparatus of claim 39, said exposure apparatus further comprising:

an adjustment unit that adjusts exposure conditions based on at least one of actual measurement values and prediction values of temperature information on said liquid between said projection optical system and said substrate.

147. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 39.

47. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies liquid to a space between said projection optical system and said substrate on said substrate stage; and

a recovery mechanism that recovers said liquid, wherein

when said substrate stage remains stationary, both liquid supply operation by said supply mechanism and liquid recovery operation by said recovery mechanism are stopped.

48. The exposure apparatus of claim 47 wherein

said supply mechanism supplies liquid to the space between said projection optical system and said substrate on said substrate stage from the front side in a moving direction of said substrate.

49. The exposure apparatus of claim 47 wherein

said supply mechanism supplies liquid to the space between said projection optical system and said substrate on said substrate stage from the rear side in a moving direction of said substrate.

50. The exposure apparatus of claim 47, said exposure apparatus further comprising:

a drive system that drives said substrate stage in a predetermined scanning direction with respect to said energy beam to transfer said pattern onto said substrate in a scanning exposure method.

51. The exposure apparatus of claim 50 wherein

said supply mechanism has a plurality of supply ports arranged spaced apart in a non-scanning direction perpendicular to said scanning direction, and said supply mechanism supplies said liquid from at least one supply port selected from said plurality of supply ports in accordance with the size of a divided area subject to exposure on said substrate.

52. The exposure apparatus of claim 47, said exposure apparatus further comprising:

at least one bubble recovery mechanism that recovers bubbles in the liquid at the rear side of said projection optical system in a moving direction of said substrate.

53. The exposure apparatus of claim 47, said exposure apparatus further comprising:

an adjustment unit that adjusts exposure conditions based on at least one of actual measurement values and prediction values of temperature information on said liquid between said projection optical system and said substrate.

54. The exposure apparatus of claim 47, said exposure apparatus further comprising:

a peripheral wall that surrounds at least an optical element closest to said substrate constituting said projection optical system, and also forms a predetermined clearance with respect to a surface of said substrate on said substrate stage, wherein

said supply mechanism supplies said liquid inside said peripheral wall where an end section of said projection optical system on the substrate side fronts.

148. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 47.

55. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a plurality of divided areas on a substrate respectively, via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a peripheral wall that surrounds at least an optical element closest to said substrate constituting said projection optical system, and also forms a predetermined clearance with respect to a surface of said substrate on said substrate stage; and

at least one supply mechanism that supplies liquid inside said peripheral wall from the rear side in a moving direction of said substrate.

56. The exposure apparatus of claim 55, said exposure apparatus further comprising:

a recovery mechanism that recovers said liquid at the front side of said projection optical system in a moving direction of said substrate.

57. The exposure apparatus of claim 55 wherein

said supply mechanism has a plurality of supply ports in the periphery of an irradiation area on said substrate where said energy beam is irradiated via said pattern and said projection optical system during exposure, and switches the supply port used for supplying said liquid in accordance with said moving direction of said substrate.

58. The exposure apparatus of claim 55, said exposure apparatus further comprising:

a drive system that drives said substrate stage in a predetermined scanning direction with respect to said energy beam to transfer said pattern onto said substrate in a scanning exposure method.

59. The exposure apparatus of claim 58 wherein

said supply mechanism is provided on one side and the other side of said irradiation area in said scanning direction, respectively, and

said supply mechanism that supplies said liquid is switched in accordance with said scanning direction of said substrate.

60. The exposure apparatus of claim 58 wherein

said supply mechanism has a plurality of supply ports arranged spaced apart in a non-scanning direction perpendicular to said scanning direction, and said supply mechanism supplies said liquid from at least one supply port selected from said plurality of supply ports in accordance with the size of a divided area subject to exposure on said substrate.

61. The exposure apparatus of claim 55, said exposure apparatus further comprising:

a plate provided in at least a part of the periphery of a mounted area of said substrate on said substrate stage, said plate having a surface arranged at substantially the same height as a surface of said substrate mounted on said substrate stage.

