Method of manufacturing circuit layout on touch panel by utilizing metal plating technology

• US 20050260338A1
• Filed: 05/19/2004
• Published: 11/24/2005
• Est. Priority Date: 05/19/2004
• Status: Abandoned Application

• Current Assignee: TPK Touch Solutions (Xiamen) Inc. (TPK Holding Co., Ltd.)
• Original Assignee: Trendon Touch Technology Corporation
• Inventors: Chien, Shun-Ta
• Application Number:
  US10/847,871
• Publication Number:
  US 20050260338A1
• Time in Patent Office: Days
• US Class Current: 427/96.100
• CPC Class Codes: C03C 17/36 at least one coating being a metal
• CPC Class Codes: C03C 17/3644 the metal being silver
• CPC Class Codes: C03C 17/3671 specially adapted for use as electrodes
• CPC Class Codes: C03C 2218/154 by sputtering
• CPC Class Codes: C03C 2218/33 by etching
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/0326 Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• CPC Class Codes: H05K 2203/1461 Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern
• CPC Class Codes: H05K 3/16 by cathodic sputtering

Abstract

The present invention is to provide a method of manufacturing a circuit layout on a touch panel by utilizing metal plating technology, comprising uniformly coating a conductive metal or conductive oxidized metal on predetermined areas proximate edges of a transparent conductive layer on a transparent glass substrate for forming a circuit by utilizing metal plating technology, which has the advantages of uniform thickness of circuit, higher hardness, better adhesion of the plated material to the underlying substrate, whether it is a resistive film or bare glass, improved weathering and chemical properties, and solderability.

Claims

1. A method of manufacturing a circuit layout on a touchscreen by utilizing metal plating technology, comprising uniformly coating a conductive metal or conductive oxidized metal on predetermined areas proximate edges of a transparent resistive layer on a transparent glass substrate for forming a first circuit by utilizing metal plating technology.

2. The method of claim 1, further comprising forming a second circuit on areas of the glass substrate not coated with the transparent conductive layer by utilizing metal plating technology, wherein the second circuit is electrically coupled to the first circuit of claim 1.

3. The method of claim 1, further comprising forming a third circuit on areas of the glass substrate not coated with the transparent conductive layer by utilizing screen printing technology, wherein the third circuit is electrically coupled to the second circuit.

4. The method of claim 1, wherein the transparent resistive layer is made of ITO.

5. The method of claim 1, wherein the metal plating technology is sputtering.

6. The method of claim 5, wherein the conductive metal is formed by ionization by impinging a conductive metal contained in a target by sputtering.

7. The method of claim 6, wherein the target is made of silver.