62. The exposure apparatus of claim 55, said exposure apparatus further comprising:

at least one bubble recovery mechanism that recovers bubbles in the liquid at the rear side of said projection optical system in a moving direction of said substrate.

63. The exposure apparatus of claim 55, said exposure apparatus further comprising:

an adjustment unit that adjusts exposure conditions based on at least one of actual measurement values and prediction values of temperature information on said liquid between said projection optical system and said substrate.

149. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 55.

64. An exposure apparatus that illuminates a pattern with an energy beam, moves a substrate in a predetermined scanning direction, and transfers said pattern onto a plurality of divided areas on said substrate via a projection optical system in a scanning exposure method, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies liquid to a space between said projection optical system and said substrate on said substrate stage; and

a recovery mechanism that recovers said liquid, wherein

liquid supply by said supply mechanism and liquid recovery by said recovery mechanism are performed in sync with exposure operations for each of said divided areas on said substrate.

65. The exposure apparatus of claim 64 wherein

each time exposure of said divided areas is performed, said liquid supply by said supply mechanism and full recovery of said liquid by said recovery mechanism are performed.

66. The exposure apparatus of claim 65 wherein

on transferring said pattern, due to said substrate stage moving in said scanning direction, said liquid supply by said supply mechanism begins at some point before the front edge of a divided area subject to exposure enters an irradiation area on said substrate on which said energy beam is irradiated via said pattern and said projection optical system on exposure.

67. The exposure apparatus of claim 66 wherein

said liquid supply by said supply mechanism begins after moving operation of said substrate stage between divided areas, which is performed between pattern transfer on said divided area subject to exposure and pattern transfer on a preceding divided area, has been completed.

68. The exposure apparatus of claim 66 wherein

said liquid supply by said supply mechanism begins when said front edge of said divided area subject to exposure reaches a supply position.

69. The exposure apparatus of claim 65 wherein

on transferring said pattern, due to said substrate stage moving in said scanning direction, said liquid supply by said supply mechanism stops at a point when the rear edge of a divided area subject to exposure comes off an irradiation area on said substrate on which said energy beam is irradiated via said pattern and said projection optical system on exposure.

70. The exposure apparatus of claim 69 wherein

said liquid recovery by said recovery mechanism ends after said pattern is transferred onto said divided area subject to exposure and before moving operation of said substrate stage between divided areas performed prior to pattern transfer on a succeeding divided area begins.

71. The exposure apparatus of claim 65 wherein

on transferring said pattern, due to said substrate stage moving in said scanning direction, said liquid supply by said supply mechanism stops at a point before the rear edge of a divided area subject to exposure comes completely off an irradiation area on said substrate on which said energy beam is irradiated via said pattern and said projection optical system on exposure.

72. The exposure apparatus of claim 71 wherein

said liquid supply by said supply mechanism stops when said rear edge of said divided area subject to exposure reaches a supply position.

73. The exposure apparatus of claim 71 wherein

said liquid recovery by said recovery mechanism ends after said pattern is transferred onto said divided area subject to exposure and before moving operation of said substrate stage between divided areas performed prior to pattern transfer on a succeeding divided area begins.

74. The exposure apparatus of claim 64, said exposure apparatus further comprising:

a peripheral wall that surrounds at least an optical element closest to said substrate constituting said projection optical system, and also forms a predetermined clearance with respect to a surface of said substrate on said substrate stage, wherein

said supply mechanism supplies said liquid inside said peripheral wall where an end section of said projection optical system on the substrate side fronts.

150. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 64.

75. An exposure apparatus that illuminates a pattern with an energy beam, moves a substrate in a predetermined scanning direction, and transfers said pattern onto a plurality of divided areas on said substrate via a projection optical system in a scanning exposure method, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a peripheral wall that surrounds at least an optical element closest to said substrate constituting said projection optical system, and also forms a predetermined clearance with respect to a surface of said substrate on said substrate stage;

a supply mechanism that supplies liquid inside said peripheral wall; and

a recovery mechanism that recovers said liquid.

76. The exposure apparatus of claim 75 wherein

the inside of said peripheral wall is in a negative pressure state.

77. The exposure apparatus of claim 75 wherein

when said substrate stage holding said substrate is moving, said liquid supply by said supply mechanism and said liquid recovery by said recovery mechanism are performed.

78. The exposure apparatus of claim 75 wherein

when said substrate stage holding said substrate is stationary, liquid supply operation by said supply mechanism and liquid recovery operation by said recovery mechanism are suspended, and a state where said liquid is held within said peripheral wall is maintained.

79. The exposure apparatus of claim 75 wherein

said predetermined clearance is set to 3 mm and under.

151. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 75.

80. An exposure apparatus that illuminates a pattern with an energy beam, moves a substrate in a predetermined scanning direction, and transfers said pattern onto a plurality of divided areas on said substrate via a projection optical system in a scanning exposure method, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate; and

said supply mechanism that has a plurality of supply ports arranged spaced apart in a non-scanning direction perpendicular to said scanning direction, and said supply mechanism supplies said liquid along said scanning direction from at least one supply port selected from said plurality of supply ports in accordance with the position of a divided area subject to exposure on said substrate to a predetermined spatial area, which includes at least a space between said substrate on said substrate stage and said projection optical system.

81. The exposure apparatus of claim 80 wherein

when said divided area subject to exposure is a divided area in the periphery on said substrate, said supply mechanism supplies said liquid only from a part of said plurality of supply ports spaced apart in said non-scanning direction.

82. The exposure apparatus of claim 80, said exposure apparatus further comprising:

at least one bubble recovery mechanism that recovers bubbles in the liquid in the upstream side of said liquid flowing along said scanning direction with respect to said projection optical system.

83. The exposure apparatus of claim 80 wherein

said supply mechanism supplies liquid from the rear side in a moving direction of said substrate.

84. The exposure apparatus of claim 80, said exposure apparatus further comprising:

an adjustment unit that adjusts exposure conditions based on at least one of actual measurement values and prediction values of temperature information on said liquid between said projection optical system and said substrate.

152. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 80.

85. An exposure apparatus that illuminates a pattern with an energy beam, moves a substrate in a predetermined scanning direction, and transfers said pattern onto a plurality of divided areas on said substrate via a projection optical system in a scanning exposure method, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate; and

a supply mechanism that has a plurality of supply ports arranged spaced apart in a non-scanning direction perpendicular to said scanning direction, said supply mechanism supplying said liquid along said scanning direction to a predetermined spatial area, which includes at least a space between said substrate on said substrate stage and said projection optical system, from at least one supply port selected from said plurality of supply ports in accordance with the size of a divided area subject to exposure on said substrate in said non-scanning direction.

86. The exposure apparatus of claim 85, said exposure apparatus further comprising:

at least one bubble recovery mechanism that recovers bubbles in the liquid in the upstream side of said liquid flowing along said scanning direction with respect to said projection optical system.

87. The exposure apparatus of claim 85 wherein

said supply mechanism supplies liquid from the rear side in a moving direction of said substrate.

88. The exposure apparatus of claim 85, said exposure apparatus further comprising:

an adjustment unit that adjusts exposure conditions based on at least one of actual measurement values and prediction values of temperature information on said liquid between said projection optical system and said substrate.

153. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 85.

89. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies liquid to a space between said projection optical system and said substrate on said substrate stage; and

at least one bubble recovery mechanism that recovers bubbles in the liquid in the upstream side of said liquid flow with respect to said projection optical system.

90. The exposure apparatus of claim 89 wherein

said bubble recovery mechanism exhausts bubbles with said liquid.

91. The exposure apparatus of claim 89 wherein

a plurality of said bubble recovery mechanisms are provided, and

said bubble recovery mechanism used for recovering bubbles is switched in accordance with a moving direction of said substrate.

92. The exposure apparatus of claim 89, said exposure apparatus further comprising:

an adjustment unit that adjusts exposure conditions based on at least one of actual measurement values and prediction values of temperature information on said liquid between said projection optical system and said substrate.

93. The exposure apparatus of claim 89 wherein

said supply mechanism makes a flow of said liquid along a moving direction of said substrate.

94. The exposure apparatus of claim 93 wherein

said supply mechanism supplies said liquid from the rear side in a moving direction of said substrate.

154. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 89.

95. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies liquid to a predetermined spatial area which includes a space between said projection optical system and said substrate on said substrate stage; and

an adjustment unit that adjusts exposure conditions based on temperature information on said liquid between said projection optical system and said substrate.

96. The exposure apparatus of claim 95, said exposure apparatus further comprising:

a drive system that drives said substrate stage in a predetermined scanning direction with respect to said energy beam to transfer said pattern onto said substrate in a scanning exposure method; and

at least two temperature sensors, at least each one of which is arranged on one side and the other side of said projection optical system in said scanning direction.

97. The exposure apparatus of claim 96, said exposure apparatus further comprising:

a prediction unit that predicts temperature change of said liquid occurring while said liquid passes through an area of said substrate where said energy beam is irradiated via said pattern and said projection optical system, based on detection results of said at least two temperature sensors arranged on the one side and the other side respectively.

98. The exposure apparatus of claim 95, said exposure apparatus further comprising:

a drive system that drives said substrate stage in a predetermined scanning direction with respect to said energy beam to transfer said pattern onto said substrate in a scanning exposure method, wherein

said adjustment unit adjusts exposure conditions taking into consideration temperature distribution of said liquid between said projection optical system and said substrate in a scanning direction.

99. The exposure apparatus of claim 98 wherein

said adjustment unit adjusts a positional relationship between an image plane and a surface of said substrate taking into consideration of image plane inclination caused by said temperature distribution in said scanning direction.

100. The exposure apparatus of claim 99 wherein

said adjustment unit inclines said substrate to make said substrate match said image plane inclination caused by said temperature distribution in said scanning direction and also scans said substrate in a direction of said inclination.

101. The exposure apparatus of claim 95 wherein

said supply mechanism makes a flow of said liquid along a moving direction of said substrate.

102. The exposure apparatus of claim 101 wherein

said supply mechanism supplies said liquid from the rear side in a moving direction of said substrate.

103. The exposure apparatus of claim 95 wherein

said temperature information includes at least one of actual measurement values and prediction values.

104. The exposure apparatus of claim 95, said exposure apparatus further comprising:

a temperature sensor that can detect the temperature of said liquid between said projection optical system and said substrate, wherein

said exposure conditions are adjusted based on detection results of said temperature sensor.

105. The exposure apparatus of claim 95 wherein

a focus control is performed to adjust a positional relationship between an image plane formed by said projection optical system and a surface of said substrate, based on said temperature information.

155. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 95.

106. An exposure apparatus that transfers a predetermined pattern on a substrate via a projection optical system in a state where a space between said projection optical system and said substrate is filled with liquid, wherein

in the case multiple exposure is performed, a first pattern is transferred onto a divided area on said substrate, and then a second pattern is also transferred on said divided area on said substrate while said liquid is being held between said projection optical system and said substrate.

156. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 106.

107. An exposure apparatus that exposes a substrate by projecting an image of a pattern on said substrate via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies liquid to a predetermined spatial area which includes a space between said projection optical system and said substrate on said substrate stage; and

an adjustment unit that adjusts exposure conditions based on pressure information on said liquid between said projection optical system and said substrate.

108. The exposure apparatus of claim 107 wherein

said substrate is exposed while being moved in a predetermined scanning direction,

said liquid supplied between said projection optical system and said substrate flows in parallel with said scanning direction, and

said adjustment unit adjusts said exposure conditions based on pressure distribution in said scanning direction.

109. The exposure apparatus of claim 107 wherein

said substrate is exposed while being moved in the same direction as a flow direction of said liquid.

110. The exposure apparatus of claim 107 wherein

said adjustment unit adjusts said exposure conditions based on adjustment information on exposure conditions corresponding to a scanning speed of the substrate.

111. The exposure apparatus of claim 107 wherein

said adjustment unit adjusts said exposure conditions based on adjustment information on exposure conditions corresponding to a supply amount of said liquid by said supply mechanism.

157. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 107.

112. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies liquid to a space between said projection optical system and said substrate on said substrate stage;

a recovery mechanism that recovers said liquid; and

a liquid removal mechanism that removes said liquid which could not be recovered by said recovery mechanism.

113. The exposure apparatus of claim 112 wherein

said liquid removal mechanism recovers liquid on said substrate.

114. The exposure apparatus of claim 112 wherein

said liquid is locally held between said projection optical system and said substrate, and

said substrate stage has a flat section which is substantially flush with a surface of said substrate in the periphery of said substrate held on said substrate stage.

115. The exposure apparatus of claim 114, said exposure apparatus further comprising:

an exhaust mechanism that exhausts gas on an image plane side of said projection optical system, wherein

said supply mechanism begins supplying said liquid in parallel with exhausting operation of said exhaust mechanism.

116. The exposure apparatus of claim 112, said exposure apparatus further comprising:

a control unit that controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid.

117. The exposure apparatus of claim 116 wherein

said control unit controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid to make an image plane formed by said projection optical system and a surface of said substrate substantially coincide with each other.

158. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 112.

118. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system and liquid while locally holding said liquid on an image plane side of said projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate;

a supply mechanism that supplies said liquid to an image plane side of said projection optical system;

a first recovery mechanism that recovers said liquid outside a projection area of said projection optical system; and

a second recovery mechanism that recovers said liquid outside said first recovery mechanism with respect to said projection area.

119. The exposure apparatus of claim 118 wherein

said substrate stage has a flat section which is substantially flush with a surface of said substrate in the periphery of said substrate held on said substrate stage.

120. The exposure apparatus of claim 118 wherein

a supply position of said supply mechanism is arranged between said projection area and a recovery position of said second recovery mechanism.

121. The exposure apparatus of claim 118, said exposure apparatus further comprising:

an exhaust mechanism that exhausts gas on an image plane side of said projection optical system, wherein

said supply mechanism begins supplying said liquid in parallel with exhausting operation of said exhaust mechanism.

122. The exposure apparatus of claim 118, said exposure apparatus further comprising:

a control unit that controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid.

123. The exposure apparatus of claim 122 wherein

said control unit controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid to make an image plane formed by said projection optical system and a surface of said substrate substantially coincide with each other.

124. The exposure apparatus of claim 118 wherein

said second recovery mechanism is arranged around said projection area.

159. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 118.

125. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system and liquid while locally holding said liquid on an image plane side of said projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate, wherein

said substrate stage has a flat section which is substantially flush with a surface of said substrate in the periphery of said substrate held on said substrate stage.

126. The exposure apparatus of claim 125 wherein

said flat section is made up of a plurality of members.

127. The exposure apparatus of claim 125 wherein

said substrate stage has a reference member on which reference marks are formed, and the upper surface of said reference member is substantially flush with said flat section.

128. The exposure apparatus of claim 125 wherein

said projection optical system and said flat section face each other to keep on holding said liquid on said image plane side of said projection optical-system when exposure operation for said substrate is suspended.

129. The exposure apparatus of claim 125, said exposure apparatus further comprising:

a recovery mechanism that recovers said liquid held on said image plane side of said projection optical system, wherein

said substrate stage is moved to a predetermined position after exposure has been completed for the substrate held on said substrate stage to make said projection optical system and said flat section face each other, and then at said position, liquid recovery by said recovery mechanism is performed and after said liquid has been recovered, said substrate for which exposure has been completed is unloaded from said substrate stage.

130. The exposure apparatus of claim 125, said exposure apparatus further comprising:

a supply mechanism that supplies liquid to an image plane side of said projection optical system; and

an exhaust mechanism that exhausts gas on an image plane side of said projection optical system, wherein

said supply mechanism begins supplying said liquid in parallel with exhausting operation of said exhaust mechanism.

131. The exposure apparatus of claim 125 wherein

said supply mechanism begins supplying said liquid in a state where said projection optical system and said flat section are facing each other.

132. The exposure apparatus of claim 125, said exposure apparatus further comprising:

a control unit that controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid.

133. The exposure apparatus of claim 132 wherein

said control unit controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid to make an image plane formed by said projection optical system and a surface of said substrate substantially coincide with each other.

160. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 125.

134. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system and liquid while locally holding said liquid on an image plane side of said projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate, wherein

said substrate stage has a flat section substantially flush with a surface of said substrate held on said substrate stage, and

when exposure operation on said substrate is suspended, said projection optical system and said flat section face each other to keep on holding said liquid on said image plane side of said projection optical system.

135. The exposure apparatus of claim 134 wherein

said liquid is held between said projection optical system and said flat section when a substrate is loaded onto said substrate stage.

136. The exposure apparatus of claim 134 wherein

said liquid is held between said projection optical system and said flat section when a substrate is unloaded from said substrate stage.

161. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 134.

137. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system and liquid while locally holding said liquid on an image plane side of said projection optical system, said exposure apparatus comprising:

a substrate stage on which said substrate is mounted that moves within a two-dimensional plane holding said substrate, wherein

said substrate stage has a flat section substantially flush with a surface of said substrate held on said substrate stage, and

after exposure of said substrate held on said substrate stage has been completed, said substrate stage is moved to a predetermined position where said liquid on an image plane side of said projection optical system is recovered, and

said substrate on which exposure has been completed is unloaded from said substrate stage, after recovery of said liquid has been completed.

138. The exposure apparatus of claim 137 wherein

said projection optical system and said flat section face each other at said predetermined position.

162. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 137.

139. An exposure apparatus that illuminates a pattern with an energy beam and transfers said pattern onto a substrate via a projection optical system and liquid while locally holding said liquid on an image plane side of said projection optical system, said exposure apparatus comprising:

a supply mechanism that supplies said liquid to an image plane side of said projection optical system; and

an exhaust mechanism that exhausts gas on an image plane side of said projection optical system, wherein

said supply mechanism begins supplying said liquid in parallel with exhausting operation of said exhaust mechanism.

140. The exposure apparatus of claim 139, said exposure apparatus further comprising:

a control unit that controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid.

141. The exposure apparatus of claim 140 wherein

said control unit controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid to make an image plane formed by said projection optical system and a surface of said substrate substantially coincide with each other.

163. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 139.

142. An exposure apparatus that irradiates an energy beam on a substrate via a projection optical system and liquid and exposes said substrate, said exposure apparatus comprising:

a substrate stage that is movable within a two-dimensional plane holding said substrate; and

a control unit that controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid.

143. The exposure apparatus of claim 142 wherein

said control unit controls movement of said substrate stage based on at least one of temperature information of said liquid and pressure information of said liquid to make an image plane formed by said projection optical system and a surface of said substrate substantially coincide with each other.

164. A device manufacturing method including a lithographic process, wherein

in said lithographic process, a device pattern is transferred onto a substrate using an exposure apparatus in claim 142.

165. A method of irradiating a layer including:

directing and focusing a radiation beam to a spot on said layer by means of at least one optical element;

causing relative movement of the layer relative to said at least one optical element so that, successively, different portions of the layer are irradiated and an interspace between a surface of said at least one optical element nearest to said layer is maintained;

maintaining at least a portion of said interspace through which said radiation irradiates said spot on said layer filled with a liquid supplied via a supply conduit;

directing gas to said layer; and

removing supplied liquid from said layer in the vicinity of a flow of said gas.

166. A method according to claim 165, wherein said gas is supplied to cause a gas flow.

167. A method according to claim 165, wherein the flow of said gas is entered into an interspace between said layer and a boundary surface having a width.

168. A method according to claim 167, wherein the liquid forms a film on said layer having a thickness.

169. A method according to claim 165, wherein liquid and gas are drawn away from said layer.

170. A method according to claim 165, wherein said gas is air.

171. A device for directing radiation to a layer including:

at least one optical element for focusing a beam of radiation originating from a radiation source to a spot on said layer;

a displacement structure for causing relative movement of the layer relative to said at least one optical element so that, successively, different portions of the layer are irradiated and an interspace between said layer and a surface of said at least one optical element nearest to said spot is maintained;

an outflow opening for supplying liquid to at least a portion of said interspace through which, in operation, said radiation irradiates said spot on said layer;

a gas outflow opening for directing a gas flow to said layer; and

a discharge channel having an inlet in the vicinity of said gas outflow opening for drawing away liquid from the layer.

172. A device according to claim 171, wherein said discharge channel communicates with a vacuum source.

173. A device according to claim 171, wherein said inlet of said discharge-channel extends about said interspace.

174. A device according to claim 171, wherein said gas flow openings are arranged about said interspace.

175. A method of irradiating a layer including:

directing and focusing a radiation beam to a spot on said layer by means of at least one optical element;

causing relative movement of the layer relative to said at least one optical element so that, successively, different portions of the layer are irradiated and an interspace between a surface of said at least one optical element nearest to said layer is maintained; and

maintaining at least a portion of said interspace through which said radiation irradiates said spot on said layer filled with a liquid, the liquid being supplied via a supply conduit and flowing out of an outflow opening;

characterized in that at least one outflow opening via which the liquid flows out is provided in the form of at least one canal open towards said layer, said canal distributing supplied liquid longitudinally along said canal and dispensing distributed liquid towards said layer.

176. A method according to claim 175, wherein the canal or canals are positioned such that, seen in a direction perpendicular to said layer, the canals define a total cross-sectional area having a center in said portion of said interspace through which the radiation irradiates the spot.

177. A method according to claim 175, wherein a thickness of said interspace is maintained at 3 mm and under.

178. A method according to claim 175, wherein at least a portion of said liquid fills up a recess through which said radiation irradiates said spot.

179. A method according to claim 178, wherein the recess has a rim portion closest to said layer extending around said radiation irradiating said spot.

180. A method according to claim 178, wherein said recess includes a portion of said surface of said at least one optical element nearest to said layer.

181. A device for directing radiation to a layer including:

at least one optical element for focusing a beam of radiation originating from a radiation source to a spot on said layer;

a displacement structure for causing relative movement of the layer relative to said at least one optical element so that, successively, different portions of the layer are irradiated and an interspace between said layer and a surface of said at least one optical element nearest to said spot is maintained; and

an outflow opening for supplying liquid to at least a portion of said interspace through which, in operation, said radiation irradiates said spot on said layer, said outflow opening having a total projected cross-sectional passage area in a plane perpendicular to an axis of said radiation beam;

characterized in that the at least one outflow opening is formed by at least one canal open towards said layer, for distributing supplied liquid longitudinally along said canal and dispensing distributed liquid towards said layer.

182. A device according to claim 181, wherein the outflow opening or a plurality of the outflow openings are positioned such that, seen in a direction parallel to said axis of said radiation beam, said total cross-sectional area has a center in said portion of said gap through which the radiation irradiates the spot.

183. A device according to claim 181, wherein said displacement structure and said recess are positioned and dimensioned for maintaining a thickness of said interspace at 3 mm and under.

184. A device according to claim 181, wherein a recess is provided in a surface facing said spot, an internal surface of said recess bounding at least said portion of said interspace through which said radiation irradiates said spot.

185. A device according to claim 184, wherein said recess has a rim portion closest to said layer extending around said portion of said interspace through which, in operation, said radiation irradiates said spot.

186. A device according to claim 184, wherein said recess includes a portion of said surface of said at least one optical element nearest to said spot.

187. A method of irradiating a layer including:

directing and focusing a radiation beam to a spot on said layer by means of at least one optical element;

causing relative movement of the layer relative to said at least one optical element so that, successively, different portions of the layer are irradiated and an interspace between a surface of said at least one optical element nearest to said layer is maintained; and

maintaining at least a portion of said interspace through which said radiation irradiates said spot on said layer filled with a liquid, the liquid being supplied via a supply conduit;

characterized in that at least a portion of said liquid fills up a recess through which said radiation irradiates said spot.

188. A method according to claim 187, wherein the recess has a rim portion closest to said layer extending around said radiation irradiating said spot.

189. A method according to claim 187, wherein said recess is bounded by a passage in a wall between said layer and a surface of said at least one optical element nearest to said layer and by said at least one optical element nearest to said layer.

190. A method according to claim 189, wherein a liquid outflow via said passage is maintained.

191. A method according to claim 187, wherein a thickness of said interspace is maintained at 3 mm and under.

192. A method according to claim 187, wherein said recess includes a portion of said surface of said at least one optical element nearest to said layer.

193. A method according to claim 187, wherein the liquid flows out from at least one outflow opening in the form of at least one canal open towards said layer, said canal distributing supplied liquid longitudinally along said canal and dispensing distributed liquid towards said layer.

194. A method a according to claim 187, wherein said interspace between said layer and said surface of said at least one optical element nearest to said layer has a thickness, the layer and the at least one optical element are moved relative to each other at a velocity, the liquid is supplied via an outflow opening having a width in a plane parallel to said layer.

195. A device for directing radiation to a layer including:

at least one optical element for focusing radiation originating from a radiation source to a spot on said layer;

a displacement structure for causing relative movement of the layer relative to said at least one optical element so that, successively, different portions of the layer are irradiated and an interspace between said layer and a surface of said at least one optical element nearest to said spot is maintained; and

an outflow opening for supplying liquid to at least a portion of said interspace through which, in operation, said radiation irradiates said spot on said layer;

characterized by a recess in a surface facing said spot, an internal surface of said recess bounding at least said portion of said interspace through which said radiation irradiates said spot.

196. A device according to claim 195, wherein said recess has a rim portion closest to said layer extending around said portion of said interspace through which, in operation, said radiation irradiates said spot.

197. A device according to claim 195, wherein said recess is bounded by a passage in a wall between said spot and a surface of said at least one optical element nearest to said spot and by said surface of said at least one optical element nearest to said spot.

198. A device according to claim 197, further including a liquid supply structure communicating with said passage for maintaining a liquid outflow via said passage.

199. A device according to claim 195, arranged for maintaining a thickness of said interspace at 3 mm and under.

200. A device according to claim 195, wherein said recess includes a portion of said surface of said at least one optical element nearest to said spot.

201. A device according to claim 195, wherein the at least one outflow opening is formed by at least one canal open towards said layer, for distributing supplied liquid longitudinally along said canal and dispensing distributed liquid towards said layer.

202. A lithographic projection apparatus comprising:

a support structure configured to hold a patterning device, the patterning device configured to pattern a beam of radiation according to a desired pattern;

a projection system configured to project the patterned beam onto a target portion of a substrate;

a substrate table configured to hold the substrate, said substrate table comprising an edge seal member configured to at least partly surround an edge of an object positioned on said substrate table and to provide a primary surface facing said projection system substantially co-planar with a primary surface of said object; and

a liquid supply system configured to provide a liquid, through which said beam is to be projected, in a space between said projection system and said object, wherein

said liquid supply system provides liquid to a localized area of at least one of said object, said edge seal member and said substrate.

203. A lithographic projection apparatus according to claim 202, wherein

the object has a reference.

204. A lithographic projection apparatus according to claim 202, wherein

the object is used for alignment of the patterning device.

205. A lithographic projection apparatus according to claim 202, wherein

said primary surface of the edge seal member is substantially co-planar with a primary surface of the substrate and the primary surface of the object.